Patents by Inventor Tomohiro Shinagawa

Tomohiro Shinagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11107685
    Abstract: The semiconductor manufacturing device includes: a lower substrate support base configured to support a diamond substrate; an upper substrate support base configured to support a semiconductor substrate; a support base drive unit configured to move the lower substrate support base and the upper substrate support base to bring the diamond substrate and the semiconductor substrate into close contact with each other under a state in which a pressure is applied to the diamond substrate and the semiconductor substrate in a thickness direction; and a second mechanism configured to deform a surface of the upper substrate support base opposed to the lower substrate support base so that a surface of the semiconductor substrate opposed to the diamond substrate forms a parallel surface or a parallel plane with respect to a surface of the diamond substrate opposed to the semiconductor substrate.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: August 31, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Keisuke Nakamura, Muneyoshi Suita, Akifumi Imai, Kenichiro Kurahashi, Tomohiro Shinagawa, Takashi Matsuda, Koji Yoshitsugu, Eiji Yagyu, Kunihiko Nishimura
  • Patent number: 10916447
    Abstract: In a semiconductor device including a crystalline nitride layer, in which diamond is used for heat dissipation thereof, it is an object of the present invention to suppress cracking of the crystalline nitride layer. The semiconductor device includes a layered body and a heat dissipation layer. The layered body includes a crystalline nitride layer and a composite layer. The composite layer includes a non-inhibiting portion which does not inhibit diamond growth on a surface thereof and an inhibiting portion which inhibits the diamond growth on the surface. A layered body main surface of the layered body has a first region in which the non-inhibiting portion is exposed and a second region in which the inhibiting portion is exposed. The heat dissipation layer is made of diamond, opposed to the main surface, adhered to the first region, and separated from the second region with a void interposed therebetween.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: February 9, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Yasushi Fujioka, Takeo Furuhata, Tomohiro Shinagawa, Keisuke Nakamura
  • Patent number: 10906387
    Abstract: A cooling apparatus of a vehicle driving system of the invention connects an engine water circulation passage to a hybrid system water circulation passage and flows cooling water in the engine water circulation passage and the hybrid system water circulation passage to cool a first hybrid system component by the cooling water cooled by an engine radiator and cool a second hybrid system component by the cooling water cooled by a hybrid system radiator when an engine cooling process is not requested, a first hybrid system cooling process is requested, a second hybrid system cooling process is requested, and a connection condition is satisfied. The connection condition is satisfied when the engine cooling process is not requested, and the cooling water flowing into the hybrid system water circulation passage from the engine water circulation passage, can cool the first hybrid system component.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: February 2, 2021
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takuya Hirai, Yuji Miyoshi, Tomohiro Shinagawa, Masatoshi Yano, Hiroyuki Sugihara, Ryo Michikawauchi, Kunihiko Hayashi, Yoichi Ogura, Hidefumi Aikawa, Yu Ofune
  • Patent number: 10890102
    Abstract: A cooling apparatus of an internal combustion engine according to the invention controls an activation of a flow rate changing valve such that a block water flow rate proportion when an engine output is relatively large in a range of the engine output equal to or larger than a predetermine engine output, is larger than the block water flow rate proportion when the engine output is relatively small in the range of the engine output equal to or larger than a predetermine engine output.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: January 12, 2021
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Yoshiharu Hirata, Yuji Miyoshi, Tomohiro Shinagawa, Hiroyuki Sugihara
  • Patent number: 10865694
    Abstract: A cooling apparatus of a vehicle of the invention comprises an engine cooling system, a device cooling system, and a connection apparatus configured to connect an engine circulation circuit of the engine cooling system and a device circulation circuit of the device cooling system to each other such that heat exchanging liquid cooled by a device radiator of the device cooling system, is supplied to an engine passage formed in an internal combustion engine without flowing through a device passage formed in the device including at least one of a motor of the vehicle, a battery for storing electric power to be supplied to the motor, and a power control unit for controlling a supply of the electric power from the battery to the motor.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: December 15, 2020
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hiroyuki Sugihara, Tomohiro Shinagawa, Yuji Miyoshi, Takuya Hirai, Keisuke Tokai
  • Patent number: 10720374
