Patents by Inventor Tomomi Okumura

Tomomi Okumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210217680
    Abstract: A semiconductor device incudes: a semiconductor chip that includes an active area and an outer peripheral area surrounding the active area; a metal member that includes one face including a mounting portion on which the semiconductor chip is mounted and a peripheral member surrounding the mounting portion; a joining member that connects the semiconductor chip and the metal member; and a sealing resin body. The metal member includes, as the peripheral portion, an adhesive portion that surrounds the mounting portion and adheres to the sealing resin body, and a non-adhesive portion that is placed between the mounting portion and the adhesive portion. An entire width is placed in an area overlapping the semiconductor chip in a projection view in a thickness direction of the semiconductor chip.
    Type: Application
    Filed: March 26, 2021
    Publication date: July 15, 2021
    Inventors: Masanori OOSHIMA, Tomomi OKUMURA, Takahiro HIRANO
  • Patent number: 10943859
    Abstract: The present disclosure describes a semiconductor device including: a semiconductor chip having an electrode; a conductive member including a metal base and having a mounting portion and a peripheral portion surrounding the mounting portion; a solder that is provided between the electrode and the mounting portion; and a sealing resin body that integrally seals the semiconductor chip, at least the face opposed to the electrode in the conductive member, and the solder.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: March 9, 2021
    Assignee: DENSO CORPORATION
    Inventors: Eiji Hayashi, Ryoji Uwataki, Tomomi Okumura
  • Publication number: 20190355656
    Abstract: The present disclosure describes a semiconductor device including: a semiconductor chip having an electrode; a conductive member including a metal base and having a mounting portion and a peripheral portion surrounding the mounting portion; a solder that is provided between the electrode and the mounting portion; and a sealing resin body that integrally seals the semiconductor chip, at least the face opposed to the electrode in the conductive member, and the solder.
    Type: Application
    Filed: July 31, 2019
    Publication date: November 21, 2019
    Inventors: Eiji HAYASHI, Ryoji UWATAKI, Tomomi OKUMURA
  • Patent number: 10304777
    Abstract: A semiconductor device includes an assembly configured such that a plurality of semiconductor modules is connected by a component. Each of the plurality of semiconductor modules includes a semiconductor element including a front-surface electrode fixing a front-surface electrode plate and a back-surface electrode fixing a back-surface electrode plate, wherein the component is either of a first component and a second component. The first component being configured to connect adjacent semiconductor modules to each other such that a front-surface electrode plate of one of the adjacent semiconductor modules is connected to a back-surface electrode plate of the other one of the adjacent semiconductor modules. The second component is configured to connect adjacent semiconductor modules such that respective front-surface electrode plates are connected and respective back-surface electrode plates are connected. The semiconductor modules are connected by the first component or the second component.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: May 28, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takashi Ueta, Tomomi Okumura
  • Publication number: 20190139874
    Abstract: A semiconductor device includes a first switching element; a second switching element; a first metal member; a second metal member; a first terminal that has a potential on a high potential side; a second terminal that has a potential on a low potential side; a third terminal that has a midpoint potential; and a resin part. A first potential part has potential equal to potential of the first terminal. A second potential part has potential equal to potential of the second terminal. A third potential part has potential equal to potential of the third terminal. A first creepage distance between the first potential part and the second potential part is longer than a minimum value of a second creepage distance between the first potential part and the third potential part and a third creepage distance between the second potential part and the third potential part.
