Abstract: A method for manufacturing a semiconductor device includes: a step of forming a via plug erected on an electrically conductive layer, and embedding the via plug in an insulation layer to form a wiring structure; and a step of bonding the wiring structure to a wiring substrate including electronic components mounted thereon.

Abstract: An inverse F type antenna 29 including first wiring portions 41 to 45 provided at an upper face 15A of a board 15, second wiring portions 51 to 56 provided at a lower face 15B of the board 15, connecting portions 61 to 70 electrically connecting the first wiring portions 41 to 45 and the second wiring portions 51 to 56, in which the connecting portions 61 to 70 are provided at a side face 15-4 of the board 15.

Abstract: A terminal includes a wireless module for relaying a data signal, a sub-module for relaying the data signal, and a switch which connects the wireless module and the sub-module in parallel, and selects the wireless module or the sub-module to relay the data signal in response to a control signal from a controller provided in the wireless module.

Abstract: A multilayer wiring structural body 13 is formed on a surface 57A of a metal plate 57 used as a support plate in the case of forming the multilayer wiring structural body 13, and the metal plate 57 is patterned and a slot antenna 60 is formed.

Abstract: An antenna 1 which is incorporated in a multilayer wiring board 2 has: radiating elements 11-1, 11-2, 11-3, and 11-4 which are laid on faces of A-, B-, and C-layers of the wiring board 2, respectively; power supplying portions 12-1, 12-2, 12-3, and 12-4 which are laid on the faces of the layers, respectively to supply an electric power to the radiating elements 11-1, 11-2, 11-3, and 11-4; short-circuiting portions 13-1, 13-2, 13-3, and 13-4 which are laid on the faces of the layers, respectively to ground the radiating elements 11-1, 11-2, 11-3, and 11-4; and a connecting portion 14 which penetrates the A-, B-, and C-layers of the wiring board 2, and through which the power supplying portions 12-1, 12-2, 12-3, and 12-4 are electrically connected to each other.

Abstract: A capacitor-built-in substrate of the present invention contains a capacitor which includes a lower common electrode, a plurality of dielectric portions formed on the lower common electrode to be isolated mutually and coupled electrically to the lower common electrode, an insulating layer formed between the plurality of dielectric portions and on a surrounding area, and an upper common electrode formed on the plurality of dielectric portions and the insulating layer, and coupled electrically to the plurality of dielectric portions.

Abstract: A wiring substrate 11 having a power feeding layer 24 and a ground conductive layer 27 is provided, and also an inverted F-type antenna 20 is provided on a sealing resin 17, which covers a semiconductor chip 12 and a chip parts 13 connected to the wiring substrate 11, and an inverted F-type antenna 20 is connected electrically to the power feeding layer 24 and the ground conductive layer 27.

Abstract: Electronic parts 12, 13 and a terminal 14 are provided on a substrate 11, an upper surface 18A of a terminal main body portion 18 is set higher than surfaces 12A, 13A of the electronic parts 12, 13, a sealing resin is provided to expose the upper surface 18A of the terminal main body portion 18, and the terminal 14 and the wiring pattern 16 are connected directly to each other.

Abstract: A semiconductor chip 11 comprising an element formation layer 36 which is formed on a first main surface 35A of a semiconductor substrate 35 and has a semiconductor element, through electrodes 15, 16 which are electrically connected to the semiconductor element and extend through the semiconductor chip 11, and a patch antenna 33 formed on the side of a second main surface 35B of the semiconductor substrate 35 are disposed, and the patch antenna 33 is electrically connected to the through electrode 15 electrically connected to a line for power feeding of the semiconductor element.

Abstract: A patch antenna is disclosed that includes a dielectric substrate, a substantially rectangular radiation element formed of a conductive material on the dielectric substrate; and a feeder line connected to a feeding point for feeding to the radiation element. The feeding point has an impedance matching the impedance of the feeder line.

Abstract: A non-contact type IC card includes a plane coil comprising a conductor line wound several times on substantially the same surface. The plane coil has respective terminals at the innermost and outermost ends. A semiconductor element has electrode terminals electrically connected to the terminals of the plane coil, respectively. A resin-filled portion is defined by a part of the circumference of the plane coil where spaces between adjacent loops of conductor line of the plane coil are filled with light-setting resin to maintain predetermined intervals between the adjacent conductors lines of the plane coil.

Abstract: An antenna for a non-contact type IC card is provided. A plane coil is formed by punching or etching a thin metal plate in such a manner that a conductor line is wound several times on substantially the same surface. The plane coil has respective terminals at innermost and outermost ends. The innermost terminal is provided with accommodation hole, in which a semiconductor element having electrode terminals is arranged. A circuit film comprises an insulating resin film and a circuit pattern formed on the insulating resin film. The circuit pattern electrically connects the electrode terminals of the semiconductor element to the terminals of the plane coil, respectively. At least one projection is integrally formed with the conductor and extending therefrom inwardly or outwardly so as not to contact an adjacent loop of the conductor line. The projection is located at any desired position to be used as a suction pad, an alignment mark or a positioning guide when said plane coil is sucked or positioned.

Abstract: A semiconductor device with an antenna including one or more antenna units for sending and receiving signals and a semiconductor element electrically connected to the antenna units, wherein the antenna units are formed by pressing or etching a thin metal sheet with substantially the same flat surface size as the semiconductor element, and the antenna units are integrally coupled to the surface of the semicondcutor element. The antenna units are formed in a plurality of layers separated by insulating layers, and the antenna units formed on the respective layers are connected electrically in series with each other.

Abstract: A non-contact type IC card, enabling adjustment of an inductance of a flat coil in accordance with a product and enabling universal use of a common shape of the flat coil, carrying a semiconductor device electrically connected to terminals formed at an inner circumference end and outer circumference end of a coil body formed by winding a conductor in a flat manner, wherein an adjustment coil is extended in a flat spiral shape from at least one terminal of the inner circumference end and outer circumference end of the coil body, and the adjustment coil and the semiconductor device are electrically connected.

Abstract: An IC card comprises: a plane coil having respective terminal sections; a semiconductor element arranged at a position not overlapping with the plane coil, the semiconductor element having electrode terminals; means for electrically connecting the respective terminal sections of the plane coil to the electrode terminals of the semiconductor element; and a reinforcing frame arranged on a face substantially the same as that of the semiconductor element so that the semiconductor element is surrounded by the reinforcing frame.

Abstract: An antenna for a non-contact type IC card is provided.

Abstract: A non-contact type IC card includes a plane coil comprising a conductor line wound several times on substantially the same surface. The plane coil has respective terminals at the innermost and outermost ends. A semiconductor element has electrode terminals electrically connected to the terminals of the plane coil, respectively. A resin-filled portion is defined by a part of the circumference of the plane coil where spaces between adjacent loops of conductor line of the plane coil are filled with light-setting resin to maintain predetermined intervals between the adjacent conductors lines of the plane coil.