Abstract: A mirror die image recognition system configured to perform recognition of a mirror die without damage or a pattern that is the same quadrilateral shape as a production die having a pattern, in a manner that distinguishes the mirror die without damage or pattern from a mirror die with damage and from a production die, the mirror die image recognition system including a camera configured to image at least a portion of the wafer in a field of view; and an image processing device configured to process the image captured by the camera to recognize, from among each of the dies in the image, a mirror die without damage in a manner that distinguishes the mirror die without damage from other dies.

Abstract: A maintenance management device which individually manages maintenance times at which to perform maintenance using a plurality of constituent elements, which are equipped in an exchangeable manner to a plurality of equipment positions of a component mounting machine to operate, as management targets, and the maintenance management device includes a remaining operation number calculating section which calculates respective remaining operation numbers of each of the plurality of constituent elements, an operation frequency ascertaining section which ascertains respective operation frequencies of the constituent elements at the plurality of equipment positions according to a type of the board, and a guide section which performs guidance of equipment positions of the constituent elements based on the remaining operation number and the operation frequency when a worker equips the constituent elements.

Abstract: A mirror die image recognition system configured to perform recognition of a mirror die without damage or a pattern that is the same quadrilateral shape as a production die having a pattern, in a manner that distinguishes the mirror die without damage or pattern from a mirror die with damage and from a production die, the mirror die image recognition system including a camera configured to image at least a portion of the wafer in a field of view; and an image processing device configured to process the image captured by the camera to recognize, from among each of the dies in the image, a mirror die without damage in a manner that distinguishes the mirror die without damage from other dies.

Abstract: A magazine lifting and lowering section of a die supply apparatus houses a replaced magazine rack having different specifications. A code display portion marked with identification information (“a magazine rack ID”) for each magazine rack is provided in each magazine rack, and a magazine rack ID and specification data related to each magazine rack are associated with each other and are registered in a database of a host computer. When the magazine rack accommodating a wafer expander is housed in the magazine lifting and lowering section, the magazine rack ID is read from the code display portion of the magazine rack by using a reader such that specification data related to the magazine rack corresponding to the magazine rack ID is transmitted to the die supply apparatus, thereby controlling a lifting and lowering operation of the magazine rack performed by a lifting and lowering mechanism.

Abstract: A maintenance management device which individually manages maintenance times at which to perform maintenance using a plurality of constituent elements, which are equipped in an exchangeable manner to a plurality of equipment positions of a component mounting machine to operate, as management targets, and the maintenance management device includes a remaining operation number calculating section which calculates respective remaining operation numbers of each of the plurality of constituent elements, an operation frequency ascertaining section which ascertains respective operation frequencies of the constituent elements at the plurality of equipment positions according to a type of the board, and a guide section which performs guidance of equipment positions of the constituent elements based on the remaining operation number and the operation frequency when a worker equips the constituent elements.

Abstract: A magazine lifting and lowering section of a die supply apparatus houses a replaced magazine rack having different specifications. A code display portion marked with identification information (“a magazine rack ID”) for each magazine rack is provided in each magazine rack, and a magazine rack ID and specification data related to each magazine rack are associated with each other and are registered in a database of a host computer. When the magazine rack accommodating a wafer expander is housed in the magazine lifting and lowering section, the magazine rack ID is read from the code display portion of the magazine rack by using a reader such that specification data related to the magazine rack corresponding to the magazine rack ID is transmitted to the die supply apparatus, thereby controlling a lifting and lowering operation of the magazine rack performed by a lifting and lowering mechanism.