    Type: Application
    Filed: January 4, 2019
    Publication date: May 9, 2019
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, DENSO CORPORATION
    Inventors: Takuya KADOGUCHI, Takahiro HIRANO, Arata HARADA, Tomomi OKUMURA, Keita FUKUTANI, Masayoshi NISHIHATA
  • Patent number: 10283429
    Abstract: A semiconductor device includes: a semiconductor element; a heat sink including a first surface and a second surface, the semiconductor element being joined to the first surface, the second surface being a surface on an opposite side of the first surface; and a package that is in contact with the semiconductor element and the first surface of the heat sink, the package including a recess portion in an outer face, wherein the heat sink includes a thick portion, and a thin portion having a thickness that is smaller than that of the thick portion, and the thin portion is located on a line connecting an outer face of the semiconductor element and the recess portion in a shortest distance.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: May 7, 2019
    Assignees: Toyota Jidosha Kabushiki Kaisha, Denso Corporation
    Inventors: Shingo Iwasaki, Tomomi Okumura
  • Patent number: 10157815
    Abstract: A semiconductor device includes: a sealing body that seals a first semiconductor element and a second semiconductor element; first heat-radiating members exposed at a front surface of the sealing body; second heat-radiating members exposed at a back surface of the sealing body; first signal terminals electrically connected to the first semiconductor element, and projecting from a top surface of the sealing body in a first direction; and second signal terminals electrically connected to the second semiconductor elements, and projecting from the top surface of the sealing body in the first direction. The top surface of the sealing body includes a first inclined surface, a second inclined surface, and a boundary line or a boundary range located therebetween. The boundary line or the boundary range includes at least part of a minimum creepage path between the first signal terminals and the second signal terminals.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: December 18, 2018
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Keita Hatasa, Makoto Imai, Tomomi Okumura
  • Patent number: 10103090
    Abstract: The semiconductor device includes a semiconductor element, and an electro-conductive first plate-like part electrically connected to a top-face-side electrode of the semiconductor element and including a first joint part projecting from a side face, and an electro-conductive second plate-like part including a second joint part projecting from a side face. A bottom face of the first joint part and a top face of the second joint part face one another, and are electrically connected via an electro-conductive bonding material. A bonding-material-thickness ensuring means is provided in a zone where the bottom face of the first joint part and the top face of the second joint part face one another to ensure a thickness of the electro-conductive bonding material between an upper portion of a front end of the second joint part and the bottom face of the first joint part.
    Type: Grant
    Filed: January 15, 2015
    Date of Patent: October 16, 2018
    Assignees: Toyota Jidosha Kabushiki Kaisha, Denso Corporation
    Inventors: Takuya Kadoguchi, Takahiro Hirano, Takanori Kawashima, Keita Fukutani, Tomomi Okumura, Masayoshi Nishihata
  • Patent number: 10026673
    Abstract: A semiconductor device of a double-side cooling structure having a bus bar electrically connected, and coolers independently arranged on both sides of the semiconductor device for cooling is provided. The semiconductor device includes: a semiconductor chip including an element, and has a first main surface and a second main surface; a sealing resin body having a first surface and a second surface and also having a side surface; a first heatsink arranged facing the first main surface and electrically connected to the first main electrode; and a second heatsink arranged facing the second main surface and electrically connected to the second main electrode. The first heatsink is exposed only to the first surface. The second heatsink is exposed only to the second surface. An exposed surface of a heatsink to be electrically connected to the bus bar has a heat dissipation region, and an electrical connection region.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: July 17, 2018
    Assignee: DENSO CORPORATION
    Inventor: Tomomi Okumura
  • Publication number: 20180174998
    Abstract: Method for manufacturing a semiconductor device includes: preparing a first subassembly in which an upper surface of the conductive spacer is soldered on the second conductive member and preliminary solder is provided on a lower surface of the conductive spacer; preparing a second subassembly in which the lower surface of the semiconductor element is soldered on the first conductive member and the bonding wire is joined on upper surface of the semiconductor element; and soldering the upper surface of the semiconductor element in the second subassembly on the lower surface of the conducive spacer in the first subassembly by melting the preliminary solder in the first subassembly
    Type: Application
    Filed: November 3, 2017
    Publication date: June 21, 2018
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kaisei SATO, Keita HATASA, Tomomi OKUMURA
  • Publication number: 20180130748
    Abstract: A semiconductor device includes an assembly configured such that a plurality of semiconductor modules is connected by a component. Each of the plurality of semiconductor modules includes a semiconductor element including a front-surface electrode fixing a front-surface electrode plate and a back-surface electrode fixing a back-surface electrode plate, wherein the component is either of a first component and a second component. The first component being configured to connect adjacent semiconductor modules to each other such that a front-surface electrode plate of one of the adjacent semiconductor modules is connected to a back-surface electrode plate of the other one of the adjacent semiconductor modules. The second component is configured to connect adjacent semiconductor modules such that respective front-surface electrode plates are connected and respective back-surface electrode plates are connected. The semiconductor modules are connected by the first component or the second component.
