Abstract: The present invention is a laminate including a base sheet and a metal particle-containing layer laminated on the base sheet, and including metal particles. The base sheet has a contact surface in contact with the metal particle-containing layer, and a Young's modulus of the base sheet at 23° C., which is obtained by measuring the contact surface using a nano-indentation method, is 0.01 to 10 GPa.

Abstract: To provide a sheet for sintering bonding and the same with a base material suited for lamination and integration and also suited for realizing satisfactory operational efficiency in a sintering process in a process of producing semiconductor devices that go through sintering bonding of semiconductor chips. A sheet for sintering bonding 10 of the present invention comprises an electrically conductive metal containing sinterable particle and a binder component. In this sheet, the minimum load, reached during an unloading process in load-displacement measurement according to a nanoindentation method, is ?100 to ?30 ?N. Alternatively, the ratio of the minimum load to a maximum load, reached during a load applying process in the above measurement, is ?0.2 to ?0.06. A sheet body X, a sheet for sintering bonding with a base material of the present invention, has a laminated structure comprising a base material B and the sheet 10.

Abstract: Provided in the present invention is a thermosetting sheet including a thermosetting resin, a thermoplastic resin, a volatile component, and conductive particles. The thermosetting sheet has an arithmetic average roughness Ra of 0.1 ?m or more and 1.2 ?m or less that is measured in a state before being cured.

Abstract: To provide a wound body of a sheet for sintering bonding with a base material that realizes a satisfactory operational efficiency in a process of producing a semiconductor device comprising sintering bonding portions of semiconductor chips and that also has both a satisfactory storage stability and a high storage efficiency. A wound body 1 according to the present invention has a form in which a sheet for sintering bonding with a base material X is wound around a winding core 2 into a roll shape, the sheet for sintering bonding with a base material X having a laminated structure comprising: a base material 11; and a sheet for sintering bonding 10, comprising an electrically conductive metal containing sinterable particle and a binder component.

Abstract: A manufacturing method includes the step of forming a diced semiconductor wafer (10) including semiconductor chips (11) from a semiconductor wafer (W) typically on a dicing tape (T1). The diced semiconductor wafer (10) on the dicing tape (T1) is laminated with a sinter-bonding sheet (20). The semiconductor chips (11) each with a sinter-bonding material layer (21) derived from the sinter-bonding sheet (20) are picked up typically from the dicing tape (T1). The semiconductor chips (11) each with the sinter-bonding material layer are temporarily secured through the sinter-bonding material layer (21) to a substrate. Through a heating process, sintered layers are formed from the sinter-bonding material layers (21) lying between the temporarily secured semiconductor chips (11) and the substrate, to bond the semiconductor chips (11) to the substrate.

Abstract: A semiconductor device manufacturing method includes a preparation step and a sinter bonding step. In the preparation step, a sinter-bonding work having a multilayer structure including a substrate, semiconductor chips, and sinter-bonding material layers is prepared. The semiconductor chips are disposed on, and will bond to, one side of the substrate. Each sinter-bonding material layer contains sinterable particles and is disposed between each semiconductor chip and the substrate. In the sinter bonding step, a cushioning sheet having a thickness of 5 to 5000 ?m and a tensile elastic modulus of 2 to 150 MPa is placed on the sinter-bonding work, the resulting stack is held between a pair of pressing faces, and, in this state, the sinter-bonding work between the pressing faces undergoes a heating process while being pressurized in its lamination direction, to form a sintered layer from each sinter-bonding material layer.

Abstract: A thermosetting sheet according to the present invention includes a thermosetting resin and a thermoplastic resin, in which a thickness change rate when a temperature is changed from 25° C. to 200° C. is 0% or more and 10% or less.

Abstract: A manufacturing method includes the step of laminating a sheet assembly onto chips arranged on a processing tape, where the sheet assembly has a multilayer structure including a base and a sinter-bonding sheet and is laminated so that the sinter-bonding sheet faces the chips, and subsequently removing the base B from the sinter-bonding sheet. The chips on the processing tape are picked up each with a portion of the sinter-bonding sheet adhering to the chip, to give sinter-bonding material layer-associated chips. The sinter-bonding material layer-associated chips are temporarily secured through the sinter-bonding material layer to a substrate. The sinter-bonding material layers lying between the temporarily secured chips and the substrate are converted through a heating process into sintered layers, to bond the chips to the substrate.

Abstract: Provided is a transport fixing jig that has a high gripping force, hardly contaminates an object to be processed (object to be transported), and is excellent in heat resistance. The transport fixing jig of the present invention includes: a first base material; a carbon nanotube aggregate; and an adhesive layer arranged between the first base material and the carbon nanotube aggregate, wherein the first base material and the carbon nanotube aggregate are bonded to each other via the adhesive layer, and wherein a ratio (adhesive layer/base material) between a linear expansion coefficient of the first base material and a linear expansion coefficient of the adhesive layer is from 0.7 to 1.8.

