Patents by Inventor Tom K. Cho

Tom K. Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8203126
    Abstract: Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other.
    Type: Grant
    Filed: July 22, 2010
    Date of Patent: June 19, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Juan Carlos Rocha-Alvarez, Thomas Nowak, Dale R. Du Bois, Sanjeev Baluja, Scott A. Hendrickson, Dustin W. Ho, Andrzei Kaszuba, Tom K. Cho
  • Publication number: 20110164955
    Abstract: Embodiments of a method and apparatus for processing large area substrates including a translational wear plate and/or bushing assembly are provided for reducing the stress on a lift pin used to space substrates from a substrate support in a processing or other type of chamber. In another embodiment, an apparatus for processing substrates includes processing chamber comprising a substrate support disposed in a chamber body. A bushing assembly is disposed in the substrate support. A lift pin is disposed through the bushing assembly. A wear plate is provided that is coupled to the chamber body and aligned with the lift pin. The wear plate is movable laterally relative to a centerline of the chamber body to accommodate lateral motion of the lift pin when contacting the wear plate.
    Type: Application
    Filed: July 13, 2010
    Publication date: July 7, 2011
    Applicant: APPLIED MATERIALS,INC.
    Inventors: John M. White, Jeonghoon Oh, Tom K. Cho, Silja James, Uday Pai, Oscar Lopez, Alexander S. Polyak
  • Publication number: 20110033620
    Abstract: A method and apparatus for a lift pin is described. In one embodiment, a lift pin head is described. The lift pin head includes a base member having a body made of a first material having a first coefficient of thermal expansion, and a tip disposed on the base member, the base member having a body made of a second material that is flexible at room temperature and having a second coefficient of thermal expansion, the first coefficient of thermal expansion being less than the second coefficient of thermal expansion.
    Type: Application
    Filed: August 2, 2010
    Publication date: February 10, 2011
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Alexander S. Polyak, Tom K. Cho, Oscar Gomez
  • Publication number: 20100285240
    Abstract: Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other.
    Type: Application
    Filed: July 22, 2010
    Publication date: November 11, 2010
    Applicant: Applied Materials, Inc
    Inventors: Juan Carlos Rocha-Alvarez, Thomas Nowak, Dale R. Du Bois, Sanjeev Baluja, Scott A. Hendrickson, Dustin W. Ho, Andrzei Kaszuba, Tom K. Cho
  • Patent number: 7829145
    Abstract: Apparatus and methods for distributing gases into a processing chamber are disclosed. In one embodiment, the method for processing a substrate includes delivering a processing gas into a chemical vapor deposition chamber through a first gas pathway that includes flow through a first plurality of apertures in a blocker plate, the blocker plate creating a pressure drop of at least approximately 0.8 torr thereacross, reacting the processing gas to deposit a material on a substrate surface, removing the substrate from the chamber, delivering a cleaning gas into the chamber through a second gas pathway around the blocker plate bypassing the blocker plate and through a second plurality of apertures formed in the blocker plate, and reacting the cleaning gases with deposits within the chamber to etch the deposits from the chamber.
    Type: Grant
    Filed: October 22, 2008
    Date of Patent: November 9, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Ganesh Balasubramanian, Juan Carlos Rocha-Alvarez, Tom K. Cho, Daemian Raj
  • Patent number: 7777198
    Abstract: Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other.
    Type: Grant
    Filed: March 15, 2007
    Date of Patent: August 17, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Juan Carlos Rocha-Alvarez, Thomas Nowak, Dale R. Du Bois, Sanjeev Baluja, Scott A. Hendrickson, Dustin W. Ho, Andrzei Kaszuba, Tom K. Cho
  • Publication number: 20100178137
    Abstract: Systems, methods and apparatus are provided for moving substrates in electronic device manufacturing. In some aspects, end effectors having a base portion and at least three pads are provided. Each of the pads has a contact surface, and at least one of the contact surfaces has a curved shape. A substrate supported by the end effector may be moved at a relatively high lateral g-force without significant slipping relative to the pads. Additional aspects are provided.
    Type: Application
    Filed: January 8, 2010
    Publication date: July 15, 2010
    Applicant: Applied Materials, Inc.
    Inventors: Prudhvi R. Chintalapati, Satish Sundar, Boris Axelrod, Mario Dave Silvetti, Tom K. Cho, Jeffrey A. Brodine, Jason K. Foster, Edward Ng
  • Publication number: 20100151127
    Abstract: Embodiments of the present invention generally provide apparatus and methods for preventing contamination within a processing system due to substrate breakage. In one embodiment, an acoustic detection mechanism is disposed on or within a process chamber to monitor conditions within the process chamber. In one embodiment, the acoustic detection mechanism detects conditions indicative of substrate breakage within the process chamber. In one embodiment, the acoustic detection mechanism detects conditions that are known to lead to substrate breakage within the process chamber. In one embodiment, the acoustic detection mechanism is combined with an optical detection mechanism. By early detection of substrate breakage or conditions known to lead to substrate breakage, the process chamber may be taken off line and repaired prior to contamination of the entire process system.