    Abstract: A semiconductor substrate according to the present invention includes a nitride semiconductor layer 203, an amorphous semiconductor layer 205 formed on one main surface side of the nitride semiconductor layer 203, a high-roughness layer 206 which is a semiconductor layer formed on the amorphous semiconductor layer 205 and has a surface roughness larger than the amorphous semiconductor layer 205, and a diamond layer 207 formed on the high-roughness layer 206. Damage to the nitride semiconductor layer can be reduced in forming the diamond layer on the nitride semiconductor layer and adhesion between the layers can be increased.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: July 21, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Tomohiro Shinagawa, Takeo Furuhata, Shingo Tomohisa
  • Patent number: 10651278
    Abstract: An object is to provide a technology capable of suppressing a crack of a crystalline nitride layer which is generated due to a stress caused by difference in thermal expansion coefficients between a crystalline nitride and diamond. A semiconductor device includes a crystalline nitride layer, a structure containing silicon, and a diamond layer. The structure is disposed on a first main surface of the crystalline nitride layer. The diamond layer is disposed at least on a lateral portion of the structure and has a void between the diamond layer and the first main surface of the crystalline nitride layer. The void is a stress absorbing space, for example.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: May 12, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takeo Furuhata, Tomohiro Shinagawa
  • Patent number: 10563623
    Abstract: An EGR cooler in the disclosure includes: a gas path configured to allow an EGR gas to flow; a refrigerant path configured to perform heat exchange between the EGR gas circulating along the gas path and a refrigerant; an exothermic body containing portion configured such that an exothermic body to generate heat by adsorbing a predetermined working gas is contained within the EGR cooler and at least a part of the exothermic body contacts with a wall surface of the gas path; a working gas tank in which the working gas is stored; and a gas moving apparatus configured to move the working gas stored in the working gas tank, from the working gas tank to the exothermic body containing portion.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: February 18, 2020
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Tomohiro Shinagawa, Takashi Hotta, Takeo Yamaguchi, Yoshio Ohashi, Taizo Yoshinaga, Yuji Miyoshi
  • Publication number: 20200047605
    Abstract: A cooling apparatus of a vehicle driving system of the invention connects an engine water circulation passage to a hybrid system water circulation passage and flows cooling water in the engine water circulation passage and the hybrid system water circulation passage to cool a first hybrid system component by the cooling water cooled by an engine radiator and cool a second hybrid system component by the cooling water cooled by a hybrid system radiator when an engine cooling process is not requested, a first hybrid system cooling process is requested, a second hybrid system cooling process is requested, and a connection condition is satisfied. The connection condition is satisfied when the engine cooling process is not requested, and the cooling water flowing into the hybrid system water circulation passage from the engine water circulation passage, can cool the first hybrid system component.
    Type: Application
    Filed: April 16, 2019
    Publication date: February 13, 2020
    Inventors: Takuya HIRAI, Yuji MIYOSHI, Tomohiro SHINAGAWA, Masatoshi YANO, Hiroyuki SUGIHARA, Ryo MICHIKAWAUCHI, Kunihiko HAYASHI, Yoichi OGURA, Hidefumi AIKAWA, Yu OFUNE
  • Patent number: 10557400
    Abstract: The cooling apparatus of the engine sets the first shut-off valve to the closed position, sets the second shut-off valve to the open position, and performs the opposite flow connection operation to supplies the cooling water directly to the cylinder block water passage from the cylinder head water passage without flowing the cooling water through the radiator and to the heat exchanger from the cylinder head water block when the engine temperature is lower than the completely-warmed temperature, and the cooling water is requested to be supplied to the heat exchanger.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: February 11, 2020
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Yoshio Hasegawa, Tomohiro Shinagawa, Yuji Miyoshi
  • Publication number: 20190362974
    Abstract: The semiconductor manufacturing device includes: a lower substrate support base configured to support a diamond substrate; an upper substrate support base configured to support a semiconductor substrate; a support base drive unit configured to move the lower substrate support base and the upper substrate support base to bring the diamond substrate and the semiconductor substrate into close contact with each other under a state in which a pressure is applied to the diamond substrate and the semiconductor substrate in a thickness direction; and a second mechanism configured to deform a surface of the upper substrate support base opposed to the lower substrate support base so that a surface of the semiconductor substrate opposed to the diamond substrate forms a parallel surface or a parallel plane with respect to a surface of the diamond substrate opposed to the semiconductor substrate.
