Patents by Inventor Tomonori Nakamura

Tomonori Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240077829
    Abstract: A foreign substance collection apparatus includes: a frame body; a photosensitive drum; a cleaning roller which collects foreign substances from a surface of the photosensitive drum; a collecting roller which further collects the foreign substances having been collected by the cleaning roller from the cleaning roller; and a scraping member which scrapes off the foreign substances from the collecting roller. A foreign substance collecting portion included in the frame body has, in a posture during use: a first inner bottom surface which is positioned below the scraping member in a gravity direction; an outer bottom surface which is positioned further below the first inner bottom surface; and a connecting surface which intersects the first inner bottom surface and the outer bottom surface and which connects the first inner bottom surface and the outer bottom surface with each other.
    Type: Application
    Filed: November 2, 2023
    Publication date: March 7, 2024
    Inventors: Noriyuki Komatsu, Tomonori Mori, Teruhiko Sasaki, Makoto Hayashida, Shunsuke Uratani, Yuuki Nakamura, Satoru Motohashi
  • Patent number: 11910534
    Abstract: A mounting device includes: an application part applying paste on a substrate to form an application body; a bonding part forming a mounted body by mounting a chip component on the substrate via the application body; a first imaging part imaging the application body after application processing and before mounting processing to acquire first image information; a second imaging part imaging the mounted body after the mounting processing to acquire second image information; and a control part controlling the application part, the bonding part, and the first and second imaging parts, and obtains a 3D application body shape (first shape) from the first image information as a first shape and calculates a 3D mounted body shape (second shape) from the second image information. The control part evaluates the application processing or the mounting processing based on the first and the second shapes.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: February 20, 2024
    Assignee: SHINKAWA LTD.
    Inventors: Tomonori Nakamura, Koji Matsushita, Hiroshi Omata, Masahito Tsuji, Keiichi Hiruma, Mitsuteru Sakamoto, Ryo Urahashi, Takaya Kinjo, Shota Nakano, Akira Sekikawa
  • Publication number: 20240012047
    Abstract: An inspection apparatus includes a light source that emits light, an optical amplifier that amplifies input light and outputs the amplified light, an optical system (an objective lens, an imaging optical system, and a scanning optical system) that irradiates a semiconductor device with the light from the light source and guides light from the semiconductor device to the optical amplifier, and a photodetector that detects the light output from the optical amplifier, and the optical amplifier amplifies the input light so that saturation does not occur.
    Type: Application
    Filed: June 25, 2021
    Publication date: January 11, 2024
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Tomonori NAKAMURA, Akihito UCHIKADO, Mitsunori NISHIZAWA
  • Patent number: 11841393
    Abstract: Provided is a cooling unit to be used in an inspection of a semiconductor device. The cooling unit includes a jacket for dissipating heat of the semiconductor device. The jacket is provided with a light passing portion for passing light from the semiconductor device. The jacket has a space defining surface that faces the semiconductor device and defines a space between the space defining surface and the semiconductor device in a state where the light passing portion faces the semiconductor device. The jacket is provided with a supply flow path through which a fluid to be supplied to the space flows.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: December 12, 2023
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Tomonori Nakamura, Hirotaka Nonaka, Hiroyuki Matsuura, Hirotoshi Terada
  • Publication number: 20230324520
    Abstract: A light source device includes a light source that generates continuous light, a retroreflective material that retroreflects a light beam from the light source, an optical system that guides the light beam from the light source to the retroreflective material and output the light beam retroreflected from the retroreflective material to the outside, and a modulation unit that is disposed in the optical system, changes an optical path length between the light source and the retroreflective material with time, and changes a wavelength of the light beam with time using a Doppler effect.
    Type: Application
    Filed: February 1, 2023
    Publication date: October 12, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Tomonori NAKAMURA, Kenichiro IKEMURA
  • Publication number: 20230324550
    Abstract: A device includes a signal generation unit that generates a first signal having a first repetition frequency and a second signal having a second repetition frequency higher than the first repetition frequency, a light source unit that generates light whose wavelength is modulated with time through internal modulation based on the first signal, a modulation unit that further modulates, with time, the wavelength of the light using a Doppler effect through external modulation based on the second signal, a splitting unit that divides the light output from the modulation unit into measurement light and reference light, an irradiation unit that irradiates a target object with the measurement light, a detection unit that detects interference light between reflected light from the target object and the reference light, and a calculation unit that calculates a distance to the target object on the basis of an output signal from the detection unit.
