Abstract: The re-peelable pressure-sensitive adhesive sheet of the invention is a re-peelable pressure-sensitive adhesive sheet, which comprises an adhesive layer formed over a base film, and which further comprises at least one intermediate layer between the base film and the adhesive layer, the intermediate layer having a storage elastic modulus (G?) of 3.0×104 to 1.0×108 Pa at 23° C. and a storage elastic modulus (G?) of 1.0×103 to 8.0×104 Pa at 200° C.

Abstract: The present invention relates to a pressure-sensitive adhesive sheet for dicing comprising a substrate layer and an active energy ray-curable pressure-sensitive adhesive layer provided on the substrate layer, in which the active energy ray-curable pressure-sensitive adhesive layer has a gel fraction before irradiation with an active energy ray of 50% or more. Furthermore, the invention also provides a method for dicing an adherend, which comprises attaching the pressure-sensitive adhesive sheet for dicing to an adherend, followed by cutting the adherend using a round blade. The pressure-sensitive adhesive sheet for dicing of the invention is free from leaving any adhesive residue on chips, from peeling of the pressure-sensitive adhesive sheet from the ring for fixing it, as well as from leaving any paste residue on the ring.

Abstract: Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.

Abstract: The present invention provides an adhesive sheet for water jet laser dicing, comprising an adhesive layer laminated on a base film, wherein the base film is composed of mesh formed by a fiber. According to the adhesive sheet for water jet laser dicing in the present invention, a film composed of mesh is used as the base film to ensure that the perforation size and opening area are relatively larger than in nonwoven fabric and perforated sheets, thus making it possible to maintain stable permeability to liquids originating in the liquid stream during water jet laser dicing and to provide an adhesive sheet that allows extremely thin semiconductor wafers or materials to be processed while preventing die fly-off or defects such as cracking and chipping in IC components, chips, or the like.

Abstract: The present invention relates to a removable pressure-sensitive adhesive composition containing an acrylic polymer, a photopolymerization initiator and a crosslinking agent, in which the acrylic polymer and the photopolymerization initiator each are chemically bonded to the crosslinking agent. The present invention also relates to a removable pressure-sensitive adhesive composition containing an acrylic polymer and a photopolymerization initiator, the composition further containing a crosslinking agent having a reactive functional group which is capable of reacting with a reactive functional group of the acrylic polymer and a reactive functional group of the photopolymerization initiator.

Abstract: The present invention provides an adhesive sheet for water jet laser dicing, comprising an adhesive layer laminated on a base film which has a mean opening diameter of 5 ?m to 30 ?m. According to the adhesive sheet of the invention, a base film having a mean opening diameter of a certain size is used, thus ensuring better permeability to liquids originating in a liquid stream, and preventing the material that is being processed from being separated by the liquids from the adhesive sheet. In addition, the relatively low mean opening diameter makes it possible to control rippling on the surface of the base film and kept the surface flat, resulting in better adhesion to the material being processed and ensuring that the material being processed is secured during the dicing stage.

Abstract: The present invention relates to a heat-resistant dicing tape or sheet, which includes a substrate having a glass transition temperature of 70° C. or higher; and at least one pressure-sensitive adhesive layer disposed on at least one side of the substrate, the pressure-sensitive adhesive layer having a degree of weight loss upon heating of less than 2% when the pressure-sensitive adhesive layer is heated from room temperature to 200° C. at a rate of temperature increase of 2° C./min, in which the pressure-sensitive adhesive layer has an adhesive force (peel rate: 300 mm/min; peel angle: 180°) of 0.5 N/20 mm or lower when the heat-resistant dicing tape or sheet is applied to a silicon mirror wafer, is subsequently heated at 200° C. for 30 seconds, and is then cooled to 23° C.

Abstract: An adhesive sheet for laser processing comprises an adhesive layer laminated on the surface of a base film, wherein the base film has a textured contact-reducing layer on the back side thereof. According to the adhesive sheet for laser processing of the present invention, the melting of the base film caused by the local concentration of laser beam energy at the places irradiated with the laser beam can be effectively prevented. Accordingly, the back side of the base film can be prevented from locally adhering to the processing table in the dicing apparatus, and subsequent steps, namely, drawing the base film to separate the workpiece from the adhesive layer, and individually recovering these, can be carried out easily and efficiently.

Abstract: An adhesive sheet for water jet laser dicing, comprises an adhesive layer laminated on a base film, wherein the adhesive constituting the adhesive layer is an energy radiation curing type adhesive, and said adhesive sheet has an adhesive strength of at least 1.5 N/20 mm.

Abstract: An adhesive sheet for water jet laser dicing, comprises an adhesive layer laminated on a base film, wherein the adhesive sheet has perforations, has a porosity of 3 to 90% and has a fracture elongation of at least 100%.

Abstract: An adhesive sheet for laser processing, comprises a base film and an adhesive layer laminated on the surface of the base film, wherein the base film has a melting protection layer on the back side thereof. According to the adhesive sheet for laser processing of the present invention, the melting of the base film caused by the local concentration of laser beam energy at the places irradiated with the laser beam can be effectively prevented. Accordingly, the back side of the base film can be prevented from locally adhering to the processing table in the dicing apparatus, and subsequent steps, namely, drawing the base film to separate the workpiece from the adhesive layer, and individually recovering these, can be carried out easily and efficiently.