Abstract: The present invention provides a method for producing a semiconductor device, including: a semiconductor chip-mounting step of subsequently pressing a plurality of semiconductor chips by a first pressing member to respectively bond the plurality of semiconductor chips to a plurality of mounting areas provided on a substrate, wherein the bonding is performed in a state where adhesive sheets are respectively interposed between the plurality of semiconductor chips and the plurality of mounting areas, each of the adhesive sheets includes sinterable metal particles that can be sintered by heating at a temperature of 400° C. or less, and the first pressing member is heated to a temperature, at which the sinterable metal particles can be sintered.

Abstract: Provided is a carbon nanotube aggregate excellent in gripping force in a wide temperature range including high-temperature conditions. The carbon nanotube aggregate of the present invention is a carbon nanotube aggregate of a sheet shape, including a plurality of carbon nanotubes, wherein the carbon nanotube aggregate satisfies the following condition for FFM differential voltages when a frictional curve is obtained by scanning a front surface and/or a back surface of the carbon nanotube aggregate with a probe of a scanning probe microscope under a state in which the probe is brought into contact therewith: a ratio of an FFM differential voltage at 210° C. to an FFM differential voltage at 25° C. is from 0.3 to 5.

Abstract: The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 ?m or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 80% by mass. The sinter-bonding sheet (10) has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet (10) and a dicing tape (20). The dicing tape (20) has a lamination structure containing a base material (21) and an adhesive layer (22), and the sinter-bonding sheet (10) is positioned on the adhesive layer (22) of the dicing tape (20).

Abstract: A dicing die bonding film according to the present invention includes: a dicing tape including a base layer and an adhesive layer laminated on the base layer; and a die bonding layer laminated on the adhesive layer of the deicing tape; the die bonding layer including a matrix resin, a thiol-group-containing compound, and conductive particles.

Abstract: Provided in the present invention is a thermosetting sheet including a thermosetting resin, a thermoplastic resin, a volatile component, and conductive particles. The thermosetting sheet has an arithmetic average roughness Ra of 0.1 ?m or more and 1.2 ?m or less that is measured in a state before being cured.

Abstract: A chair is realized which takes specific measures to suppress movement of a seat in a front-rear direction when the seat swings in the front-rear and the left-right directions with respect to a support base. For the purpose, the chair wherein a seat 5 swings in the front-rear and left-right directions with respect to a support base 2, the chair is configured such that swinging of the seat 5 in front-rear direction with respect to the support base 2 is capable of being suppressed at one or a plurality of predetermined positions, or arbitrary position via operation of operation member 152.

Abstract: A thermosetting sheet according to the present invention includes: a thermosetting resin; a thermoplastic resin; and conductive particles. The conductive particles includes silver particles having an average particle size D50 of 0.01 ?m or more and 10 ?m or less, and having a circularity in cross section of 0.7 or more. The thermosetting sheet has a viscosity at 100° C. of 20 kPa·s or more and 3000 kPa·s or less.

Abstract: The present invention is a laminate including a base sheet and a metal particle-containing layer laminated on the base sheet, and including metal particles. The base sheet has a contact surface in contact with the metal particle-containing layer, and a Young's modulus of the base sheet at 23° C., which is obtained by measuring the contact surface using a nano-indentation method, is 0.01 to 10 GPa.

Abstract: [Problem] Provided is a chair capable of changing an operation of a movable part between allowed and suppressed states, without causing an up-down movement of a seat or without requiring a complicated structure relying on a back. [Solution] For that purpose, a weight-receiving part 50, the height position of which changes due to a person sitting on a seat surface, is provided on a seat 5, the change of the height position is mechanically transmitted to a control mechanism 8X configured to control an operation of a front-rear swing part 3 being the movable part, and the control mechanism 8X changes an operation of the front-rear swing part-3 being the movable part between allowed and suppressed states.

Abstract: In view of various movement of a seated person, when giving the left-right swinging operation to the seat in the non-conventional aspect, a chair configured such that the back can perform a new movement suitable for the left-right movement of the seat and return to the predetermined position when the seated person leaves a seat, is realized. For the purpose, a back 6 is arranged behind a seat 5, and the back 6 has an operation mechanism 6M turning-movably supporting the load received from a seated person in a left-right direction in a front view, and when the load is applied, at least a part of guide part 65a, 66a of the operation mechanism 6M is separated and the back moves freely, and when the applied load is removed, the back automatically returns to the neutral position along the guide part 65a, 66a.

Abstract: A flange part 31b is provided on a vertical surface 31a on the plate member PM of the front-rear swing part 3, the flange part 31b has a guide surface 31b1 extending to lateral direction and moving the rolling body 45 in the longitudinal direction, a lateral direction dimension of the guide surface 31b1 is greater than a thickness of the plate member PM, the flange part 31b and the portion of the plate member PM forming the vertical surface 31a around the flange part 31b are integrally formed of metal; and the flange part 31b has a shape that goes around the circumference of the guide hole 34 opened in the vertical surface 31a, and then, the rolling body 45 are provided independently to the left and right, to be able to a roll along the guide surface 31b1.