Abstract: Various embodiments of the present technology may provide methods and apparatus for optical image stabilization. A system may include an actuator control circuit responsive to a sensor and a feedback signal from an actuator. The actuator control circuit may be configured to calibrate a gain applied to a drive signal based on a measured difference value of the feedback signal generated by the actuator control circuit and a predetermined difference value.

Abstract: Provided are a fine silver particle composition which is usable as a bonding composition and a fine silver particle composition which can give high bonding strength at a low bonding temperature. The fine silver particle composition comprises: fine silver particles, a dispersant containing an alkoxyamine, and a dispersing medium; wherein a content of the dispersant is 0.1 to 7.0% by mass relative to a content of the fine silver particles, and a weight loss when heating from room temperature to 200° C. is 70% by mass or more of the whole organic components.

Abstract: An conductive paste comprises inorganic particles having alkylamine with 6 or less of carbon number on at least a portion of a surface, a polymer dispersant having a pigment affinity group in a main chain and/or a plurality of side chains, and, that comprising a polymer with a comb structure having a plurality of side chains constituting a solvation portion, a polymer having a plurality of pigment affinity portions made from a pigment affinity group in the main chain or a straight-chain polymer having a pigment affinity portion made from a pigment affinity group in one terminal of the main chain, a dispersion medium, wherein a weight reduction percentage at the time of heating solid content of the conductive paste from room temperature to 500° C. by thermal analysis is 15% by weight or less.

Abstract: To provide a bonding composition where high joint strength can be obtained due to joining at a comparatively low temperature and under a pressureless condition, and, that is also equipped with thermal resistance that is difficult to cause a reduction of joint strength due to decomposition, deterioration and/or the like of a resin component at the time of an increase of an operating temperature, and to provide a bonding composition particularly containing metallic particles.

Abstract: Provided is a composition for metal bonding, especially a bonding composition containing metal particles, which is capable of achieving high bonding strength by bonding at a relatively low temperature without the application of a pressure, and which has heat resistance and is thus not susceptible to decrease in the bonding strength due to decomposition or deterioration of a resin component when the service temperature thereof is increased. A bonding composition which is characterized by containing two or more kinds of metal particles having different average particle diameters, an organic component and a dispersant, and which is also characterized in that the particle diameter ratio of the average particle diameter (DS) of metal particles (S) that have the smallest average particle diameter to the average particle diameter (DL) of metal particles (L) that have the largest average particle diameter, namely DS/DL is from 1×10-4 to 0.5.

Abstract: To provide a bonding composition where high joint strength can be obtained due to joining at a comparatively low temperature and under a pressureless condition, and, that is also equipped with thermal resistance that is difficult to cause a reduction of joint strength due to decomposition, deterioration and/or the like of a resin component at the time of an increase of an operating temperature, and to provide a bonding composition particularly containing metallic particles.

Abstract: An conductive paste comprises inorganic particles having alkylamine with 6 or less of carbon number on at least a portion of a surface, a polymer dispersant having a pigment affinity group in a main chain and/or a plurality of side chains, and, that comprising a polymer with a comb structure having a plurality of side chains constituting a solvation portion, a polymer having a plurality of pigment affinity portions made from a pigment affinity group in the main chain or a straight-chain polymer having a pigment affinity portion made from a pigment affinity group in one terminal of the main chain, a dispersion medium, wherein a weight reduction percentage at the time of heating solid content of the conductive paste from room temperature to 500° C. by thermal analysis is 15% by weight or less.

Abstract: Provided is a composition for bonding, in particular, a composition for bonding which contains metal particles, said composition for bonding enabling the achievement of high bonding strength by bonding at a relatively low temperature and having such heat resistance that a decrease in the bonding strength does not easily occur due to &composition, deterioration or the like of a resin component when service temperature is increased. This composition for bonding is characterized by containing inorganic particles and an organic material that contains an amine and/or a carboxylic acid and adheres to at least a part of the surface of each inorganic particle, and is also characterized in that the weight loss rate when heated from room temperature to 200°c. is 33-69% and the weight loss rate when heated from 200° c. to 300° c. is 24-50% as determined by thermal analysis.

Abstract: A program processing device comprises a CPU for carrying out predetermined processing according to a program; an internal memory storing the program and data generated by the CPU by carrying out the program, and a data acquiring circuit connected to an external program processing device, for acquiring the program from the external program processing device to write into the internal memory, wherein the CPU, the internal memory, a debug processing circuit, and the data acquiring circuit are integrally mounted on the same semiconductor substrate.

Abstract: A semiconductor device with an anti-shake function includes a logic chip having a digital circuit which obtains a value for vibration of an apparatus based on a vibration detection signal supplied from a vibration detection element to generate a correction signal. The logic chip includes a correction signal processing unit which generates the correction signal, and a control signal output unit which outputs a vibration control signal in accordance with the correction signal to a vibration correction control unit which executes vibration correction control for an optical component in accordance with vibration.

