Patents by Inventor Tomonori Seki

Tomonori Seki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10673357
    Abstract: A power generation device converts vibrational energy into electric power using a vibrational power generation element in which an electret is provided on one substrate of substrates configured to be relatively movable while maintaining a mutually facing state, and supplies the electric power. A vibrational power generation element has the same configuration as the vibrational power generation element and converts vibrational energy into electric power. The vibrational power generation element is connected to a light-emitting diode via a bridge-type full wave rectifier circuit constituted by diodes, a smoothing circuit constituted by a capacitor, and a light-emitting diode drive circuit. A power generation state of the power generation device using the vibrational power generation element and the like is displayed by blinking of the light-emitting diode.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: June 2, 2020
    Assignees: OMRON Corporation, THHINK WIRELESS TECHNOLOGIES JAPAN LTD.
    Inventors: Masatoshi Oba, Tomonori Seki, Naoki Yoshitake, Yutaka Hattori
  • Patent number: 10202980
    Abstract: There is provided a centrifugal compressor apparatus including a centrifugal compressor that centrifugally compresses a gas, an electric motor that rotatably drives the centrifugal compressor, a current detector that detects a drive current I of the electric motor, and an exhaust valve that discharges a compressed gas to a lower pressure section. The centrifugal compressor apparatus (A) detects the drive current I at a sampling cycle ts, (B) updates, as a current threshold, in real time, a value “(moving average)?n×(standard deviation)” for which a plurality of drive currents measured in a sampling period tp serves as a population, where n is a positive number in the range of 3 to 4 and, (C) determines that surging has occurred when the exhaust valve is closed and the drive current I is below the current threshold X, and (D) further opens the exhaust valve to discharge the compressed gas when determining that surging has occurred.
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: February 12, 2019
    Assignee: IHI Rotating Machinery Engineering Co., Ltd.
    Inventors: Tsuneo Koki, Naoki Nishiyama, Yuji Echizen, Takashi Oyabu, Tomonori Seki, Masashi Moriguchi
  • Patent number: 10125237
    Abstract: A heat radiation sheet having high heat-radiation property and excellent handleability and having sheet properties permitting the sheet to cope with changes in use temperature thereof. Also provided is a heat radiation device using the sheet. The heat radiation sheet comprises: a binder component comprising: (A) a thermoplastic rubber component; (B) a thermosetting rubber component; and (C) a thermosetting rubber curing agent crosslinkable with the thermosetting rubber component (B); and an anisotropic graphite powder oriented into a specified direction in the binder component.
    Type: Grant
    Filed: May 22, 2009
    Date of Patent: November 13, 2018
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Noriji Tashiro, Michiaki Yajima, Tomonori Seki, Atsushi Fujita, Tooru Yoshikawa, Rei Yamamoto
  • Publication number: 20180152119
    Abstract: A power generation device converts vibrational energy into electric power using a vibrational power generation element in which an electret is provided on one substrate of substrates configured to be relatively movable while maintaining a mutually facing state, and supplies the electric power. A vibrational power generation element has the same configuration as the vibrational power generation element and converts vibrational energy into electric power. The vibrational power generation element is connected to a light-emitting diode via a bridge-type full wave rectifier circuit constituted by diodes, a smoothing circuit constituted by a capacitor, and a light-emitting diode drive circuit. A power generation state of the power generation device using the vibrational power generation element and the like is displayed by blinking of the light-emitting diode.
    Type: Application
    Filed: August 28, 2015
    Publication date: May 31, 2018
    Applicants: OMRON Corporation, THHINK WIRELESS TECHNOLOGIES JAPAN LTD.
    Inventors: Masatoshi OBA, Tomonori SEKI, Naoki YOSHITAKE, Yutaka HATTORI
  • Patent number: 9953961
    Abstract: A semiconductor device can reduce the number of bonding wires. The semiconductor device includes two or more semiconductor elements each of which has electrodes on a first main surface and a second main surface, an electrode plate that has one surface which is bonded to electrodes on the first main surfaces of the semiconductor elements, with a first bonding material layer interposed therebetween, and extends over the electrodes on the first main surfaces of the two or more semiconductor elements, and a conductive plate that includes a first lead terminal and a semiconductor element bonding portion which is bonded to electrodes on the second main surfaces of the semiconductor elements. A second bonding material layer is interposed therebetween, and is connected to the electrodes on the second main surfaces of the two or more semiconductor elements.
    Type: Grant
    Filed: October 10, 2014
    Date of Patent: April 24, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Takeshi Yokoyama, Masaaki Ochiai, Atsushi Maruyama, Tomonori Seki, Shinichiro Matsunaga
  • Patent number: 9728475
    Abstract: A miniaturized semiconductor device includes a frame body having an opening region formed in a central portion, an insulating substrate which is provided in the opening region of the frame body and on which semiconductor chips are mounted, lead portions, each including an inclined portion that is at least partially exposed to the opening region formed in the frame body and extends so as to be inclined with respect to an end surface forming the opening region, and a bonding wire that is bonded between the lead portion and the semiconductor chip by ultrasonic bonding.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: August 8, 2017
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Tadanori Yamada, Toshio Denta, Tomonori Seki
  • Patent number: 9574833
    Abstract: The thermal conductive sheet of the present invention includes a base sheet and, on one surface of the base sheet, a metal foil (C) that has a thickness of from 1 to 30% of a thickness of the base sheet. The base sheet includes a binder component (A) that exhibits elasticity at room temperature and a graphite powder (B) that has anisotropy, and the graphite powder (B) is oriented in a thickness direction.