    Type: Application
    Filed: October 19, 2017
    Publication date: May 10, 2018
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takashi UETA, Tomomi OKUMURA
  • Patent number: 9960096
    Abstract: In a semiconductor device, a second heat sink and a third heat sink are electrically connected by a joint portion in an alignment direction in which a first switching element and a second switching element are aligned. A second power-supply terminal is disposed in the alignment direction in a region between a first power-supply terminal and an output terminal and between the second heat sink and the third heat sink. In an encapsulation resin body, at least one of a shortest distance between a first potential portion at same potential as the first power-supply terminal and a third potential portion at same potential as the output terminal and a shortest distance between a second potential portion at same potential as the second power-supply terminal and the third potential portion is shorter than a shortest distance between the first potential portion and the second potential portion.
    Type: Grant
    Filed: September 9, 2014
    Date of Patent: May 1, 2018
    Assignees: DENSO CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Tomomi Okumura, Takuya Kadoguchi
  • Patent number: 9831160
    Abstract: A semiconductor device includes: opposed first and second metal plates; a plurality of semiconductor elements each interposed between the first metal plate and the second metal plate; a metal block interposed between the first metal plate and each of the semiconductor elements; a solder member interposed between the first metal plate and the metal block and connecting the first metal plate to the metal block; and a resin molding sealing the semiconductor elements and the metal block. A face of the first metal plate, which is on an opposite side of a face of the first metal plate to which the metal block is connected via the solder member, is exposed from the resin molding. The first metal plate has a groove formed along an outer periphery of a region in which the solder member is provided, the groove collectively surrounding the solder member.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: November 28, 2017
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, DENSO CORPORATION
    Inventors: Takuya Kadoguchi, Takahiro Hirano, Takanori Kawashima, Tomomi Okumura, Masayoshi Nishihata
  • Publication number: 20170317006
    Abstract: A semiconductor device of a double-side cooling structure having a bus bar electrically connected, and coolers independently arranged on both sides of the semiconductor device for cooling is provided. The semiconductor device includes: a semiconductor chip including an element, and has a first main surface and a second main surface; a sealing resin body having a first surface and a second surface and also having a side surface; a first heatsink arranged facing the first main surface and electrically connected to the first main electrode; and a second heatsink arranged facing the second main surface and electrically connected to the second main electrode. The first heatsink is exposed only to the first surface. The second heatsink is exposed only to the second surface. An exposed surface of a heatsink to be electrically connected to the bus bar has a heat dissipation region, and an electrical connection region.
    Type: Application
    Filed: November 20, 2015
    Publication date: November 2, 2017
    Inventor: Tomomi OKUMURA
  • Publication number: 20170162462
    Abstract: A semiconductor device includes: a sealing body that seals a first semiconductor element and a second semiconductor element; first heat-radiating members exposed at a front surface of the sealing body; second heat-radiating members exposed at a back surface of the sealing body; first signal terminals electrically connected to the first semiconductor element, and projecting from a top surface of the sealing body in a first direction; and second signal terminals electrically connected to the second semiconductor elements, and projecting from the top surface of the sealing body in the first direction. The top surface of the sealing body includes a first inclined surface, a second inclined surface, and a boundary line or a boundary range located therebetween. The boundary line or the boundary range includes at least part of a minimum creepage path between the first signal terminals and the second signal terminals.