    Type: Application
    Filed: February 1, 2023
    Publication date: October 12, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Tomonori NAKAMURA, Kenichiro IKEMURA, Koji TAKAHASHI, Yasunori IGASAKI
  • Publication number: 20230289950
    Abstract: An inspection apparatus is an inspection apparatus includes an excitation light source that generates excitation light to irradiate the object, a dichroic mirror that separates fluorescence from the sample by transmitting or reflecting the fluorescence according to a wavelength, a camera that images fluorescence reflected by the dichroic mirror, a camera that images fluorescence transmitted through the dichroic mirror, and a control apparatus that derives color irregularity information of a light-emitting element based on a first fluorescence image acquired by the camera and a second fluorescence image acquired by the camera, and an edge shift width corresponding to a width of a wavelength band in which transmittance and reflectance change according to a change in wavelength in the dichroic mirror is wider than a full width at half maximum of a normal fluorescence spectrum of the light-emitting element.
    Type: Application
    Filed: May 18, 2023
    Publication date: September 14, 2023
    Applicant: HAMAMATSU PHOTONICS K. K.
    Inventors: Tomonori NAKAMURA, Kenichiro IKEMURA, Akihiro OTAKA
  • Patent number: 11714120
    Abstract: An inspection system includes a light source, a mirror, Galvano mirrors, a casing that holds the mirror and the Galvano mirrors inside and includes an attachment portion for attaching an optical element, and a control unit that controls a deflection angle of the Galvano mirrors, wherein the control unit controls the deflection angle so that an optical path optically connected to a semiconductor device is switched between a first optical path passing through the Galvano mirrors and the mirror, and a second optical path passing through the Galvano mirrors and the attachment portion, and controls the deflection angle so that the deflection angle when switching to the first optical path has been performed and the deflection angle when switching to the second optical path has been performed do not overlap.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: August 1, 2023
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Tomonori Nakamura, Yoshitaka Iwaki
  • Patent number: 11694324
    Abstract: An inspection apparatus is an inspection apparatus includes an excitation light source that generates excitation light to irradiate the object, a dichroic mirror that separates fluorescence from the sample by transmitting or reflecting the fluorescence according to a wavelength, a camera that images fluorescence reflected by the dichroic mirror, a camera that images fluorescence transmitted through the dichroic mirror, and a control apparatus that derives color irregularity information of a light-emitting element based on a first fluorescence image acquired by the camera and a second fluorescence image acquired by the camera, and an edge shift width corresponding to a width of a wavelength band in which transmittance and reflectance change according to a change in wavelength in the dichroic mirror is wider than a full width at half maximum of a normal fluorescence spectrum of the light-emitting element.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: July 4, 2023
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Tomonori Nakamura, Kenichiro Ikemura, Akihiro Otaka
  • Publication number: 20230209998
    Abstract: An organic electroluminescence device including a cathode, an anode, and one or two or more organic layers arranged between the cathode and the anode, wherein at least one layer of the one or two or more organic layers includes a first component and a second component, the first component is a compound represented by the following formula (1), and the second component is a compound represented by the following formula (2).
    Type: Application
    Filed: December 14, 2022
    Publication date: June 29, 2023
    Applicant: IDEMITSU KOSAN CO.,LTD.
    Inventors: Ryota TAKAHASHI, Yoshinori AOYAMA, Sayaka MIZUTANI, Masato MITANI, Tomonori NAKAMURA
  • Publication number: 20230204824
    Abstract: An optical device is provided which does not need a collimate lens, and which has a high available efficiency of light. The optical device includes a light source unit 1 emitting light with a wavelength ?, and an optical element 2 with a concavo-convex structure including periodical lenses. When n is a natural number equal to or greater than 1, and the size of a k-th (where k is a natural number equal to or greater than 1) pitch from the smallest one among the pitches of the concavo-convex structure is Pk, a distance L1 between the light source unit and the optical element satisfies the following formula 1 for equal to or greater than any one pitch Pk. ( n - 0 . 1 ) ? P k 2 2 ? ? ? L 1 ? ( n + 0 .
