Abstract: An inspection apparatus comprises a light output unit configured to output first light having a first wavelength and second light having a second wavelength, a magneto-optical crystal arranged so that a reflection film faces a measurement target, a light detection unit configured to detect the first light and the second light, and a light guide optical system configured to guide the first light and the second light toward the magneto-optical crystal and the measurement target, and guide the first light reflected by the magneto-optical crystal and the second light reflected by the measurement target toward the light detection unit. The light guide optical system comprises an optical path switching clement configured to perform switching between optical paths of a plurality of optical elements so that the first light and the second light are selectively incident on the light detection unit.

Abstract: An inspection system includes a light source, a mirror, Galvano mirrors, a casing that holds the mirror and the Galvano mirrors inside and includes an attachment portion for attaching an optical element, and a control unit that controls a deflection angle of the Galvano mirrors, wherein the control unit controls the deflection angle so that an optical path optically connected to a semiconductor device is switched between a first optical path passing through the Galvano mirrors and the mirror, and a second optical path passing through the Galvano mirrors and the attachment portion, and controls the deflection angle so that the deflection angle when switching to the first optical path has been performed and the deflection angle when switching to the second optical path has been performed do not overlap.

Abstract: A device analysis apparatus is a device analysis apparatus for determining a quality of a power semiconductor device, including an application unit that applies a voltage signal to the power semiconductor device, a light detection unit that detects light from the power semiconductor device at a plurality of detection positions and outputs detection signals based on detection results, and a determination unit that determines the quality of the power semiconductor device based on temporal changes of the detection signals.

Abstract: A bonding apparatus and a bonding method are provided. The bonding apparatus bonds a semiconductor die to a substrate by thermocompression through an adhesive material. This bonding apparatus is provided with: a bonding tool which has a bonding surface that holds the semiconductor die through a first portion of a tape, and a pair of first tape constraining surfaces that are arranged so as to sandwich the bonding surface and constrain a second portion of the tape: tape constraining mechanisms which have a second tape constraining surface that presses the tape against the first tape constraining surfaces; and a control part which controls the movements of the bonding tool and the tape constraining mechanisms.

Abstract: A heat source position inside a measurement object is identified with high accuracy by improving time resolution. An analysis system according to the present invention is an analysis system that identifies a heat source position inside a measurement object, and includes a condition setting unit that sets a measurement point for one surface of the measurement object, a tester that applies a stimulation signal to the measurement object, a light source that irradiates the measurement point of the measurement object with light, a photo detector that detects light reflected from a predetermined measurement point on the surface of the measurement object according to the irradiation of light and outputs a detection signal, and an analysis unit that derives a distance from the measurement point to the heat source position based on the detection signal and the stimulation signal and identifies the heat source position.

Abstract: This method for producing a structure wherein base materials are bonded by atomic diffusion comprises: a step for applying a liquid resin on the base material; a step for smoothing the surface of the liquid resin by surface tension; a step for forming a resin layer by curing; a step for forming a metal thin film on the resin layer; a step for forming a metal thin film on the base material; and a step for bringing the metal thin film of the base material and the metal thin film of the base material into close contact with each other, thereby bonding the metal thin film of the resin layer and the metal thin film of the base material with each other by atomic diffusion

Abstract: An inspection apparatus comprises a light output unit configured to output first light having a first wavelength and second light having a second wavelength, a magneto-optical crystal arranged so that a reflection film faces a measurement target, a light detection unit configured to detect the first light and the second light, and a light guide optical system configured to guide the first light and the second light toward the magneto-optical crystal and the measurement target, and guide the first light reflected by the magneto-optical crystal and the second light reflected by the measurement target toward the light detection unit. The light guide optical system comprises an optical path switching element configured to perform switching between optical paths of a plurality of optical elements so that the first light and the second light are selectively incident on the light detection unit.