Abstract: A semiconductor device with an “anti-shake” function includes a logic chip having a digital circuit which obtains a value indicating the amount of vibration of device such as an imaging apparatus based on a vibration detection signal supplied from a vibration detection element to generate a correction signal. The logic chip includes a correction signal processing unit which generates the correction signal, and a control signal output unit which outputs a vibration control signal in accordance with the correction signal to a vibration correction control unit which executes vibration correction control for an optical component. The control signal output unit includes a plurality of types of signal output sections and outputs a vibration control signal corresponding to a driving unit from one signal output section selected from among the plurality of types of signal output sections.

Abstract: A vibration control equalizer for generating a vibration signal for determining a driving amount for an optical component on the basis of an output signal of a vibration detector for detecting vibration of an imaging apparatus, a position control equalizer for calculating a position signal for determining a driving amount for the optical component on the basis of an output signal of a position detector for detecting position of the optical component, and an internal CPU for controlling the vibration control equalizer and the position control equalizer are provided, and compensation for the output signal of the position detector is performed by the internal CPU.

Abstract: A first equalizer generates a vibration-component signal indicating the amount of movement of an image pickup apparatus according to an output signal of a vibration detecting element for detecting the vibration of the image pickup apparatus. The second equalizer generates a drive signal used to control a driver element to correct the position of a lens or image pickup devices, based on the output signal of a position detecting element for detecting the position of the lens to be driven or the image pickup devices to be driven and the vibration-component signal. A control unit verifies the operations of the driver element, the position detecting element, the vibration detecting element and the first equalizer, based on the output signal of the position detecting element and the vibration-component signal.

Abstract: The accuracy of servo control of a corrective lens in an image stabilization control circuit is prevented from decreasing due to non-linear characteristics of a position-detecting element. A signal representing a component of vibration of an image pickup apparatus is generated based on an angular velocity signal from a vibration-detecting element. A microcomputer corrects the vibration component signal according to a predetermined correction function and generates a target position signal representing a target position of the lens. A position-detection signal based on an output from the position-detecting element is compared with the target position signal, and the position of the lens is servo-controlled. The correction function is set so that the characteristics of variation of the target position signal relative to the target position will be the same as the characteristics of variation of the position-detection signal relative to the actual position of the lens.

Abstract: An internal CPU, a vibration control equalizer for processing an output signal of a vibration detector for detecting vibration of an imaging apparatus and calculating a vibration signal for determining a driving amount for an optical component on the basis of vibration of the imaging apparatus, a position control equalizer for calculating a position signal for determining a driving amount for the optical component on the basis of position of the optical component, and a control switching section for switching between the internal CPU and an external control circuit for the imaging apparatus for control of the vibration control equalizer and the position control equalizer.

Abstract: A stepping motor includes two coils and has supply currents to the two coils with different phases so that a rotor is rotated by the two coils. During a period where one coil is in a high impedance state, an induced voltage generated at that coil is detected. An output control circuit controls the magnitude of motor drive current supplied to the two coils in accordance with the detected induced voltage state. Then, prior to entering the high impedance state from the drive state, a short-circuit period is provided for short circuiting both terminals of the coil.

Abstract: In a vibration correction control circuit mounted on an image pickup apparatus including an image pickup unit, provided with lenses, image pickup devices and vibration detecting element, and a driver element for adjusting the position of the image pickup unit, the equalizer generates a drive signal used to move the image pickup unit in a direction along which to reduce the vibration applied to the image pickup unit, based on the output signal of the vibration detecting element. A verifying-signal input circuit supplies a dummy vibration-component signal to the equalizer.

Abstract: A MCP semiconductor device with an “anti-shake” function includes a driver chip and a logic chip. The logic chip includes a correction signal processing unit which obtains a value for vibration of apparatus based on a vibration detection signal to generate a correction signal and a control signal output unit having a plurality of types of signal output sections which output a vibration control signal in accordance with the correction signal to a vibration correction control unit which executes vibration correction control for an optical component. The logic chip further includes a driver output terminal which outputs the vibration control signal to the driver chip, an external output terminal which outputs the control signal to an external circuit other than the driver chip, and also an output switch unit which connects one of the plurality of signal output sections with the driver output terminal or the external output terminal.

Abstract: An optical shake correction unit corrects an optical axis in response to an output signal of an vibration detecting element. An electronic shake correction unit adaptively varies an effective region in image signals of an image pickup region formed by image pickup devices. A control unit performs control such that either the optical shake correction unit or the electronic shake correction unit is enabled by switching between a first image pickup mode and a second image pickup mode.

Abstract: An image stabilization control circuit controls an optical element driving element configured to move an optical element provided in an imaging apparatus based on an output signal of a vibration detection element provided in the imaging apparatus. The image stabilization control circuit includes an analog-digital conversion circuit configured to receive an analog signal from a position detection element that detects the position of the optical element and convert the input analog signal into a digital signal, and a servo circuit configured to generate a correction signal for correcting the position of the optical element based on an output signal of the analog-digital conversion circuit and output the generated correction signal to the optical element driving element. The servo circuit includes a digital filter circuit and a register. The digital filter circuit performs filter processing based on a filter coefficient stored in the register.