    Type: Application
    Filed: December 17, 2020
    Publication date: June 29, 2023
    Applicant: SCIVAX CORPORATION
    Inventors: Akifumi Nawata, Tomonori Nakamura, Satoru Tanaka
  • Publication number: 20230184827
    Abstract: A semiconductor inspection device includes: a measuring device that supplies power to a semiconductor device and measures the electrical characteristics; an optical scanning device that scans the semiconductor device with light intensity-modulated with a plurality of frequencies; a lock-in amplifier that acquires a characteristic signal indicating the electrical characteristics of the plurality of frequency components; and an inspection device that calculates a frequency at which the characteristic signal reflecting the electrical characteristics of a first layer and the characteristic signal reflecting the electrical characteristics of a second layer have a predetermined phase difference, corrects a phase component of the characteristic signal at an arbitrary scanning position with a phase component at the scanning position reflecting the electrical characteristics of the first layer as a reference, and outputs an in-phase component and a quadrature component at the arbitrary scanning position at the calcula
    Type: Application
    Filed: April 5, 2021
    Publication date: June 15, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Norimichi CHINONE, Tomonori NAKAMURA, Akira SHIMASE, Shigeru EURA
  • Publication number: 20230184825
    Abstract: A semiconductor inspection device includes: a measuring device that supplies power to a semiconductor device and measures the electrical characteristics of the semiconductor device; an optical scanning device that scans the semiconductor device with light intensity-modulated with a plurality of frequencies; a lock-in amplifier that acquires a characteristic signal indicating the electrical characteristics of the plurality of frequency components; and an inspection device that corrects a phase component of the characteristic signal at an arbitrary scanning position with a phase component at a scanning position reflecting the electrical characteristics of a first layer in the semiconductor device as a reference, specifies a phase component of the characteristic signal at a scanning position reflecting the electrical characteristics of a second layer, normalizes the phase component of the characteristic signal at the arbitrary scanning position by using the phase component, and outputs a result based on the norm
    Type: Application
    Filed: April 5, 2021
    Publication date: June 15, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Norimichi CHINONE, Tomonori NAKAMURA, Akira SHIMASE
  • Publication number: 20230066638
    Abstract: A height measurement apparatus includes: a light irradiation unit that irradiates a sample with irradiation light; a camera system that detects light from the sample irradiated with the irradiation light; and a control apparatus that calculates a height of the sample based on the wavelength information. The camera system includes an inclined dichroic mirror of which a transmittance and a reflectance change according to a wavelength in a predetermined wavelength range and which separates the light from the sample by transmitting and reflecting the light, a light detector that detects a reflected light quantity from light reflected by the inclined dichroic mirror, a light detector that detects a transmitted light quantity from light transmitted through the inclined dichroic mirror, and a processing unit that calculates the wavelength information based on a ratio between the reflected light quantity and the transmitted light quantity, to output the wavelength information.
    Type: Application
    Filed: February 2, 2021
    Publication date: March 2, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Tomonori NAKAMURA, Kunihiko TSUCHIYA
  • Publication number: 20230061667
    Abstract: A measurement apparatus includes an inclined dichroic mirror configured to separate light from a sample by transmitting or reflecting the light according to wavelengths, a total reflection mirror configured to reflect one part of light either transmitted or reflected by the inclined dichroic mirror, an imaging element configured to photograph the other part of the light transmitted or reflected by the inclined dichroic mirror in a first imaging region and photograph light reflected by the total reflection mirror in a second imaging region different from the first imaging region, and a control apparatus configured to correct images photographed in the first imaging region and the second imaging region based on optical characteristics related to a change in transmittance and reflectance with respect to a wavelength in the inclined dichroic mirror.
    Type: Application
    Filed: January 4, 2021
    Publication date: March 2, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventor: Tomonori NAKAMURA
  • Publication number: 20230058064
    Abstract: A film thickness measuring apparatus includes a light irradiation unit configured to irradiate an object with light in a planar shape, an optical element having a transmittance and a reflectance changing according to wavelengths in a predetermined wavelength range, the optical element being configured to separate light from the object by transmitting and reflecting the light, an imaging unit configured to photograph light separated by the optical element, and an analysis unit configured to estimate a film thickness of the object based on a signal from the imaging unit photographing light, in which the light irradiation unit emits light having a wavelength included in the predetermined wavelength range of the optical element.
