Abstract: An electron emitting device includes an amorphous electron supply layer, an insulating layer formed on the electron supply layer, and an electrode formed on the insulating layer. The electron emits device emitting electrons when an electric field is applied between the electron supply layer and the electrode. The electron emitting device includes a concave portion provided by notching the electrode and the insulating layer to expose the electron supply layer, and a carbon layer covering the electrode and the concave portion except for an inner portion of an exposed surface 4a of the electron supply layer and being in contact with an edge portion of the exposed surface of the electron supply layer.

Abstract: [PROBLEMS] To provide an electron emitting layer with improved efficiency of electron emission and prevented damage of the device. [SOLVING MEANS] An electron emitting device including an amorphous electron supply layer 4, an insulating layer 5 formed on the electron supply layer 4, and an electrode 6 formed on the insulating layer 5, the electron emitting device emitting electrons when an electric field is applied between the electron supply layer 4 and the electrode 6, wherein the electron emitting device includes a concave portion 7 provided by notching the electrode 6 and the insulating layer 5 to expose the electron supply layer 4, and a carbon layer 8 covering the electrode 6 and the concave portion 7 except for an inner portion 4b of an exposed surface 4a of the electron supply layer 4 and being in contact with an edge portion 4c of the exposed surface 4a of the electron supply layer 4.

Abstract: Disclosed is a semiconductor device eliminated of the effect of an adhesive used in assembling upon the semiconductor chip. According to the semiconductor device, the semiconductor device includes a board, a semiconductor chip provided on and contacting with the board, and a plurality of wires each having both ends firmly fixed to a point close to a peripheral edge of the semiconductor chip and a point on the board close to a peripheral edge respectively. The semiconductor chip is fixed on the board by means of the wires.

Abstract: An electron emission device including a lower electrode on a near side to a substrate and an upper electrode on a far side to the substrate and an insulator layer and an electron supply layer stacked between the lower electrode and the upper electrode and emitting an electron from the upper electrode side at the time of applying a voltage between the lower electrode and the upper electrode, which includes an electron emission part provided with an opening formed by an inner wall of a stepped shape in which a thickness of the insulator layer decreases stepwise; and a carbon-containing carbon region which is connected to the upper electrode side and which is brought into contact with the insulator layer and the electron supply layer.

Abstract: An electron emitting device having a lower electrode on a side near to a substrate and an upper electrode on a side remote from the substrate respectively, formed of a plurality of electron emitting elements remitting electrons from a side of the upper electrode side, wherein space is formed between the electron emitting elements, and the upper electrode extends across the plurality of electron emitting elements and the space by a bridging portion of the upper electrode.