Patents by Inventor Tomohiro Ishino

Tomohiro Ishino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220162418
    Abstract: There is provided a resin composition that can greatly improve voltage endurance while ensuring high capacitance and excellent circuit adhesion, when used as the dielectric layer of a capacitor. This resin composition includes a binder component including bisphenol S, an epoxy resin curing agent having a phenolic hydroxyl group, and an epoxy resin; and a dielectric filler.
    Type: Application
    Filed: February 7, 2020
    Publication date: May 26, 2022
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Toshihiro HOSOI, Kenshiro FUKUDA, Yoshihiro YONEDA, Tomohiro ISHINO, Tetsuro SATO
  • Patent number: 11279005
    Abstract: Provided are a vacuum chuck member and a vacuum chuck method that are capable of suppressing misalignment of a substrate when a wafer having a significant deflection or warpage is chucked and held. In a state in which a wafer W is placed on the upper surface side of a base 1, the pressure in an inner space S1 surrounded by the upper surface of the base 1, the lower surface of the wafer W, and the inner side surface of an inner annular rib 21 is reduced through a first air passage 101. Subsequently, the pressure in an outer space S2 surrounded by the upper surface of the base 1, the lower surface of the wafer W, the outer side surface of the inner annular rib 21, and the inner side surface of an outer annular rib 22 is reduced through a second air passage 102.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: March 22, 2022
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Tomohiro Ishino, Shinya Kikuchi
  • Patent number: 11004715
    Abstract: A substrate supporting device having a feeder structure that enables a large number of electrodes to be successfully supplied with power. A ceramic heater 100 includes a base 10 having an upper surface as a support surface on which a substrate is supported, electrodes 20 embedded in the base 10, a base-supporting member 30 that is mounted on a lower surface of the base 10 and that is formed of a heat insulating material, and feeder rods 40 that extend through respective through-holes 35 formed in a circumferential wall 34 of the base-supporting member 30 and extending in the vertical direction and that are electrically connected to the electrodes 20.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: May 11, 2021
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Noriaki Tokusho, Shunichi Sasaki, Tomohiro Ishino, Hisanori Aoyama, Makoto Hino, Kenichi Fukazawa, Atsushi Tsuchida, Toshiya Umeki
  • Patent number: 10836018
    Abstract: Provided are a substrate holding device and a substrate holding method that enhance the precision of the shape of a substrate while holding the substrate. The substrate holding device includes a first holding member 1, including a plate-shaped first base 10, and a second holding member 2, including a thin plate-shaped second base 20. The first base 10 has an airway 102 extending to the upper surface of the first base 10. The second base 20 has a through hole 202 extending in a thick direction of the second base 20 at a center portion of the second base 20. The second base 20 includes, on the upper surface of the second base 20, multiple protrusions 211, which protrude upward, and at least one annular ridge 212, which protrudes upward in a substantially annular shape coaxial with the first base 10 and surrounds an upper opening of the through hole 202 and the multiple protrusions 211.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: November 17, 2020
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Tomohiro Ishino, Shinya Kikuchi
  • Patent number: 10770334
    Abstract: A substrate holding device includes a base body that has a flat plate-like shape and in which gas holes that open in an upper surface of the base body are formed, and a plurality of protrusions that protrude upward from the upper surface of the base body. A groove that opens in a lower surface of the base body and that is connected to the gas holes is formed in the base body, and a plurality of protrusions that protrude downward are formed in the groove.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: September 8, 2020
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Tomohiro Ishino, Shinya Kikuchi
  • Patent number: 10468289
    Abstract: Provided is a substrate holding member that includes a base body and a plurality of protrusions formed on a surface of the base body and that is capable of suppressing generation of particles due to peeling-off or cracking of protective layers of the protrusions. A substrate holding member includes a base body and a plurality of protrusions formed on a surface of the base body. Each of the protrusions includes a base portion and a protective layer, the base portion having a flat upper end surface and being made from a silicon carbide sintered compact, the protective layer being made of silicon carbide. The protective layer includes a region on at least a part of the base portion from an edge of the upper end surface to a lower end of the base portion, the region being exposed along an entire periphery. Preferably, the protective layer is formed so as to cover at least only a part of an upper portion of the base portion, the upper portion including the upper end surface.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: November 5, 2019
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Tomohiro Ishino, Takashi Teshima
  • Publication number: 20180311796
    Abstract: Provided are a substrate holding device and a substrate holding method that enhance the precision of the shape of a substrate while holding the substrate. The substrate holding device includes a first holding member 1, including a plate-shaped first base 10, and a second holding member 2, including a thin plate-shaped second base 20. The first base 10 has an airway 102 extending to the upper surface of the first base 10. The second base 20 has a through hole 202 extending in a thick direction of the second base 20 at a center portion of the second base 20. The second base 20 includes, on the upper surface of the second base 20, multiple protrusions 211, which protrude upward, and at least one annular ridge 212, which protrudes upward in a substantially annular shape coaxial with the first base 10 and surrounds an upper opening of the through hole 202 and the multiple protrusions 211.