    Type: Grant
    Filed: April 25, 2011
    Date of Patent: February 21, 2017
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Michiaki Yajima, Rei Yamamoto, Tooru Yoshikawa, Tomonori Seki
  • Patent number: 9406576
    Abstract: A miniaturized semiconductor device includes a frame body having an opening region formed in a central portion, an insulating substrate which is provided in the opening region of the frame body and on which semiconductor chips are mounted, lead portions, each including an inclined portion that is at least partially exposed to the opening region formed in the frame body and extends so as to be inclined with respect to an end surface forming the opening region, and a bonding wire that is bonded between the lead portion and the semiconductor chip by ultrasonic bonding.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: August 2, 2016
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Tadanori Yamada, Toshio Denta, Tomonori Seki
  • Publication number: 20160211202
    Abstract: A miniaturized semiconductor device includes a frame body having an opening region formed in a central portion, an insulating substrate which is provided in the opening region of the frame body and on which semiconductor chips are mounted, lead portions, each including an inclined portion that is at least partially exposed to the opening region formed in the frame body and extends so as to be inclined with respect to an end surface forming the opening region, and a bonding wire that is bonded between the lead portion and the semiconductor chip by ultrasonic bonding.
    Type: Application
    Filed: March 31, 2016
    Publication date: July 21, 2016
    Inventors: Tadanori YAMADA, Toshio DENTA, Tomonori SEKI
  • Patent number: 9379096
    Abstract: A semiconductor device includes a plurality of semiconductor elements; first semiconductor chips including first semiconductor elements, the first semiconductor elements being defined as semiconductor elements in the plurality of semiconductor elements and having a current flowing greater than that of the other semiconductor elements; second semiconductor chips having second semiconductor elements, the second semiconductor elements being defined as semiconductor elements in the plurality of semiconductor elements for controlling the first semiconductor elements; an insulating substrate having a first wiring pattern bonded with the first semiconductor chips; and an insulating member having a second wiring pattern mounted with the second semiconductor chips.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: June 28, 2016
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Toshio Denta, Tomonori Seki, Tadanori Yamada, Tadahiko Sato
  • Publication number: 20150187669
    Abstract: A miniaturized semiconductor device includes a frame body having an opening region formed in a central portion, an insulating substrate which is provided in the opening region of the frame body and on which semiconductor chips are mounted, lead portions, each including an inclined portion that is at least partially exposed to the opening region formed in the frame body and extends so as to be inclined with respect to an end surface forming the opening region, and a bonding wire that is bonded between the lead portion and the semiconductor chip by ultrasonic bonding.
    Type: Application
    Filed: March 12, 2015
    Publication date: July 2, 2015
    Inventors: Tadanori YAMADA, Toshio DENTA, Tomonori SEKI
  • Patent number: 9064818
    Abstract: A semiconductor device includes an insulating circuit substrate mounted with at least one semiconductor element; a resin case having a bottom surface portion attached with the insulating circuit substrate and a side surface portion enclosing a periphery of the bottom surface portion; a lead molded integrally with the resin case and provided on a periphery of the insulating circuit substrate to be positioned on a surface of the bottom surface portion inside the resin case, the lead partially extending from inside the resin case to outside the resin case; and a sealing resin filled inside the resin case. A depressed portion is formed on two sides of the lead along a peripheral edge of the bottom surface portion inside the resin case.
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: June 23, 2015
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Toshio Denta, Tomonori Seki, Tadanori Yamada, Tadahiko Sato
  • Patent number: 8975736
    Abstract: A wafer level package has a first wafer having a plurality of chips mounted or formed thereon in a plane, and a second wafer that is opposed to the first wafer. The first wafer and the second wafer are joined while a seal frame that seals a periphery of each chip is interposed therebetween. A gap is formed between the seal frames of the chips adjacent to each other. A partial connect part that partially connects the seal frames to each other is provided in the gap formed between the seal frames of the chips adjacent to each other.
    Type: Grant
    Filed: March 16, 2011
    Date of Patent: March 10, 2015
    Assignee: OMRON Corporation
    Inventors: Toshiaki Okuno, Katsuyuki Inoue, Takeshi Fujiwara, Tomonori Seki
  • Publication number: 20150028467
    Abstract: A semiconductor device can reduce the number of bonding wires. The semiconductor device includes two or more semiconductor elements each of which has electrodes on a first main surface and a second main surface, an electrode plate that has one surface which is bonded to electrodes on the first main surfaces of the semiconductor elements, with a first bonding material layer interposed therebetween, and extends over the electrodes on the first main surfaces of the two or more semiconductor elements, and a conductive plate that includes a first lead terminal and a semiconductor element bonding portion which is bonded to electrodes on the second main surfaces of the semiconductor elements. A second bonding material layer is interposed therebetween, and is connected to the electrodes on the second main surfaces of the two or more semiconductor elements.