Abstract: Provided is a method for working an object which includes sticking the object fixed onto a supporting plate through a double faced pressure-sensitive adhesive sheet having a heat-peelable or radial ray curable pressure-sensitive adhesive layer onto a dicing adhesive tape, heating the double faced pressure-sensitive adhesive sheet or irradiating the double faced pressure-sensitive adhesive sheet, thereby removing the double faced pressure-sensitive adhesive sheet and the supporting plate from the object, dicing the object, on which the dicing pressure-sensitive adhesive sheet is stuck, and picking up a piece of the object, wherein the dicing pressure-sensitive adhesive sheet contains a substrate film and a pressure-sensitive adhesive layer formed over the film wherein the pressure-sensitive adhesive layer contains an acrylic polymer containing 5% or more by weight of a monomer having, in its side chain, an alkoxyl group, and the thickness of the pressure-sensitive adhesive layer is 1 to 50 ?m.

Abstract: The present invention relates to a pressure-sensitive adhesive tape or sheet for dicing which is to be applied to an active surface in the state of being not wholly covered with a native oxide film. The adhesive tape or sheet includes a substrate, and a radiation-curable pressure-sensitive adhesive layer disposed on at least one side of the substrate, in which the pressure-sensitive adhesive layer contains an acrylic polymer (A) having a weight-average molecular weight of 500,000 or higher and at least one radiation-polymerizable compound (B) selected from cyanurate compounds having one or more groups containing a carbon-carbon double bond and isocyanurate compounds having one or more groups containing a carbon-carbon double bond, and the ratio of the radiation-polymerizable compound (B) with respect to 100 parts by weight of the acrylic polymer (A) is 5 to 150 parts by weight.

Abstract: A laser processing protection sheet (2) capable of effectively preventing contamination on the surface of an article to be processed by decomposition products when the article to be processed (1) is processed by the UV absorption ablation of a laser beam (7). A production method for a laser processed article (10) using the laser. processing protection sheet (2). The laser processing protection sheet (2) is provided on the laser beam incident surface side of the article to be processed (1) when the article (1) is processed by the UV absorption ablation of the laser beam (7).

Abstract: In order to produce high quality final products cheaply using a large-scale production chains, not just the production being performed in the present production unit, but also parts supplies chains must be rational and without waste or overburdening. However, there is presently no means for discovering whether parts supplies chains are irrational, without waste or overburdening, or are rational and without waste or overburdening. A hierarchical tree table of product-parts lists of multi-stages may be displayed with at least one item of parts supply information, this being selected out of production unit of the parts, number of parts, lead time of the parts, cost of the parts, etc. The retrieved parts supply information is displayed in a manner allowing it to be distinguished from other items of parts supply information. The method of retrieval can be set as desired. The entirety of the parts supplies chains is displayed graphically, and the location where the problems exist becomes clear.

Abstract: According to the invention, a pressure-sensitive adhesive sheet for use in dicing of a workpiece is provided which comprises a base film and at least a pressure-sensitive adhesive layer provided on the base film, wherein the pressure-sensitive adhesive layer comprises an acrylic polymer that contains at least 5% by weight of a monomer unit having an alkoxyl group in its side chain. According to the structure, there are provided a pressure-sensitive adhesive sheet for dicing that can produce good pickup performance even after a long time and a method of picking up a product worked with the pressure-sensitive adhesive sheet.

Abstract: A manufacturing method of laser processed parts is characterized in that at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet (2) for laser processing, using a material having specified physical properties, and this method comprises a step of adhering the pressure-sensitive adhesive sheet (2) for laser processing to the laser beam exit side of the work (1) by way of the pressure-sensitive adhesive layer, a step of processing the work by irradiating the work with a laser beam (6) of within 2 times of the irradiation intensity for forming a through-hole in the work (1), at higher than the irradiation intensity of threshold for inducing ablation of the work (1), and a step of peeling the pressure-sensitive adhesive sheet (2) for laser processing from the work (1) after the machining.

Abstract: In order to produce high quality final products cheaply using a large-scale production chains, not just the production being performed in the present production unit, but also parts supplies chains must be rational and without waste or overburdening. However, there is presently no means for discovering whether parts supplies chains are irrational, without waste or overburdening, or are rational and without waste or overburdening. A hierarchical tree table of product-parts lists of multi-stages may be displayed with at least one item of parts supply information, this being selected out of production unit of the parts, number of parts, lead time of the parts, cost of the parts, etc. The retrieved parts supply information is displayed in a manner allowing it to be distinguished from other items of parts supply information. The method of retrieval can be set as desired. The entirety of the parts supplies chains is displayed graphically, and the location where the problems exist becomes clear.

Abstract: Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.

Abstract: The re-peelable pressure-sensitive adhesive sheet of the invention is a re-peelable pressure-sensitive adhesive sheet, which comprises an adhesive agent layer formed over a base film, and which further comprises at least one intermediate layer between the base film and the adhesive agent layer, the intermediate layer having a storage elastic modulus (G?) of 3.0×104 to 1.0×108 Pa at 23° C. and a storage elastic modulus (G?) of 1.0×103 to 8.0×104 Pa at 200° C. Even when this re-peelable pressure-sensitive adhesive sheet and a semiconductor wafer are adhered to each other and they are placed, as they are, in a heating environment, the wafer can be prevented from being warped.