Patents by Inventor Tomohisa Kishimoto

Tomohisa Kishimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10847683
    Abstract: A package includes a first electrode and a second electrode that are located at a bottom portion of a bottomed recess, and a first resin securing the first electrode and the second electrode in place and forming a part of the bottomed recess. The first electrode has a first outer lead having a first indentation at a tip in a plan view. The second electrode has a second outer lead having a second indentation at a tip in a plan view. The first resin has at least a portion between the first electrode and the second electrode located at the bottom portion of the bottomed recess, wall portions structuring lateral walls of the bottomed recess, and flange portions having the same thickness as a thickness of the first outer lead and different outward widths from the wall portions on both sides of the first outer lead in a plan view.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: November 24, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Mayumi Fukuda, Tomohisa Kishimoto
  • Patent number: 10804449
    Abstract: A method for manufacturing a package includes molding a precursor of a package including a cup-shaped resin component having a bottom surface and side walls, an opening opened at an upper part of the side walls, and a pair of leads exposed on the bottom surface. The side walls include a side wall that extends along the Y axis and the X axis and that has a first outer surface, and a side wall that extends along the Y axis and the Z axis. A thickness of the side wall extending along Y axis and the X axis is less than a thickness of the side wall extending along axis and the Z axis. The first outer surface has a recess which is recessed in the Z axis direction and arranged in a position corresponding to the opening. The method further includes forming a reflective film in the recess.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: October 13, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Koji Abe, Tomohisa Kishimoto
  • Publication number: 20200274034
    Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c.
    Type: Application
    Filed: May 13, 2020
    Publication date: August 27, 2020
    Applicant: NICHIA CORPORATION
    Inventors: Masafumi KURAMOTO, Tomohisa KISHIMOTO
  • Publication number: 20200190400
    Abstract: The present invention relates to a composition comprising a nanoparticle.
    Type: Application
    Filed: June 5, 2018
    Publication date: June 18, 2020
    Applicant: Merck Patent GmbH
    Inventors: Yuki HIRAYAMA, Tadashi KISHIMOTO, Tomohisa GOTO, Masayoshi SUZUKI, Teruaki SUZUKI
  • Patent number: 10686102
    Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: June 16, 2020
    Assignee: Nichia Corporation
    Inventors: Masafumi Kuramoto, Tomohisa Kishimoto
  • Publication number: 20200157419
    Abstract: The present invention relates to a composition comprising a semiconducting light emitting nanoparticle.
    Type: Application
    Filed: June 26, 2018
    Publication date: May 21, 2020
    Applicant: Merck Patent GmbH
    Inventors: Tadashi KISHIMOTO, Yuki HIRAYAMA, Tomohisa GOTO, Masayoshi SUZUKI, Teruaki SUZUKI
  • Publication number: 20200107447
    Abstract: A printed circuit board includes a printed wiring board, a semiconductor element, and conductive members. The printed wiring board includes an insulative substrate having a first surface and a second surface opposite to the first surface, and wiring provided on the second surface of the insulative substrate to face the through-holes. The insulative substrate has flexibility and through-holes passing through the insulative substrate from the first surface to the second surface. The semiconductor element is mounted on the first surface of the insulative substrate of the printed wiring board and has element terminals interposed between the printed wiring board and the semiconductor element. The conductive members filled in the through-holes connect the element terminals and the wiring.
    Type: Application
    Filed: September 27, 2019
    Publication date: April 2, 2020
    Applicant: NICHIA CORPORATION
    Inventors: Masakazu SAKAMOTO, Masaaki KATSUMATA, Tomohisa KISHIMOTO
  • Publication number: 20200073075
    Abstract: A lens includes a cover part and a light-shielding part. The cover part includes a lens part, a connection part, and a plurality of flange parts, formed with a thermosetting first resin and continuous to one another. The light-shielding part covers lateral end surfaces and an upper surface of each of the flange parts and outer lateral sides of the connection part and formed with a thermosetting second resin having a greater light-absorptance or a greater light-reflectance than the thermosetting first resin.