    Type: Application
    Filed: February 1, 2018
    Publication date: November 28, 2019
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Keisuke NAKAMURA, Muneyoshi SUITA, Akifumi IMAI, Kenichiro KURAHASHI, Tomohiro SHINAGAWA, Takashi MATSUDA, Koji YOSHITSUGU, Eiji YAGYU, Kunihiko NISHIMURA
  • Publication number: 20190329644
    Abstract: A cooling apparatus of a vehicle driving system for driving a vehicle according to the invention activates a heat pump to cool a hybrid system by cooling medium and flows an engine cooling water in an engine water circulation passage through a condenser to cool the cooling medium by the engine cooling water at the condenser when an engine water circulation condition is satisfied. The engine water circulation condition is a condition that a heat pump activation condition is satisfied, and an engine cooling condition is not satisfied. The heat pump activation condition is a condition that a process of cooling the hybrid system by the cooling medium of the heat pump is requested. The engine cooling condition is a condition that a process of cooling an internal combustion engine by the engine cooling water is requested.
    Type: Application
    Filed: March 22, 2019
    Publication date: October 31, 2019
    Inventors: Yoichi OGURA, Kunihiko HAYASHI, Masatoshi YANO, Yuji MIYOSHI, Takuya HIRAI, Tomohiro SHINAGAWA, Ryo MICHIKAWAUCHI, Hidefumi AIKAWA, Yu OFUNE
  • Patent number: 10434867
    Abstract: A cooling apparatus of vehicle driving apparatuses of the invention controls flow of cooling water so as to cool engine cooling water by at least two radiators when a requested ability of cooling an internal combustion engine, is equal to or larger than a requested ability of cooling a hybrid device. The number of the radiators used for cooling the engine cooling water is larger than the number of the remaining radiator(s). The cooling apparatus controls the flow of the cooling water so as to cool device cooling water at least two radiators when the requested ability of cooling the hybrid device, is larger than the requested ability of cooling the internal combustion engine. The number of the radiators used for cooling the device cooling water is larger than the number of the remaining radiator(s).
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: October 8, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yuji Miyoshi, Takuya Hirai, Tomohiro Shinagawa, Hiroyuki Sugihara
  • Publication number: 20190299770
    Abstract: A cooling apparatus of vehicle driving apparatuses of the invention controls flow of cooling water so as to cool engine cooling water by at least two radiators when a requested ability of cooling an internal combustion engine, is equal to or larger than a requested ability of cooling a hybrid device. The number of the radiators used for cooling the engine cooling water is larger than the number of the remaining radiator(s). The cooling apparatus controls the flow of the cooling water so as to cool device cooling water at least two radiators when the requested ability of cooling the hybrid device, is larger than the requested ability of cooling the internal combustion engine. The number of the radiators used for cooling the device cooling water is larger than the number of the remaining radiator(s).