    Type: Application
    Filed: December 2, 2016
    Publication date: June 8, 2017
    Inventors: Keita Hatasa, Makoto Imai, Tomomi Okumura
  • Publication number: 20170117212
    Abstract: A semiconductor device includes: opposed first and second metal plates; a plurality of semiconductor elements each interposed between the first metal plate and the second metal plate; a metal block interposed between the first metal plate and each of the semiconductor elements; a solder member interposed between the first metal plate and the metal block and connecting the first metal plate to the metal block; and a resin molding sealing the semiconductor elements and the metal block. A face of the first metal plate, which is on an opposite side of a face of the first metal plate to which the metal block is connected via the solder member, is exposed from the resin molding. The first metal plate has a groove formed along an outer periphery of a region in which the solder member is provided, the groove collectively surrounding the solder member.
    Type: Application
    Filed: January 4, 2017
    Publication date: April 27, 2017
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, DENSO CORPORATION
    Inventors: Takuya KADOGUCHI, Takahiro HIRANO, Takanori KAWASHIMA, Tomomi OKUMURA, Masayoshi NISHIHATA
  • Publication number: 20170092559
    Abstract: A semiconductor device includes: a semiconductor element; a heat sink including a first surface and a second surface, the semiconductor element being joined to the first surface, the second surface being a surface on an opposite side of the first surface; and a package that is in contact with the semiconductor element and the first surface of the heat sink, the package including a recess portion in an outer face, wherein the heat sink includes a thick portion, and a thin portion having a thickness that is smaller than that of the thick portion, and the thin portion is located on a line connecting an outer face of the semiconductor element and the recess portion in a shortest distance.
    Type: Application
    Filed: September 23, 2016
    Publication date: March 30, 2017
    Inventors: Shingo Iwasaki, Tomomi Okumura
  • Publication number: 20170018484
    Abstract: The semiconductor device includes a semiconductor element, and an electro-conductive first plate-like part electrically connected to a top-face-side electrode of the semiconductor element and including a first joint part projecting from a side face, and an electro-conductive second plate-like part including a second joint part projecting from a side face. A bottom face of the first joint part and a top face of the second joint part face one another, and are electrically connected via an electro-conductive bonding material. A bonding-material-thickness ensuring means is provided in a zone where the bottom face of the first joint part and the top face of the second joint part face one another to ensure a thickness of the electro-conductive bonding material between an upper portion of a front end of the second joint part and the bottom face of the first joint part.
    Type: Application
    Filed: January 15, 2015
    Publication date: January 19, 2017
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, DENSO CORPORATION
    Inventors: Takuya KADOGUCHI, Takahiro HIRANO, Takanori KAWASHIMA, Keita FUKUTANI, Tomomi OKUMURA, Masayoshi NISHIHATA
  • Publication number: 20160343630
    Abstract: A semiconductor device includes a metal member, a semiconductor element, a resin part, a primer layer, and a peel-off restraining part. The metal member has a surface that includes a semiconductor element mounting region and a resin close contact region that extends from the semiconductor element mounting region to an outer peripheral edge of the metal member. The semiconductor element is mounted on the semiconductor element mounting region. The resin part extends to a position outside a side surface of the metal member, and closely contacts with the resin close contact region, and collectively covers the semiconductor element and the metal member. The primer layer is disposed between the resin close contact region and the resin part. The peel-off restraining part is configured to restrain the metal member and the resin part from peeling from each other in the outer peripheral part of the resin close contact region.
    Type: Application
    Filed: December 18, 2014
    Publication date: November 24, 2016
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takuya KADOGUCHI, Takahiro HIRANO, Masayoshi NISHIHATA, Keita FUKUTANI, Tomomi OKUMURA
  • Publication number: 20160322726
    Abstract: A terminal connecting structure includes: a male terminal; and a female terminal to which the male terminal is fitted. The male terminal includes a first metal material and a first metal film that is formed on an outermost surface of the male terminal to coat the first metal material directly or indirectly. The female terminal includes a second metal material and a second metal film that is formed on an outermost surface of the female terminal to coat the second metal material directly or indirectly. A hardness of the first metal material is different from a hardness of the second metal material.
    Type: Application
    Filed: December 30, 2014
    Publication date: November 3, 2016
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, DENSO CORPORATION
    Inventors: Takuya KADOGUCHI, Takahiro HIRANO, Arata HARADA, Tomomi OKUMURA, Keita FUKUTANI, Masayoshi NISHIHATA