Patents by Inventor Tomohisa Ohta

Tomohisa Ohta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9250359
    Abstract: The object of the present invention is to prevent or suppress occurrences of uneven saponification and blocking, while improving cutting properties and dimensional stability. Specifically disclosed is a hard coat film (130) which comprises a protective film (114) for protecting a polarizer (112), and a hard coat layer (118) that is formed on the protective film (114). The sum of the thickness of the protective film (114) and the thickness of the hard coat layer (118) is less than 40 ?m, and the mixed region of the protective film (114) and the hard coat layer (118) is 1-20% of the thickness of the hard coat layer (118).
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: February 2, 2016
    Assignee: KONICA MINOLTA OPTO, INC.
    Inventor: Tomohisa Ohta
  • Publication number: 20120015169
    Abstract: The object of the present invention is to prevent or suppress occurrences of uneven saponification and blocking, while improving cutting properties and dimensional stability. Specifically disclosed is a hard coat film (130) which comprises a protective film (114) for protecting a polarizer (112), and a hard coat layer (118) that is formed on the protective film (114). The sum of the thickness of the protective film (114) and the thickness of the hard coat layer (118) is less than 40 ?m, and the mixed region of the protective film (114) and the hard coat layer (118) is 1-20% of the thickness of the hard coat layer (118).
    Type: Application
    Filed: February 12, 2010
    Publication date: January 19, 2012
    Applicant: KONICA MINOLTA OPTO, INC.
    Inventor: Tomohisa Ohta
  • Publication number: 20080219427
    Abstract: An information terminal includes a microprocessor for gathering a plurality of information sets of a user, with the user being a communication partner, and the information set including an identification tag for specifying the communication partner, communication service information corresponding to a specific communication service among a plurality of communication services and contact information of the communication partner, and a storage device for storing the plurality of information sets.
    Type: Application
    Filed: March 7, 2008
    Publication date: September 11, 2008
    Inventors: Norihiko NAONO, Tomohisa Ohta
  • Patent number: 7041429
    Abstract: Disclosed are a light sensitive composition comprising an addition polymerizable ethylenically unsaturated monomer, a photopolymerization initiator and a polymer binder, and a light sensitive planographic printing plate material comprising a hydrophilic support, and provided thereon, the light sensitive composition, wherein the photopolymerization initiator is a trihalomethyl group-containing oxadiazole compound represented by the following formula 1 or 2,
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: May 9, 2006
    Assignee: Konica Minolta Holdings, Inc.
    Inventors: Tomohisa Ohta, Takaaki Kuroki
  • Patent number: 7009774
    Abstract: A component including a part having a concave and convex configuration for one of the enabling one of light convergence, light diffusion and light diffraction, being formed as a reflective film. The outline of the concave and convex configuration viewed from a right angle relative to a horizontal face has a half moon-shape, and a direction of a straight line part of the half moon-shape of each concave and convex configuration matches a direction of the horizontal face, and a plurality of the concave and convex configurations are combined.
    Type: Grant
    Filed: September 28, 2004
    Date of Patent: March 7, 2006
    Assignees: Hitachi, Ltd., Hitachi Chemical Co., Ltd.
    Inventors: Takehisa Yoshikawa, Yukio Maeda, Masato Taya, Tomohisa Ohta, Isao Ishizawa, Makoto Satoh
  • Patent number: 6898015
    Abstract: A microlens array having a substrate and microlenses of a substantially circular profile provided on the substrate and each arranged such that a major axis and a minor axis thereof, which pass through a center of the substantially circular profile and intersect at 90 degrees, are substantially equal in length to each other, and sectional forms at faces vertical to an axis parallel to the major axis or the minor axis are, respectively, made of the same curved shape at any position.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: May 24, 2005
    Assignees: Hitachi, Ltd., Hitachi Chemical Company, Ltd.
    Inventors: Takehisa Yoshikawa, Yukio Maeda, Masato Taya, Tomohisa Ohta, Isao Ishizawa, Makoto Satoh
  • Publication number: 20050041295
    Abstract: A component including a part having a concave and convex configuration for one of the enabling one of light convergence, light diffusion and light diffraction, being formed as a reflective film. The outline of the concave and convex configuration viewed from a right angle relative to a horizontal face has a half moon-shape, and a direction of a straight line part of the half moon-shape of each concave and convex configuration matches a direction of the horizontal face, and a plurality of the concave and convex configurations are combined.
    Type: Application
    Filed: September 28, 2004
    Publication date: February 24, 2005
    Inventors: Takehisa Yoshikawa, Yukio Maeda, Masato Taya, Tomohisa Ohta, Isao Ishizawa, Makoto Satoh
  • Publication number: 20040191691
    Abstract: Disclosed are a light sensitive composition comprising an addition polymerizable ethylenically unsaturated monomer, a photopolymerization initiator and a polymer binder, and a light sensitive planographic printing plate material comprising a hydrophilic support, and provided thereon, the light sensitive composition, wherein the photopolymerization initiator is a trihalomethyl group-containing oxadiazole compound represented by the following formula 1 or 2, 1
    Type: Application
    Filed: January 30, 2004
    Publication date: September 30, 2004
    Applicant: Konica Minolta Holdings, Inc.