    Type: Application
    Filed: September 2, 2019
    Publication date: March 5, 2020
    Applicant: NICHIA CORPORATION
    Inventors: Tsuyoshi OKAHISA, Toshiyuki FUJII, Tomohisa KISHIMOTO
  • Publication number: 20200073074
    Abstract: A lens includes a cover part and a light-shielding part. The cover part includes a lens part, a connection part extending downward from lateral sides of the lens part, and one or more flange parts each extending outward from a lower-end portion of the connection part. The lens part and the connection part define a recess having an opening facing downward. The flange parts extend outward from a periphery of the opening of the recess. The lens part, the flange parts, and the connection part are formed of a thermosetting first resin and continuous to one another. The light-shielding part covers outer lateral surface of the connection part and is formed of a thermosetting second resin having a greater light-absorptance or a greater light-reflectance than the thermosetting first resin. The flange parts have a greater thickness than the connection part.
    Type: Application
    Filed: September 2, 2019
    Publication date: March 5, 2020
    Applicant: NICHIA CORPORATION
    Inventors: Tomohisa KISHIMOTO, Tsuyoshi OKAHISA, Toshiyuki FUJII
  • Patent number: 10490705
    Abstract: A package has a bottomed recess with a bottom portion. The package includes: a first electrode having a first outer lead portion and disposed in the bottom portion; a second electrode having a second outer lead portion and disposed in the bottom portion; and a first resin fixing the first electrode and the second electrode and constituting a part of the bottomed recess. The first resin has: a part between the first electrode and the second electrode disposed in the bottom portion; a wall portion constituting side walls of the bottomed recess; and a flange portion having a first part located adjacent to at least one of both sides of the first outer lead portion in plan view. The first part has a thickness different from a thickness of the first outer lead portion. A light emitting has: the package; and a light emitting element mounted on at least one of the first electrode and the second electrode of the package.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: November 26, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Mayumi Fukuda, Tomohisa Kishimoto
  • Patent number: 10466537
    Abstract: A base has a base surface. Light emitting elements are disposed on the base surface along an X-axis with an X pitch and along the Y axis with a Y pitch to form a matrix. The X pitch is smaller than the Y pitch. Lenses has a batwing illumination distribution. Each of the lenses covers each of the light emitting elements. A first lenticular lens sheet is provided on the base such that a first lenticular lens sheet lower surface is opposite to the base surface. A second lenticular lens sheet is provided on the first lenticular lens sheet such that a second lenticular lens sheet lower surface is opposite to a first lenticular lens sheet upper surface. A third lenticular lens sheet is provided on the second lenticular lens sheet such that a third lenticular lens sheet lower surface is opposite to a second lenticular lens sheet upper surface.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: November 5, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Kazuhiro Kamada, Yusaku Achi, Tomohisa Kishimoto, Satoshi Yoshinaga
  • Patent number: 10431725
    Abstract: A light emitting device includes: a package forming a recess, having a first lead and a second lead arranged on a bottom surface of the recess and a resin section on a lateralwall of the recess to fix the leads, and being in a substantially rectangular shape surrounded by upper sides of the lateralwalls of the recess; a light emitting element arranged on the first lead and being in a parallelogram shape; a second wire electrically connecting the light emitting element to the second lead; and reflective members covering inner surfaces of the lateralwalls on a diagonal line at corners in the recess, wherein one side of the light emitting element adjacent to the second lead is substantially in parallel to one side of the first lead or the second lead.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: October 1, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Masaki Hayashi, Tomohisa Kishimoto
  • Publication number: 20190294006
    Abstract: A base has a base surface. Light emitting elements are disposed on the base surface along an X-axis with an X pitch and along the Y axis with a Y pitch to form a matrix. The X pitch is smaller than the Y pitch. Lenses has a batwing illumination distribution. Each of the lenses covers each of the light emitting elements. A first lenticular lens sheet is provided on the base such that a first lenticular lens sheet lower surface is opposite to the base surface. A second lenticular lens sheet is provided on the first lenticular lens sheet such that a second lenticular lens sheet lower surface is opposite to a first lenticular lens sheet upper surface. A third lenticular lens sheet is provided on the second lenticular lens sheet such that a third lenticular lens sheet lower surface is opposite to a second lenticular lens sheet upper surface.
