Abstract: An information processing device includes a control unit. The control unit a control unit that acquires traveling information and location information of a vehicle acquired based on past traveling of at least one vehicle for one occupant of the vehicle, the vehicle included in the at least one vehicle, generates preference information of the one occupant based on the traveling information and the location information that are acquired, and determines destination information based on the preference information of the occupant when the control unit determines that an occupant who is on board the vehicle is the one occupant who has boarded the vehicle in the past and the preference information is generated for the occupant.

Abstract: An information processing apparatus includes a control unit. The control unit is configured to acquire traveling information of one vehicle and appearance information of an occupant of the one vehicle, which are obtained in association with driving of the one vehicle to a lodging facility, estimate biological information of the occupants of the vehicle by comparing the acquired traveling information and the acquired appearance information with traveling information and appearance information previously obtained in association with driving of other vehicles, and determine first information associated with a service provided at the lodging facility. The service is matched with the estimated biological information.

Abstract: An information processing device that provides a travel route to a destination to an occupant of a vehicle includes a controller. The controller is configured to acquire travel information obtained by another vehicle that travels on a candidate route to the destination set by the occupant from a second point in time prior to a first point in time when the destination is set to the first point in time in relation to traveling of the other vehicle, and to decide the travel route optimal for driving of the vehicle to the destination based on the acquired travel information.

Abstract: A semiconductor module structure includes: a semiconductor element portion including a plurality of capacitor elements; two bus bars sandwiching the semiconductor element portion and being electrically connected to the semiconductor element portion; and cooling fins, which are conductive, formed on respective surfaces of the bus bars at positions sandwiching the semiconductor element portion. Further, insulating refrigerant is provided in the cooling fins.

Abstract: A semiconductor device may include a stack in which a cooler and a semiconductor module are stacked, the semiconductor module housing a semiconductor element; a contact plate contacting the stack in a stacking direction of the semiconductor module and the cooler; and a spring contacting the contact plate and pressurizing the stack via the contact plate in the stacking direction, wherein the spring may contact a center portion of the contact plate in a direction perpendicular to the stacking direction, and a recess or a cavity may be provided at the center portion of the contact plate, the recess facing the stack.

Abstract: In a method for predicting deterioration of grease, the grease is applied between a semiconductor module and a cooler. The semiconductor module accommodates a semiconductor element. The method for predicting deterioration includes predicting deterioration of the grease after specified heat cycles by using: a variable G1/G2 that is acquired by dividing an initial storage modulus G1 of the grease by an initial loss modulus G2 of the grease at an expected maximum use temperature of the semiconductor element; and distortion dD of the grease at the time when the initial storage modulus G1 and the initial loss modulus G2 have the same value.

Abstract: A semiconductor device may include a stack in which a cooler and a semiconductor module are stacked, the semiconductor module housing a semiconductor element; a contact plate contacting the stack in a stacking direction of the semiconductor module and the cooler; and a spring contacting the contact plate and pressurizing the stack via the contact plate in the stacking direction, wherein the spring may contact a center portion of the contact plate in a direction perpendicular to the stacking direction, and a recess or a cavity may be provided at the center portion of the contact plate, the recess facing the stack.

Abstract: A semiconductor device includes a semiconductor module. The semiconductor module includes a package made of resin. The package contains a semiconductor element and a heat sink. The heat sink has a thermal conductive surface exposed on a part of one surface of the package. The semiconductor device includes an insulating plate, which is a part of a cooler, facing the thermal conductive surface of the heat sink and a resin surface around the thermal conductive surface, and pressed against the semiconductor module. At least a part of the thermal conductive surface comprises a recessed region recessed with respect to the resin surface. A solid heat transfer layer is interposed between the recessed region of the thermal conductive surface and the insulating plate, and is not interposed between the resin surface and the insulating plate.

Abstract: A semiconductor device includes a semiconductor module. The semiconductor module includes a package made of resin. The package contains a semiconductor element and a heat sink. The heat sink has a thermal conductive surface exposed on a part of one surface of the package. The semiconductor device includes an insulating plate, which is a part of a cooler, facing the thermal conductive surface of the heat sink and a resin surface around the thermal conductive surface, and pressed against the semiconductor module. At least a part of the thermal conductive surface comprises a recessed region recessed with respect to the resin surface. A solid heat transfer layer is interposed between the recessed region of the thermal conductive surface and the insulating plate, and is not interposed between the resin surface and the insulating plate.