    Inventors: Tomohisa Ohta, Takaaki Kuroki
  • Publication number: 20040061946
    Abstract: A microlens configuration having a substantially circular form is constituted of a part of one circle or aspheric curve at any section when a section is taken at a face which is vertical to a major axis or a minor axis of the microlens configuration. A laminate for transfer includes a concave and convex pattern having concave and convex forms of a transfer master pattern, in which a number of such configurations as mentioned above are arranged, transferred to a substrate to be transferred, and a thin film layer laminated on the concave and convex surface thereof wherein a surface of the thin film layer opposite to a surface in contact with a provisional support is used as a bonding face to an application substrate.
    Type: Application
    Filed: September 26, 2003
    Publication date: April 1, 2004
    Inventors: Takehisa Yoshikawa, Yukio Maeda, Masato Taya, Tomohisa Ohta, Isao Ishizawa, Makoto Satoh
  • Patent number: 6667144
    Abstract: A laser-induced thermal transfer ink sheet for forming a transfer image, comprising a support having thereon a light-to-heat converting layer containing a light-to-heat converting compound, an interlayer containing a resin, and an ink layer in that order, wherein the light-to-heat converting compound and the resin satisfy one of the following requirements (a) and (b); (a) the light-to-heat converting compound is soluble in an organic solvent and the resin is soluble in water; and (b) the light-to-heat converting compound is soluble in water and the resin is soluble in an organic solvent.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: December 23, 2003
    Assignee: Konica Corporation
    Inventors: Katsumi Maejima, Tomohisa Ohta, Taro Konuma, Tatsuichi Maehashi
  • Patent number: 6654176
    Abstract: A microlens configuration having a substantially circular form is constituted of a part of one circle or aspheric curve at any section when a section is taken at a face which is vertical to a major axis or a minor axis of the microlens configuration. A laminate for transfer includes a concave and convex pattern having concave and convex forms of a transfer master pattern, in which a number of such configurations as mentioned above are arranged, transferred to a substrate to be transferred, and a thin film layer laminated on the concave and convex surface thereof wherein a surface of the thin film layer opposite to a surface in contact with a provisional support is used as a bonding face to an application substrate.
    Type: Grant
    Filed: July 17, 2002
    Date of Patent: November 25, 2003
    Assignees: Hitachi, Ltd., Hitachi Chemical Co., Ltd.
    Inventors: Takehisa Yoshikawa, Yukio Maeda, Masato Taya, Tomohisa Ohta, Isao Ishizawa, Makoto Satoh
  • Publication number: 20030039035
    Abstract: A microlens configuration having a substantially circular form is constituted of a part of one circle or aspheric curve at any section when a section is taken at a face which is vertical to a major axis or a minor axis of the microlens configuration. A laminate for transfer includes a concave and convex pattern having concave and convex forms of a transfer master pattern, in which a number of such configurations as mentioned above are arranged, transferred to a substrate to be transferred, and a thin film layer laminated on the concave and convex surface thereof wherein a surface of the thin film layer opposite to a surface in contact with a provisional support is used as a bonding face to an application substrate.
    Type: Application
    Filed: July 17, 2002
    Publication date: February 27, 2003
    Inventors: Takehisa Yoshikawa, Yukio Maeda, Masato Taya, Tomohisa Ohta, Isao Ishizawa, Makoto Satoh
  • Publication number: 20020192588
    Abstract: A laser-induced thermal transfer ink sheet for forming a transfer image, comprising a support having thereon a light-to-heat converting layer containing a light-to-heat converting compound, an interlayer containing a resin, and an ink layer in that order, wherein the light-to-heat converting compound and the resin satisfy one of the following requirements (a) and (b);
    Type: Application
    Filed: February 20, 2002
    Publication date: December 19, 2002
    Inventors: Katsumi Maejima, Tomohisa Ohta, Taro Konuma, Tatsuichi Maehashi
  • Patent number: 6338195
    Abstract: A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer containing a first adhesive having an insulating property and a second adhesive layer containing a second adhesive having an insulating property and a conductive material and placed at least on one side of the first adhesive layer. At the same time of electrode connection, the second adhesive molten has a viscosity equal to or lower than that of the first adhesive when molten. When the electrodes are connected with this structure, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, and part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes.
