Abstract: A component confirmation device images components arranged in a pallet before the components are picked up to confirm the components based on a captured image of the components. A pick-and-place cycle is defined as a cycle from when a mounting head configured to pick up and mount a component on a board starts picking up a target component that is at least one of the components that the mounting head picks up at one time until when the mounting head mounts the target component on the board. At this time, the component confirmation device includes a moving section configured to move target equipment that is a first one of a lighting device configured to illuminate the target component and the pallet, relative to a second one of the lighting device and the pallet as required every pick-and-place cycle, in imaging of the target component.

Abstract: A correction amount calculation device includes a first acquisition section and a correction amount calculation section. The first acquisition section is configured to acquire a first positional deviation amount, which is a positional deviation amount of a printing position detected by a printing inspection machine with respect to a pad position, and a second positional deviation amount, which is a positional deviation amount of a mounting position detected by a appearance inspection machine with respect to the pad position. The correction amount calculation section is configured to, based on the first positional deviation amount and the second positional deviation amount, calculate a correction amount, which is used in the mounting process of a board product to be produced later, regarding a third positional deviation amount, which is a positional deviation amount of the mounting position with respect to the printing position.

Abstract: A correction amount calculation device includes a first acquisition section and a correction amount calculation section. The first acquisition section is configured to acquire a first positional deviation amount, which is a positional deviation amount of a printing position detected by a printing inspection machine with respect to a pad position, and a second positional deviation amount, which is a positional deviation amount of a mounting position detected by a appearance inspection machine with respect to the pad position. The correction amount calculation section is configured to, based on the first positional deviation amount and the second positional deviation amount, calculate a correction amount, which is used in the mounting process of a board product to be produced later, regarding a third positional deviation amount, which is a positional deviation amount of the mounting position with respect to the printing position.

Abstract: A correction amount calculation device includes a selection section and a correction amount calculation section. The selection section is configured to select a target component in which a movement amount of the component on a board before and after being conveyed to a reflow furnace is equal to or less than a predetermined allowable value. The correction amount calculation section is configured to calculate a correction amount, which is used in a mounting process of a board product to be produced later, regarding a positional deviation amount of the mounting position of the target component selected by the selection section with respect to a target mounting position.

Abstract: The management device includes a display section configured to display information to a user, an input section configured to receive an instruction inputted by the user, an acquisition section configured to acquire information from a mounting-related device via a network, an output section configured to output information to the mounting-related device via the network, and a management control section configured to cause the display section to display device stoppage information when the acquisition section acquires device stoppage information indicating that the device has stopped based on an error of the mounting-related processing section configured to stop the device after counting a predetermined count number; and the management control section causes the output section to output a command to resume the mounting-related process and a command to reset the error count to the stopped mounting-related device when a command to resume execution is received from the input section.

Abstract: A control device of an electronic mounting machine that controls an operation of a mounting head when an electronic component is mounted on a printed circuit board including multiple divided boards by using the mounting head having multiple suction nozzles; sets some of the multiple divided boards within the printed circuit board as one group based on positions of the multiple suction nozzles and positions of the multiple divided boards within the printed circuit board; and controls the multiple suction nozzles to mount the electronic components on the some of the divided boards within the one group at a same time.

Abstract: A production management device includes data management section having multiple correspondence data in which component types are linked to each product type of board product with reference codes, and process setting section for selecting, when circuit board is carried into component mounting machine in a family production, a product type for each of multiple unit boards based on identification information and sets the type of mounting process to be executed for each of multiple unit boards by selecting correspondence data for the selected product type.

Abstract: The management device includes a display section configured to display information to a user, an input section configured to receive an instruction inputted by the user, an acquisition section configured to acquire information from a mounting-related device via a network, an output section configured to output information to the mounting-related device via the network, and a management control section configured to cause the display section to display device stoppage information when the acquisition section acquires device stoppage information indicating that the device has stopped based on an error of the mounting-related processing section configured to stop the device after counting a predetermined count number; and the management control section causes the output section to output a command to resume the mounting-related process and a command to reset the error count to the stopped mounting-related device when a command to resume execution is received from the input section.

Abstract: A component mounting method for using a component mounting tool which includes a plurality of claw sections that pinch and pick up a component at a component supply position, and release the component on a board to mount the component onto a predetermined position of the board, and which is mounted to be capable of moving between the component supply position and the board, includes determining pinching locations of the component to be pinched by the plurality of claw sections such that positions and a release operation of the plurality of claw sections do not interfere with mounted components which are already mounted on the board when the plurality of claw sections release the component.

Abstract: A production management device includes data management section having multiple correspondence data in which component types are linked to each product type of board product with reference codes, and process setting section for selecting, when circuit board is carried into component mounting machine in a family production, a product type for each of multiple unit boards based on identification information and sets the type of mounting process to be executed for each of multiple unit boards by selecting correspondence data for the selected product type.

Abstract: A method using an electronic circuit component mounter including a circuit substrate conveying and holding device, and a bulk feeder that is a head-side feeder which can be moved to any position on a plane inside the mounter. An electronic circuit component mounting system including a control device that performs control such that that the component holding tool positioned at a component pickup position for a component supplied from the head-side feeder and an electronic component contact each other, and the electronic circuit component and the head-side feeder contact each other during contact between the component holding tool positioned at a component mounting position and an electronic circuit component and during contact between the electronic circuit component and the circuit substrate.

Abstract: The control device controls an operation of a mounting head of an electronic component mounting machine. The control device is used when an electronic component is mounted on a printed circuit board including multiple divided boards by using the mounting head having multiple suction nozzles. In the control device, some of the multiple divided boards within the printed circuit board are set as one group based on positions of the multiple suction nozzles and positions of the multiple divided boards within the printed circuit board. In addition, in the control device, the multiple suction nozzles suck the electronic components to be mounted on the divided board within one group at the same time.

Abstract: A component mounting method for using a component mounting tool which includes a plurality of claw sections that pinch and pick up a component at a component supply position, and release the component on a board to mount the component onto a predetermined position of the board, and which is mounted to be capable of moving between the component supply position and the board, includes determining pinching locations of the component to be pinched by the plurality of claw sections such that positions and a release operation of the plurality of claw sections do not interfere with mounted components which are already mounted on the board when the plurality of claw sections release the component.

Abstract: A method using an electronic circuit component mounter including a circuit substrate conveying and holding device, and a bulk feeder that is a head-side feeder which can be moved to any position on a plane inside the mounter. An electronic circuit component mounting system including a control device that performs control such that that the component holding tool positioned at a component pickup position for a component supplied from the head-side feeder and an electronic component contact each other, and the electronic circuit component and the head-side feeder contact each other during contact between the component holding tool positioned at a component mounting position and an electronic circuit component and during contact between the electronic circuit component and the circuit substrate.