    Type: Application
    Filed: October 10, 2014
    Publication date: January 29, 2015
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Takeshi YOKOYAMA, Masaaki OCHIAI, Atsushi MARUYAMA, Tomonori SEKI, Shinichiro MATSUNAGA
  • Publication number: 20140374889
    Abstract: A semiconductor device includes a plurality of semiconductor elements; first semiconductor chips including first semiconductor elements, the first semiconductor elements being defined as semiconductor elements in the plurality of semiconductor elements and having a current flowing greater than that of the other semiconductor elements; second semiconductor chips having second semiconductor elements, the second semiconductor elements being defined as semiconductor elements in the plurality of semiconductor elements for controlling the first semiconductor elements; an insulating substrate having a first wiring pattern bonded with the first semiconductor chips; and an insulating member having a second wiring pattern mounted with the second semiconductor chips.
    Type: Application
    Filed: September 11, 2014
    Publication date: December 25, 2014
    Inventors: Toshio DENTA, Tomonori SEKI, Tadanori YAMADA, Tadahiko SATO
  • Publication number: 20140231975
    Abstract: A semiconductor device includes an insulating circuit substrate mounted with at least one semiconductor element; a resin case having a bottom surface portion attached with the insulating circuit substrate and a side surface portion enclosing a periphery of the bottom surface portion; a lead molded integrally with the resin case and provided on a periphery of the insulating circuit substrate to be positioned on a surface of the bottom surface portion inside the resin case, the lead partially extending from inside the resin case to outside the resin case; and a sealing resin filled inside the resin case. A depressed portion is formed on two sides of the lead along a peripheral edge of the bottom surface portion inside the resin case.
    Type: Application
    Filed: February 14, 2014
    Publication date: August 21, 2014
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Toshio DENTA, Tomonori SEKI, Tadanori YAMADA, Tadahiko SATO
  • Publication number: 20140219820
    Abstract: There is provided a centrifugal compressor apparatus including a centrifugal compressor that centrifugally compresses a gas, an electric motor that rotatably drives the centrifugal compressor, a current detector that detects a drive current I of the electric motor, and an exhaust valve that discharges a compressed gas to a lower pressure section. The centrifugal compressor apparatus (A) detects the drive current I at a sampling cycle ts, (B) updates, as a current threshold, in real time, a value “(moving average)?n×(standard deviation)” for which a plurality of drive currents measured in a sampling period tp serves as a population, where n is a positive number in the range of 3 to 4 and, (C) determines that surging has occurred when the exhaust valve is closed and the drive current I is below the current threshold X, and (D) further opens the exhaust valve to discharge the compressed gas when determining that surging has occurred.
    Type: Application
    Filed: April 3, 2014
    Publication date: August 7, 2014
    Applicant: IHI Corporation
    Inventors: Tsuneo KOKI, Naoki NISHIYAMA, Yuji ECHIZEN, Takashi OYABU, Tomonori SEKI, Masashi MORIGUCHI
  • Publication number: 20140202838
    Abstract: An electronic component has a first member in which an electrostatic actuator is provided, a second member in which a drive integrated circuit for driving the electrostatic actuator is provided, and join parts that joins the first member and the second member while a surface on which the electrostatic actuator is provided in the first member and a surface on which the drive integrated circuit is provided in the second member are opposed to each other. The electrostatic actuator and the drive integrated circuit are disposed in a space surrounded by the first member, the second member, and the join parts.
    Type: Application
    Filed: July 18, 2012
    Publication date: July 24, 2014
    Applicant: OMRON CORPORATION
    Inventors: Akihiko Sano, Takeshi Fujiwara, Hidenori Maruyama, Tomonori Seki
  • Publication number: 20140008779
    Abstract: A wafer level package has a first wafer having a plurality of chips mounted or formed thereon in a plane, and a second wafer that is opposed to the first wafer. The first wafer and the second wafer are joined while a seal frame that seals a periphery of each chip is interposed therebetween. A gap is formed between the seal frames of the chips adjacent to each other. A partial connect part that partially connects the seal frames to each other is provided in the gap formed between the seal frames of the chips adjacent to each other.
    Type: Application
    Filed: March 16, 2011
    Publication date: January 9, 2014
    Applicant: OMRON CORPORATION
    Inventors: Toshiaki Okuno, Katsuyuki Inoue, Takeshi Fujiwara, Tomonori Seki
  • Publication number: 20130112389
    Abstract: The thermal conductive sheet of the present invention includes a base sheet and, on one surface of the base sheet, a metal foil (C) that has a thickness of from 1 to 30% of a thickness of the base sheet. The base sheet includes a binder component (A) that exhibits elasticity at room temperature and a graphite powder (B) that has anisotropy, and the graphite powder (B) is oriented in a thickness direction.
    Type: Application
    Filed: April 25, 2011
    Publication date: May 9, 2013
    Inventors: Michiaki Yajima, Rei Yamamoto, Tooru Yoshikawa, Tomonori Seki