    Type: Application
    Filed: November 30, 2009
    Publication date: June 17, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Tom K. Cho, Lun Tsuei, Kuan-Yuan Peng, Kyle S. Reinke, Brian Sy-Yuan Shieh
  • Publication number: 20100136216
    Abstract: Embodiments of the present invention generally provide apparatus and methods for altering the flow and pressure differential of process gases supplied across a showerhead of a processing chamber to provide improved deposition uniformity across the surface of a substrate disposed therein. In one embodiment, a blocker plate is disposed between a backing plate and a showerhead. In one embodiment, the distance between the blocker plate and the showerhead is adjustable. In another embodiment, the blocker plate has a non-planar surface contour. In another embodiment, a regional blocker plate is disposed between a backing plate and a showerhead. In another embodiment, a central blocker plate and a peripheral blocker plate are disposed between a backing plate and a showerhead.
    Type: Application
    Filed: November 30, 2009
    Publication date: June 3, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Lun Tsuei, Alan Tso, Tom K. Cho, Brian Sy-Yuan Shieh
  • Publication number: 20100112212
    Abstract: Embodiments of the present invention generally provide apparatus and methods for altering the contour of a gas distribution plate within a process chamber without breaking vacuum conditions within the chamber. In one embodiment, a central support device adjusted to vary the height of a central region of a gas distribution plate with respect to the periphery of the gas distribution plate. In another embodiment, a plurality of central support devices is adjusted to vary the height of a central region of a gas distribution plate with respect to the periphery of the plate. In yet another embodiment, a plurality of central support devices and a plurality of mid-range support devices are adjusted to vary the height of certain regions of the gas distribution plate with respect to other regions of the gas distribution plate. In one embodiment, the contour of the gas distribution plate is altered based on changes detected within the process chamber.
    Type: Application
    Filed: October 23, 2009
    Publication date: May 6, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Lin Zhang, Lun Tsuei, Alan Tso, Tom K. Cho, Brian Sy-Yuan Shieh
  • Publication number: 20100104754
    Abstract: Embodiments of the present invention generally provide apparatus and methods for introducing process gases into a processing chamber at a plurality of locations. In one embodiment, a central region of a showerhead and corner regions of a showerhead are fed process gases from a central gas source with a first mass flow controller regulating the flow in the central region and a second mass flow controller regulating the flow in the corner regions. In another embodiment, a central region of a showerhead is fed process gases from a first gas source and corner regions of the showerhead are fed process gases from a second gas source. In another embodiment, a central region of a showerhead is fed process gases from a first gas source and each corner region of the showerhead is fed process gases from a separate gas source.
    Type: Application
    Filed: October 20, 2009
    Publication date: April 29, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: ALAN TSO, Lun Tsuei, Tom K. Cho, Brian Sy-Yuan Shieh
  • Patent number: 7692171
    Abstract: Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other.
    Type: Grant
    Filed: March 15, 2007
    Date of Patent: April 6, 2010
    Inventors: Andrzei Kaszuba, Juan Carlos Rocha-Alvarez, Sanjeev Baluja, Tom K. Cho, Hichem M'Saad, Scott A. Hendrickson, Dustin W. Ho, Thomas Nowak
  • Publication number: 20100037823
    Abstract: The present invention generally relates to a gas distribution showerhead and a shadow frame for an apparatus. By extending the corners of the gas distribution showerhead the electrode area may be expanded relative to the anode and thus, uniform film properties may be obtained. Additionally, the expanded corners of the gas distribution showerhead may have gas passages extending therethrough. In one embodiment, hollow cathode cavities may be present on the bottom surface of the showerhead without permitting gas to pass therethrough. The shadow frame in the apparatus may also have its corner areas extended out to enlarge the anode in the corner areas of the substrate being processed and thus, may lead to deposition of a material on the substrate having substantially uniform properties.
    Type: Application
    Filed: August 7, 2009
    Publication date: February 18, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: TOM K. CHO, Zheng Yuan, Brian Sy-Yuan Shieh
  • Publication number: 20100021273
    Abstract: The present invention embodies processing systems and vacuum chambers equipped to process substrates for flat panel displays, solar cells, or other electronic devices. The processing system and/or the vacuum chambers as well as their components and supporting structure are constructed of less costly materials and in a more energy efficient manner than that of current large area substrate processing systems. In one embodiment, the processing system chamber bodies and their supporting structures are constructed of reinforced concrete. In one embodiment, system processing chambers include a vacuum tight lining disposed inside reinforced concrete chamber bodies.