Abstract: Provided is a bonding method for directly bonding an electrode part of a chip component to a bonding part provided on a substrate that is a bonding target, the method comprising: a step for placing the substrate on a stage inside a liquid vessel; a step for injecting liquid into the liquid vessel; and a step for bonding the electrode part of the chip component to the bonding part (electrode part) of the bonding target by superimposing the chip component held by a bonding head in the liquid stored in the liquid vessel over the bonding target and then applying pressure thereto.

Abstract: The solid immersion lens unit includes: a solid immersion lens having a contact surface allowed to be in contact with an inspection object and a spherical surface allowed to be opposite to an objective lens; a holder holding the solid immersion lens; a magnet provided to the holder; and a spherical body rotatably held by a magnetic force of the magnet at a position opposite to the spherical surface. The holder swingably holds the solid immersion lens in a state where the spherical surface is in contact with the spherical body.

Abstract: An apparatus for inspecting an integrated circuit is an apparatus for inspecting an integrated circuit having a semiconductor substrate and a circuit portion formed on a front face a side of the semiconductor substrate. The apparatus comprises a light generation unit for generating light L for irradiating the integrated circuit, a wavelength width adjustment unit, for adjusting the wavelength width of the light irradiating the integrated circuit, an irradiation position adjustment unit for adjusting the irradiation position of the light irradiating the integrated circuit, and a light detection unit for detecting the light from the integrated circuit when the light from the light generation unit irradiates the circuit portion through a rear face of the semiconductor substrate.

Abstract: To provide a catheter having a simple structure capable of excising an atheroma in a blood vessel and capable of obtaining ultrasonic images of a blood vessel. [Solution] A catheter 10 has a shaft 11 having an opening 20 in a part of the side wall on the distal end side, a cutter 12 which is located in the vicinity of the opening 20 in the internal space of the shaft 11 and which can move in the axial direction 101 of the shaft 11, a balloon 23 which is disposed on the side opposite to the opening 20 with respect to the axis of the shaft 11 and which outwardly expands from the side wall of the shaft 11, and a phased array ultrasound probe 17 disposed along the circumferential direction 102 of the outer peripheral surface of the side wall in the vicinity of the opening 20 at least on the same side as the side where the opening 20 is provided with respect to the axis of the shaft 11.

Abstract: A method causing a processor to execute operations includes managing a plurality of first settings, one of the plurality of first setting being to control a first device in case that an operation status of a second device which is interconnected to the first device via a network has changed, receiving a second setting, the second setting being to control a third device in case that an operation status of a fourth device which is interconnected to the third device via the network has changed, determining whether conflicting operations are to be performed on a device when the plurality of first settings and the second setting are executed, extracting a setting from the first settings and the second setting, which is a cause of the conflicting operations in case that, in the determining, the conflicting operations are determined and transmitting a notification to divide a time during which the setting extracted in the extracting is executed.

Abstract: The disclosure is provided with: a temporary crimping step in which one or more semiconductor chips 10 are sequentially laminated while being temporarily crimped in each of two or more locations on a substrate 30 to thereby form chip stacks ST in a temporarily crimped state; and a permanent crimping step in which the top surfaces of all of the chip stacks ST formed in the temporarily crimped state are sequentially heated, pressurized, and permanently crimped. Furthermore, a specifying step is provided prior to the temporary crimping step for specifying a separation distance Dd which is the distance from the chip stacks ST under permanent crimping to a location at which the temperature of the substrate 30, the temperature having been raised by heating for the permanent crimping, becomes less than or equal to a prescribed permissible temperature Td, and in the temporary crimping step, the chip stacks ST in the temporarily crimped state are formed separated from each other by the separation distance Dd or more.