    Type: Application
    Filed: February 9, 2021
    Publication date: February 23, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Tomonori NAKAMURA, Kenichi OHTSUKA, Satoshi ARANO, Kunihiko TSUCHIYA
  • Patent number: 11569192
    Abstract: This method for producing a structure wherein base materials are bonded by atomic diffusion comprises: a step for applying a liquid resin on the base material; a step for smoothing the surface of the liquid resin by surface tension; a step for forming a resin layer by curing; a step for forming a metal thin film on the resin layer; a step for forming a metal thin film on the base material; and a step for bringing the metal thin film of the base material and the metal thin film of the base material into close contact with each other, thereby bonding the metal thin film of the resin layer and the metal thin film of the base material with each other by atomic diffusion.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: January 31, 2023
    Assignees: SHINKAWA LTD., TOHOKU UNIVERSITY
    Inventors: Yuji Eguchi, Kohei Seyama, Tomonori Nakamura, Hiroshi Kikuchi, Takehito Shimatsu, Miyuki Uomoto
  • Patent number: 11545462
    Abstract: A mounting apparatus for stacking and mounting two or more semiconductor chips at a plurality of locations on a substrate includes: a first mounting head for forming, at a plurality of locations on the substrate, temporarily stacked bodies in which two or more semiconductor chips are stacked in a temporarily press-attached state; and a second mounting head for forming chip stacked bodies by sequentially finally press-attaching the temporarily stacked bodies formed at the plurality of locations. The second mounting head includes: a press-attaching tool for heating and pressing an upper surface of a target temporarily stacked body to thereby finally press-attach the two or more semiconductor chips configuring the temporarily stacked body altogether; and one or more heat-dissipation tools having a heat-dissipating body which, by coming into contact with an upper surface of another stacked body positioned around the target temporarily stacked body, dissipates heat from the another stacked body.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: January 3, 2023
    Assignee: SHINKAWA LTD.
    Inventors: Tomonori Nakamura, Toru Maeda
  • Patent number: 11529165
    Abstract: To provide a catheter having a simple structure capable of excising an atheroma in a blood vessel and capable of obtaining ultrasonic images of a blood vessel. [Solution] A catheter 10 has a shaft 11 having an opening 20 in a part of the side wall on the distal end side, a cutter 12 which is located in the vicinity of the opening 20 in the internal space of the shaft 11 and which can move in the axial direction 101 of the shaft 11, a balloon 23 which is disposed on the side opposite to the opening 20 with respect to the axis of the shaft 11 and which outwardly expands from the side wall of the shaft 11, and a phased array ultrasound probe 17 disposed along the circumferential direction 102 of the outer peripheral surface of the side wall in the vicinity of the opening 20 at least on the same side as the side where the opening 20 is provided with respect to the axis of the shaft 11.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: December 20, 2022
    Assignee: Nipro Corporation
    Inventors: Katsuya Miyagawa, Misa Matsumoto, Tomonori Nakamura
  • Patent number: 11512411
    Abstract: A PTFE sheet in which PTFE fibers having a diameter of 1 ?m or less are spun, the PTFE sheet having a Gurley value in the range of 1 s/100 cc/in2 to 3 s/100 cc/in2 and a shrinkage factor in a direction orthogonal to a sheet winding direction of no more than 10% when heated to 300° C. The PTFE sheet makes a die adsorbable via a tool, which is for heating the die when the die is mounted on a mounting body, by being sandwiched between the die and the tool, and suppresses the adhesion, to an adsorption surface of the tool or to the die, of an adhesion member for fixing the die to the mounted body. Through this configuration, a PTFE sheet capable of stabilizing vacuum adsorption and improving maintainability and a method for mounting a die are provided.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: November 29, 2022
    Assignees: SHINKAWA LTD., VALQUA, LTD.
    Inventors: Osamu Watanabe, Tomonori Nakamura, Yoshihito Hagiwara, Yuji Kanai