Patents by Inventor Tokiyuki Seto

Tokiyuki Seto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5431324
    Abstract: An ultrasonic bonding apparatus comprises an ultrasonic wave controller, a bonding system including a bonding head, a laser oscillator, a laser optics, a vibration monitoring system including a vibrometer, and a mechanism for feeding a result of monitoring back to a bonding condition.
    Type: Grant
    Filed: January 22, 1993
    Date of Patent: July 11, 1995
    Assignee: Hitachi, Ltd.
    Inventors: Ryoichi Kajiwara, Mituo Katou, Kazuya Takahashi, Minoru Maruta, Tokiyuki Seto, Kunihiro Tsubosaki
  • Patent number: 5323952
    Abstract: A bonding apparatus comprising a bonding tool, means for driving the bonding tool, means for detecting an amount of crushing of a bonding portion during bonding, means for calculating a rate of change of the amount of crushing detected by the amount-of-crushing detecting means, means for setting a target value, which is inputted from an external source, of the amount of crushing of the bonding portion, and means for controlling the driving means. When the rate of change of the amount of crushing calculated by the calculating means is smaller than a predetermined value, the controlling means compares the amount of crushing detected by the amount-of-crushing detecting means with the target value. When the amount of crushing detected by the amount-of-crushing detecting means is smaller than the target value, the controlling means discriminates that the bonding is being performed in a satisfactory manner and hence should be continued.
    Type: Grant
    Filed: September 18, 1992
    Date of Patent: June 28, 1994
    Assignee: Hitachi, Ltd.
    Inventors: Mituo Kato, Ryoichi Kajiwara, Kazuya Takahashi, Setuo Sekine, Tokiyuki Seto
  • Patent number: 4796132
    Abstract: Conductor film terminals of a thin film magnetic head are composed of an Au film while lead terminals of a flexible printed circuit board are covered with an Au layer, so that both of these terminals can be bonded by low temperature ultrasonic bonding directly between Au and Au. The reverse surface of the lead terminals of the flexible printed circuit board is bonded and fixed to a flexible polymer resin cover film so that the dimensional accuracy of the bonded terminal portion can be improved.
    Type: Grant
    Filed: October 22, 1987
    Date of Patent: January 3, 1989
    Assignee: Hitachi, Ltd.
    Inventors: Yoshinori Dekura, Kazuhiro Momata, Tokiyuki Seto