    Type: Grant
    Filed: December 27, 1999
    Date of Patent: January 15, 2002
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Isao Tsukagoshi, Yukihisa Hirosawa, Kouji Kobayashi, Tomohisa Ohta, Hiroshi Matsuoka, Itsuo Watanabe, Kenzo Takemura, Naoyuki Shiozawa, Osamu Watanabe, Kazuyoshi Kojima
  • Patent number: 6223429
    Abstract: To provide a highly reliable semiconductor device structure that enables cost reduction in the production of packages, inclusive of the cost for chips, and may cause less changes in connection resistance even under conditions of a long-term environmental resistance test. In a semiconductor device comprising a semiconductor chip face-down bonded to a wiring board, it has a structure wherein projecting metal portions are provided at the opposing wiring board terminals without forming bumps on bonding pads of the chip, the whole chip surface is bonded with an organic, anisotropic conductive adhesive material, and the whole or at least an edge of the back of the chip is covered with a sealing material.
    Type: Grant
    Filed: July 30, 1998
    Date of Patent: May 1, 2001
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Aizou Kaneda, Masaaki Yasuda, Itsuo Watanabe, Tomohisa Ohta, Fumio Inoue, Yoshiaki Tsubomatsu, Toshio Yamazaki, Hiroto Ohata, Kenzo Takemura, Akira Nagai, Osamu Watanabe, Naoyuki Shiozawa, Kazuyoshi Kojima, Toshiaki Tanaka, Kazunori Yamamoto
  • Patent number: 6042894
    Abstract: An isotropically electroconductive resin film material produced by sticking electroconductive particles to a sticking layer formed on a support and fixing therein, and filling a film-forming resin incompatible with the sticking material among the electroconductive particles, has electroconductivity only in the film thickness direction via the electroconductive particles uniformly dispersed in the plane direction, and is suitable for electrically connecting oppositely placed circuits and fine electrodes of a plurality of electronic parts, and for testing electronic parts.
    Type: Grant
    Filed: July 9, 1997
    Date of Patent: March 28, 2000
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yasushi Goto, Isao Tsukagoshi, Tomohisa Ohta
  • Patent number: 6034331
    Abstract: A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer containing a first adhesive having an insulating property and a second adhesive layer placed at least on one side of the first adhesive layer and containing a second adhesive having an insulating property and a conductive material, wherein at the time of electrode connection, the second adhesive molten has a viscosity equal to or lower than that of the first adhesive when molten. When the electrodes are connected with this structure, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, and part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes.
    Type: Grant
    Filed: July 23, 1996
    Date of Patent: March 7, 2000
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Isao Tsukagoshi, Yukihisa Hirosawa, Kouji Kobayashi, Tomohisa Ohta, Hiroshi Matsuoka, Itsuo Watanabe, Kenzo Takemura, Naoyuki Shiozawa, Osamu Watanabe, Kazuyoshi Kojima
  • Patent number: 5723253
    Abstract: Disclosed is a light-sensitive composition containing an o-quinonediazide compound, a novolak resin and a polymer,characterized in that the polymer contains a constitutional unit selected from the group consisting of constitutional units represented by the formulae (I), (II) and (III): ##STR1## wherein R.sup.1 to R.sup.12 each represent a hydrogen atom, an alkyl group or a phenyl group,and a lithographic printing plate using the same.
    Type: Grant
    Filed: December 4, 1995
    Date of Patent: March 3, 1998
    Assignees: Konica Corporation, Mitsubishi Chemical Corporation
    Inventors: Katuhiko Higashino, Tomohisa Ohta, Shinichi Matsubara
  • Patent number: 5155906
    Abstract: Circuit connections can be repaired with high accuracy and high reliability by peeling a mutually connected circuit portion to be repaired and placing a porous sheet with predetermined shape on the peeled circuit surface, impregnating the porous sheet with a peeling solution, removing the porous sheet containing unnecessary adhesive dissolved by the peeling solution, while cleaning the circuit surface contacted with the peeling solution, and reconnecting the cleaned circuit surface to a circuit surface to be connected via an adhesive.
    Type: Grant
    Filed: March 19, 1991
    Date of Patent: October 20, 1992
    Assignee: Hitachi Chemical, Ltd.
    Inventors: Yasushi Goto, Atsuo Nakajima, Isao Tsukagoshi, Tomohisa Ohta, Yutaka Yamaguchi
  • Patent number: 4985471
    Abstract: A radiation curable pressure sensitive adhesive composition comprising:(A) 100 parts by weight of a hydrogenated polybutadiene liquid oligomer which has one or more ethylenically unsaturated terminal radicals in its molecule and in which 70% or more of intramolecular carbon-carbon double bonds has been hydrogenated;(B) from 0.2 to 20 parts by weight of a chain transfer agent; and(C) from 0.001 to 1.0 parts by weight of a thermal polymerization inhibitor selected from metal complexes of N-nitrosophenylhydroxylamine;has an excellent storage stability and curing property and can provide pressure sensitive adhesive tapes which have excellent heat resistance and weatherability and are suitably used as surface protecting films.
    Type: Grant
    Filed: April 19, 1988
    Date of Patent: January 15, 1991
    Assignee: Hitachi Chemical Company Ltd.
    Inventors: Tomohisa Ohta, Hiroyuki Hagiwara, Hisashige Kanbara, Akihiko Dobashi, Yasuyuki Seki