    Type: Application
    Filed: May 30, 2019
    Publication date: September 26, 2019
    Applicant: NICHIA CORPORATION
    Inventors: Kazuhiro KAMADA, Yusaku ACHI, Tomohisa KISHIMOTO, Satoshi YOSHINAGA
  • Publication number: 20190273188
    Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c.
    Type: Application
    Filed: March 18, 2019
    Publication date: September 5, 2019
    Applicant: NICHIA CORPORATION
    Inventors: Masafumi KURAMOTO, Tomohisa KISHIMOTO
  • Publication number: 20190237639
    Abstract: A light-emitting device includes: at least one light-emitting element; a first light-transmissive member covering the light-emitting element; a second light-transmissive member covering the first light-transmissive member; and a light-diffusing member in the second light-transmissive member. The light-diffusing member comprises hollow particles. The second light-transmissive member has a bottom surface having irregularities due to presence of the light-diffusing member.
    Type: Application
    Filed: January 30, 2019
    Publication date: August 1, 2019
    Applicant: NICHIA CORPORATION
    Inventors: Shoichi Kashihara, Masanobu Sato, Tomohisa Kishimoto
  • Patent number: 10345647
    Abstract: A base has a base surface. Light emitting elements are disposed on the base surface along an X-axis with an X pitch and along the Y axis with a Y pitch to form a matrix. The X pitch is smaller than the Y pitch. Lenses has a batwing illumination distribution. Each of the lenses covers each of the light emitting elements. A first lenticular lens sheet is provided on the base such that a first lenticular lens sheet lower surface is opposite to the base surface. A second lenticular lens sheet is provided on the first lenticular lens sheet such that a second lenticular lens sheet lower surface is opposite to a first lenticular lens sheet upper surface.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: July 9, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Kazuhiro Kamada, Yusaku Achi, Tomohisa Kishimoto, Satoshi Yoshinaga
  • Patent number: 10319889
    Abstract: A light emitting device includes a light emitting element having a light emitting surface from which the light emitting element is configured to emit a first light having a first peak wavelength. A light transform layer is provided on the light emitting surface to transform the first light to a second light having a second peak wavelength longer than the first peak wavelength. A light-transmissive layer is provided on the light transform layer and includes a first surface that has a substantially flat shape and that is opposite to the light emitting surface and a second surface connected to the first surface and having a curved shape to surround the light emitting element. A reflecting film is provided between the light transform layer and the light-transmissive layer to extend along the first surface and the second surface so as to reflect the first light and to transmit the second light.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: June 11, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Taiki Yuasa, Tomohisa Kishimoto
  • Patent number: 10263161
    Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: April 16, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Masafumi Kuramoto, Tomohisa Kishimoto
  • Publication number: 20190109265
    Abstract: A package includes a first electrode and a second electrode that are located at a bottom portion of a bottomed recess, and a first resin securing the first electrode and the second electrode in place and forming a part of the bottomed recess. The first electrode has a first outer lead having a first indentation at a tip in a plan view. The second electrode has a second outer lead having a second indentation at a tip in a plan view. The first resin has at least a portion between the first electrode and the second electrode located at the bottom portion of the bottomed recess, wall portions structuring lateral walls of the bottomed recess, and flange portions having the same thickness as a thickness of the first outer lead and different outward widths from the wall portions on both sides of the first outer lead in a plan view.
    Type: Application
    Filed: November 30, 2018
    Publication date: April 11, 2019
    Applicant: NICHIA CORPORATION
    Inventors: Mayumi FUKUDA, Tomohisa KISHIMOTO
  • Publication number: 20190103531
    Abstract: A method for manufacturing a package includes molding a precursor of a package including a cup-shaped resin component having a bottom surface and side walls, an opening opened at am upper part of the side walls, and a pair of leads exposed on the bottom surface. The side walls include a side wall that extends along the Y axis and the X axis and that has a first outer surface, and a side wall that extends along the Y axis and the Z axis. A thickness of the side wall extending along Y axis and the X axis is less than a thickness of the side wall extending along axis and the Z axis, The first outer surface has a recess which is recessed in the Z axis direction and arranged in a position corresponding to the opening. The method further includes forming a reflective film in the recess.
    Type: Application
    Filed: December 4, 2018
    Publication date: April 4, 2019
    Inventors: Koji ABE, Tomohisa KISHIMOTO