Abstract: A printed wiring board includes a first insulating layer, a conductor layer, and a second insulating layer. The conductor layer includes first and second circuits such that space is formed between the circuits, the first circuit has first and second side walls, the second circuit has third and fourth side walls such that the second wall faces the third wall, the first circuit has first, second and third portions, the second circuit has fourth, fifth and sixth portions such that the first and fourth portions, the second and fifth portions and the third and sixth portions face each other, the first circuit is formed such that the second wall of the second portion is recessed from the second wall of the first and third portions, and the first insulating layer has recess between the second and fifth portions such that the second insulating layer is filling the space and recess.

Abstract: A printed wiring board includes a first insulating layer, a conductor layer, and a second insulating layer. The conductor layer includes first and second circuits such that space is formed between the circuits, the first circuit has first and second side walls, the second circuit has third and fourth side walls such that the second wall faces the third wall, the first circuit has first, second and third portions, the second circuit has fourth, fifth and sixth portions such that the first and fourth portions, the second and fifth portions and the third and sixth portions face each other, the first circuit is formed such that the second wall of the second portion is recessed from the second wall of the first and third portions, and the first insulating layer has recess between the second and fifth portions such that the second insulating layer is filling the space and recess.

Abstract: A printed wiring board includes a resin layer, pads formed on the resin layer and positioned to be connected to an electronic component, and a solder-resist layer formed on the resin layer and exposing upper surfaces of the pads and portions of side walls of the pads. Each of the pads has a metal layer such that the metal layer is formed on each of the upper surfaces of the pads and each of the portions of the side walls of the pads exposed by the solder-resist layer.

Abstract: [PROBLEMS] To provide a rotating frame of an upper rotating body such that total productivity can be improved, the cost can be reduced, and model change can be facilitated. [MEANS FOR SOLVING PROBLEMS] Many models having different lifting capacities are divided into a plurality of classes each including a plurality of models. A rotating frame 17 is determined on the basis of the model having the largest lifting capacity in each class. An upper rotating body is constructed using the rotating frame 17 as the base. In addition, each of winches 5 to 7 is mounted on the rotating frame by using a mounting structure standardized in the same class. On the other hand, left and right deck frames 18 and 19 are divided into sections on which different pieces of equipment are mounted, and the sections are separately attached to the rotating frame 17.

Abstract: A printed wiring board includes a core substrate having a penetrating hole penetrating through the core substrate and having a first insulation layer, a second insulation layer and an insulative substrate interposed between the first and second layers, a first circuit formed on a surface of the core, a second circuit formed on opposite surface of the core, and a through-hole conductor formed in the penetrating hole of the core and connecting the first and second circuits. The penetrating hole has first and second opening portions, the first opening portion becomes thinner from the first surface toward the second surface, the second opening portion becomes thinner from the second surface toward the first surface, and the first and second insulation layers are comprised of resin materials easier to be processed by laser than resin material of the insulative substrate under same conditions of the laser.

Abstract: A printed wiring board includes a resin layer, pads formed on the resin layer and positioned to be connected to an electronic component, and a solder-resist layer formed on the resin layer and exposing upper surfaces of the pads and portions of side walls of the pads. Each of the pads has a metal layer such that the metal layer is formed on each of the upper surfaces of the pads and each of the portions of the side walls of the pads exposed by the solder-resist layer.

Abstract: A method for manufacturing a printed wiring board includes forming a pad for mounting an electronic component on a resin layer, forming a solder-resist layer on the resin layer and the pad, exposing an upper surface of the pad and a portion of a side wall of the pad from the solder-resist layer, and forming a metal layer on the upper surface of the pad and the portion of the side wall of the pad.

Abstract: A printed wiring board includes a core substrate having a penetrating hole penetrating through the core substrate and having a first insulation layer, a second insulation layer and an insulative substrate interposed between the first and second layers, a first circuit formed on a surface of the core, a second circuit formed on opposite surface of the core, and a through-hole conductor formed in the penetrating hole of the core and connecting the first and second circuits. The penetrating hole has first and second opening portions, the first opening portion becomes thinner from the first surface toward the second surface, the second opening portion becomes thinner from the second surface toward the first surface, and the first and second insulation layers are comprised of resin materials easier to be processed by laser than resin material of the insulative substrate under same conditions of the laser.

Abstract: A printed wiring board includes a core substrate having a penetrating hole, a first circuit on a first surface of the substrate, a second circuit on a second surface of the substrate, and a through-hole conductor in the hole connecting the first and second circuits. The hole has first and second opening portions. The first opening portion becomes thinner toward the second surface. The second opening portion becomes thinner toward the first surface. The first opening portion has first and second portions. The second opening portion has first and second portions. The first and second portions of the first opening portion form inner walls bending inward at the boundary between the first and second portions. The first and second portions of the second opening portion form inner walls bending inward at the boundary between the first and second portions.

Abstract: A printed wiring board includes a core substrate having a penetrating hole, a first circuit on a first surface of the substrate, a second circuit on a second surface of the substrate, and a through-hole conductor in the hole connecting the first and second circuits. The hole has first and second opening portions. The first opening portion becomes thinner toward the second surface. The second opening portion becomes thinner toward the first surface. The first opening portion has first and second portions. The second opening portion has first and second portions. The first and second portions of the first opening portion form inner walls bending inward at the boundary between the first and second portions. The first and second portions of the second opening portion form inner walls bending inward at the boundary between the first and second portions.

Abstract: A method for manufacturing a printed wiring board includes forming a pad for mounting an electronic component on a resin layer, forming a solder-resist layer on the resin layer and the pad, exposing an upper surface of the pad and a portion of a side wall of the pad from the solder-resist layer, and forming a metal layer on the upper surface of the pad and the portion of the side wall of the pad.

Abstract: [PROBLEMS] To provide a rotating frame of an upper rotating body such that total productivity can be improved, the cost can be reduced, and model change can be facilitated. [MEANS FOR SOLVING PROBLEMS] Many models having different lifting capacities are divided into a plurality of classes each including a plurality of models. A rotating frame 17 is determined on the basis of the model having the largest lifting capacity in each class. An upper rotating body is constructed using the rotating frame 17 as the base. In addition, each of winches 5 to 7 is mounted on the rotating frame by using a mounting structure standardized in the same class. On the other hand, left and right deck frames 18 and 19 are divided into sections on which different pieces of equipment are mounted, and the sections are separately attached to the rotating frame 17.