    Type: Application
    Filed: July 21, 2009
    Publication date: January 28, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: ALEXANDER S. POLYAK, TOM K. CHO, JOSEPH YUDOVSKY, ANTHONY VESCI
  • Patent number: 7622005
    Abstract: Apparatus and methods for distributing gases into a processing chamber are disclosed. In one embodiment, the apparatus includes a gas distribution plate having a plurality of apertures disposed therethrough and a blocker plate having both a plurality of apertures disposed therethrough and a plurality of feed through passageways disposed therein. A first gas pathway delivers a first gas through the plurality of apertures in the blocker plate with sufficient pressure drop to more evenly distribute the gases prior to passing through the gas distribution plate. A bypass gas pathway delivers a second gas through the plurality of feed through passageways in the blocker plate and to areas around the blocker plate prior to the second gas passing through the gas distribution plate.
    Type: Grant
    Filed: May 16, 2005
    Date of Patent: November 24, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Ganesh Balasubramanian, Juan Carlos Rocha-Alvarez, Tom K. Cho, Daemian Raj
  • Patent number: 7582167
    Abstract: In one embodiment, the invention is a guard ring for reducing particle entrapment along a moveable shaft of a substrate support. In one embodiment, the guard ring comprises a substantially annular guard ring positioned within a step formed in a sleeve that circumscribes the shaft. The guard ring is positioned to substantially seal a gap separating the shaft from the sleeve, so that the amount of particles and foreign matter that travel within or become trapped in the gap is substantially reduced. In another embodiment, a guard ring comprises a base portion having an inner perimeter and an outer perimeter, a first flange coupled to the inner perimeter, a second flange coupled to the outer perimeter, and a continuous channel separating the first flange from the second flange. The first flange is adapted to function as a spring that accommodates displacement of the shaft.
    Type: Grant
    Filed: October 3, 2007
    Date of Patent: September 1, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Andrzej Kaszuba, Sophia M. Velastegui, Visweswaren Sivaramakrishnan, Pyongwon Yim, Mario David Silvetti, Tom K. Cho, Indrajit Lahiri, Surinder S. Bedi
  • Patent number: 7572337
    Abstract: Apparatus and methods for distributing gases into a processing chamber are disclosed. In one embodiment, the apparatus includes a gas distribution plate having a plurality of apertures disposed therethrough and a blocker plate having both a plurality of apertures disposed therethrough and a plurality of feed through passageways disposed therein. A first gas pathway delivers a first gas through the plurality of apertures in the blocker plate and the gas distribution plate. A bypass gas pathway delivers a second gas through the plurality of feed through passageways in the blocker plate and to areas around the blocker plate prior to the second gas passing through the gas distribution plate.
    Type: Grant
    Filed: May 16, 2005
    Date of Patent: August 11, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Juan Carlos Rocha-Alvarez, Ganesh Balasubramanian, Tom K. Cho, Deenesh Padhi, Thomas Nowak, Bok Hoen Kim, Hichem M'Saad, Daemian Raj
  • Patent number: 7566891
    Abstract: Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other.
    Type: Grant
    Filed: March 15, 2007
    Date of Patent: July 28, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Juan Carlos Rocha-Alvarez, Thomas Nowak, Dale R. Du Bois, Sanjeev Baluja, Scott A. Hendrickson, Dustin W. Ho, Andrzei Kaszuba, Tom K. Cho
  • Patent number: 7498268
    Abstract: The present invention is directed to improving defect performance in semiconductor processing systems. In specific embodiments, an apparatus for processing semiconductor substrates comprises a chamber defining a processing region therein, and a substrate support disposed in the chamber to support a semiconductor substrate. At least one nozzle extends into the chamber to introduce a process gas into the chamber through a nozzle opening. The apparatus comprises at least one heat shield, each of which is disposed around at least a portion of one of the at least one nozzle. The heat shield has an extension which projects distally of the nozzle opening of the nozzle and which includes a heat shield opening for the process gas to flow therethrough from the nozzle opening. The heat shield decreases the temperature of nozzle in the processing chamber for introducing process gases therein to reduce particles.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: March 3, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Sudhir Gondhalekar, Padmanabhan Krishnaraj, Tom K. Cho, Muhammad Rasheed, Hemant Mungekar, Thanh N. Pham, Zhong Qiang Hua
  • Publication number: 20090047446
    Abstract: Apparatus and methods for distributing gases into a processing chamber are disclosed. In one embodiment, the apparatus includes a gas distribution plate having a plurality of apertures disposed therethrough and a blocker plate having both a plurality of apertures disposed therethrough and a plurality of feed through passageways disposed therein. A first gas pathway delivers a first gas through the plurality of apertures in the blocker plate with sufficient pressure drop to more evenly distribute the gases prior to passing through the gas distribution plate. A bypass gas pathway delivers a second gas through the plurality of feed through passageways in the blocker plate and to areas around the blocker plate prior to the second gas passing through the gas distribution plate.
    Type: Application
    Filed: October 22, 2008
    Publication date: February 19, 2009
    Inventors: Ganesh Balasubramanian, Juan Carlos Rocha-Alvarez, Tom K. Cho, Daemian Raj