    Type: Application
    Filed: December 15, 2016
    Publication date: November 1, 2018
    Inventors: Tomohiro ISHINO, Shinya KIKUCHI
  • Publication number: 20180204754
    Abstract: A substrate supporting device having a feeder structure that enables a large number of electrodes to be successfully supplied with power. A ceramic heater 100 includes a base 10 having an upper surface as a support surface on which a substrate is supported, electrodes 20 embedded in the base 10, a base-supporting member 30 that is mounted on a lower surface of the base 10 and that is formed of a heat insulating material, and feeder rods 40 that extend through respective through-holes 35 formed in a circumferential wall 34 of the base-supporting member 30 and extending in the vertical direction and that are electrically connected to the electrodes 20.
    Type: Application
    Filed: February 6, 2017
    Publication date: July 19, 2018
    Applicant: NGK SPARK PLUG CO., LTD.
    Inventors: Noriaki TOKUSHO, Shunichi SASAKI, Tomohiro ISHINO, Hisanori AOYAMA, Makoto HINO, Kenichi FUKAZAWA, Atsushi TSUCHIDA, Toshiya UMEKI
  • Publication number: 20180193983
    Abstract: Provided are a vacuum chuck member and a vacuum chuck method that are capable of suppressing misalignment of a substrate when a wafer having a significant deflection or warpage is chucked and held. In a state in which a wafer W is placed on the upper surface side of a base 1, the pressure in an inner space S1 surrounded by the upper surface of the base 1, the lower surface of the wafer W, and the inner side surface of an inner annular rib 21 is reduced through a first air passage 101. Subsequently, the pressure in an outer space S2 surrounded by the upper surface of the base 1, the lower surface of the wafer W, the outer side surface of the inner annular rib 21, and the inner side surface of an outer annular rib 22 is reduced through a second air passage 102.
    Type: Application
    Filed: February 6, 2017
    Publication date: July 12, 2018
    Inventors: Tomohiro ISHINO, Shinya KIKUCHI
  • Publication number: 20180130692
    Abstract: Provided is a substrate holding member that includes a base body and a plurality of protrusions formed on a surface of the base body and that is capable of suppressing generation of particles due to peeling-off or cracking of protective layers of the protrusions. A substrate holding member includes a base body and a plurality of protrusions formed on a surface of the base body. Each of the protrusions includes a base portion and a protective layer, the base portion having a flat upper end surface and being made from a silicon carbide sintered compact, the protective layer being made of silicon carbide. The protective layer includes a region on at least a part of the base portion from an edge of the upper end surface to a lower end of the base portion, the region being exposed along an entire periphery. Preferably, the protective layer is formed so as to cover at least only a part of an upper portion of the base portion, the upper portion including the upper end surface.
    Type: Application
    Filed: December 16, 2016
    Publication date: May 10, 2018
    Inventors: Tomohiro ISHINO, Takashi TESHIMA
  • Publication number: 20170345701
    Abstract: A substrate holding device includes a base body that has a flat plate-like shape and in which gas holes that open in an upper surface of the base body are formed, and a plurality of protrusions that protrude upward from the upper surface of the base body. A groove that opens in a lower surface of the base body and that is connected to the gas holes is formed in the base body, and a plurality of protrusions that protrude downward are formed in the groove.
    Type: Application
    Filed: May 22, 2017
    Publication date: November 30, 2017
    Inventors: Tomohiro ISHINO, Shinya KIKUCHI
  • Patent number: 6551433
    Abstract: An object of the invention is to prevent dent faults generated during bonding of an outer copper foil layer onto an inner layer substrate having a through hole or a cavity serving as an interlayer electrical connection means such as an interstitial via hole (IVH) or a blind via hole (BVH).
    Type: Grant
    Filed: July 12, 2001
    Date of Patent: April 22, 2003
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Fujio Kuwako, Tomohiro Ishino
  • Publication number: 20020005249
    Abstract: An object of the invention is to prevent dent faults generated during bonding of an outer copper foil layer onto an inner layer substrate having a through hole or a cavity serving as an interlayer electrical connection means such as an interstitial via hole (IVH) or a blind via hole (BVH).
    Type: Application
    Filed: July 12, 2001
    Publication date: January 17, 2002
    Inventors: Fujio Kuwako, Tomohiro Ishino
  • Patent number: D811451
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: February 27, 2018
    Inventors: Tomohiro Ishino, Norio Onodera
  • Patent number: D811452
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: February 27, 2018
    Inventors: Tomohiro Ishino, Norio Onodera
  • Patent number: D829778
    Type: Grant
    Filed: June 27, 2016
    Date of Patent: October 2, 2018
    Assignee: NGK SPARK PLUG CO. LTD.
    Inventor: Tomohiro Ishino