Abstract: A method of manufacturing a semiconductor device in which a prescribed target lamination number of semiconductor chips are laminated on a substrate, the method includes: a first lamination step of laminating while temporarily bonding one or more semiconductor chips on the substrate to thereby form a first chip laminate body; a first permanent bonding step of pressurizing while heating from the upper side of the first chip laminate body to thereby collectively and permanently bond the one or more semiconductor chips; a second lamination step of sequentially laminating while temporarily bonding two or more semiconductor chips on the permanently bonded semiconductor chips to thereby form a second chip laminate body; and a second permanent bonding step of pressurizing while heating from the upper side of the second chip laminate body to thereby collectively permanently bond the two or more semiconductor chips.

Abstract: A method for controlling an autonomous device that moves in two dimensions using a controller includes obtaining a first image at a first position, which is a destination of the autonomous device, calculating, from the first image, first feature values indicating certain characteristics of the first image, referring to map information indicating correspondences between coordinate information indicating coordinates of defined positions included in a movement area of the autonomous device and second feature values, which are calculated from second images and indicate certain characteristics of the second images and identifying, by referring to the map information, a second position corresponding to second feature values having at least a predetermined degree of correspondence to the feature values generating a command for moving the autonomous device to the second position on the basis of coordinate information corresponding to the second position, and transmitting the command to the autonomous device.

Abstract: A light source device includes a light source that generates incoherent light, and an optical amplifier having gain characteristics indicating a gain at each wavelength, which receives the incoherent light output by the light source as input light, and outputs amplified light obtained by amplifying the input light, and a central wavelength of an intensity distribution indicating an intensity at each wavelength of the input light is a wavelength longer than a central wavelength of the gain characteristics indicating a gain at each wavelength of the optical amplifier.

Abstract: [Object] To provide a catheter having a simple structure capable of excising an atheroma in a blood vessel and capable of obtaining ultrasonic images of a blood vessel. [Solution] A catheter 10 has a shaft 11 having an opening 20 in a part of the side wall on the distal end side, a cutter 12 which is located in the vicinity of the opening 20 in the internal space of the shaft 11 and which can move in the axial direction 101 of the shaft 11, a balloon 23 which is disposed on the side opposite to the opening 20 with respect to the axis of the shaft 11 and which outwardly expands from the side wall of the shaft 11, and a phased array ultrasound probe 17 disposed along the circumferential direction 102 of the outer peripheral surface of the side wall in the vicinity of the opening 20 at least on the same side as the side where the opening 20 is provided with respect to the axis of the shaft 11.

Abstract: A heat source position inside a measurement object is identified with high accuracy by improving time resolution. An analysis system according to the present invention is an analysis system that identifies a heat source position inside a measurement object, and includes a condition setting unit that sets a measurement point for one surface of the measurement object, a tester that applies a stimulation signal to the measurement object, a light source that irradiates the measurement point of the measurement object with light, a photo detector that detects light reflected from a predetermined measurement point on the surface of the measurement object according to the irradiation of light and outputs a detection signal, and an analysis unit that derives a distance from the measurement point to the heat source position based on the detection signal and the stimulation signal and identifies the heat source position.

Abstract: A heat generation point detection method comprises steps S01, S02 of applying a low frequency bias voltage to an integrated circuit S and acquiring a heat generation detection signal detected from the integrated circuit S in response thereto, steps S03, S04 of supplying a high frequency bias voltage to the integrated circuit S and acquiring a heat generation detection signal detected from the integrated circuit S in response thereto, steps S05 to S07 of detecting a phase shift between the low frequency bias voltage and the heat generation detection signal and a phase shift between the high frequency bias voltage and the heat generation detection signal, and a step S08 of calculating a change rate of the phase shift against a square root of the frequency of the bias voltage, based on those phase shifts, and acquiring depth information of a heat generation point from the change rate.

Abstract: A system and a method capable of identifying a heat source position corresponding to a failure portion are provided. An analysis system according to the present invention is an analysis system that identifies a heat source position inside a semiconductor device, and includes a tester that applies an AC signal to the semiconductor device, an infrared camera that detects light from the semiconductor device according to the AC signal and outputs a detection signal, and a data analysis unit that identifies the heat source position based on the detection signal.