    Type: Application
    Filed: February 7, 2019
    Publication date: October 3, 2019
    Inventors: Yuji MIYOSHI, Takuya HIRAI, Tomohiro SHINAGAWA, Hiroyuki SUGIHARA
  • Patent number: 10428753
    Abstract: An ECU avoids engine stall by putting a compressor into a stationary state in a case where the rotation speed of a crankshaft is equal to or less than a predetermined speed during an idle operation of an internal combustion engine. During the idle operation, the ECU calculates a total load torque applied to the crankshaft by the compressor and an alternator. The ECU calculates the maximum torque of the internal combustion engine during the idle operation based on a target speed during the idle operation. Then, the ECU raises the predetermined speed in a case where the value obtained by subtracting the load torque from the maximum torque is equal to or less than a predetermined value.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: October 1, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Atsushi Fukuda, Tomohiro Shinagawa
  • Patent number: 10428720
    Abstract: The cooling apparatus of the engine according to the invention supplies the cooling water directly to the cylinder block water passage from the cylinder head water passage when the engine temperature is between first and second temperatures, and a supply of the cooling water to the heat exchanger is not requested. The first and second temperatures are lower than the engine completely-warmed temperature. The apparatus supplies the cooling water discharged from the cylinder block and head water passages, to the water passages through the heat exchanger when the engine temperature is between the second temperature and the engine completely-warmed temperature, and the supply of the cooling water to the heat exchanger is not requested.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: October 1, 2019
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Yoshio Hasegawa, Yuji Miyoshi, Tomohiro Shinagawa, Yoshiharu Hirata
  • Patent number: 10415455
    Abstract: A cooling apparatus of an engine of the invention has a circulation passage for supplying cooling water to head and block passages through a heat exchanger. The apparatus circulates the cooling water through the circulation passage when a second condition is satisfied and then, a first condition is satisfied. The first condition includes a water supply condition that a supply of the cooling water to the exchanger is requested. The second condition includes the water supply condition and a condition that a cooling water temperature is lower than an engine completely-warmed water temperature.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: September 17, 2019
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Yoshio Hasegawa, Yuji Miyoshi, Tomohiro Shinagawa, Yoshiharu Hirata, Ryo Michikawauchi
  • Patent number: 10385759
    Abstract: A cooling system includes: a first coolant passage; a second coolant passage; a pump; a radiator; a third coolant passage; a connection switching mechanism that switches between a forward flow connection state and a reverse flow connection state; a fourth coolant passage; a fifth coolant passage; and a shutoff valve configured to open/shut off the fifth coolant passage. The radiator is disposed at a location at which coolant flowing from a second end of the first coolant passage into a fourth end of the second coolant passage is not cooled in the reverse flow connection state, and coolant flowing out from the second end of the first coolant passage and the fourth end of the second coolant passage is cooled in the forward flow connection state.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: August 20, 2019
    Assignees: Toyota Jidosha Kabushiki Kaisha, Aisin Seiki Kabushiki Kaisha
    Inventors: Yoshio Hasegawa, Tomohiro Shinagawa, Kenichi Kubota, Ryo Michikawauchi, Yuji Miyoshi, Yoshiharu Hirata, Naoto Yumisashi
  • Publication number: 20190252288
    Abstract: A semiconductor substrate according to the present invention includes a nitride semiconductor layer 203, an amorphous semiconductor layer 205 formed on one main surface side of the nitride semiconductor layer 203, a high-roughness layer 206 which is a semiconductor layer formed on the amorphous semiconductor layer 205 and has a surface roughness larger than the amorphous semiconductor layer 205, and a diamond layer 207 formed on the high-roughness layer 206. Damage to the nitride semiconductor layer can be reduced in forming the diamond layer on the nitride semiconductor layer and adhesion between the layers can be increased.
    Type: Application
    Filed: February 3, 2017
    Publication date: August 15, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Tomohiro SHINAGAWA, Takeo FURUHATA, Shingo TOMOHISA
  • Publication number: 20190234289
    Abstract: A cooling apparatus of a vehicle of the invention comprises an engine cooling system, a device cooling system, and a connection apparatus configured to connect an engine circulation circuit of the engine cooling system and a device circulation circuit of the device cooling system to each other such that heat exchanging liquid cooled by a device radiator of the device cooling system, is supplied to an engine passage formed in an internal combustion engine without flowing through a device passage formed in the device including at least one of a motor of the vehicle, a battery for storing electric power to be supplied to the motor, and a power control unit for controlling a supply of the electric power from the battery to the motor.
    Type: Application
    Filed: October 9, 2018
    Publication date: August 1, 2019
    Applicant: Toyota Jidosha Kabushiki Kaisha
    Inventors: Hiroyuki Sugihara, Tomohiro Shinagawa, Yuji Miyoshi, Takuya Hirai, Keisuke Tokai