Abstract: One object is to provide a particulate material supply apparatus of a simple configuration provided with leakage preventing portions configured to receive a particulate material falling out from a feed port during stop of supply of the particulate material and not to interfere with the supply of the particulate material from the feed port during supply of the particulate material. There is provided a particulate material supply apparatus of the present disclosure comprising a main body; a plurality of stockers; and a plurality of leakage preventing portions. The stocker comprises a charging port configured to cause the particulate material to be charged into inside of the stocker; and a feed portion configured to supply the particulate material stored inside of the stocker from a feed port. The leakage preventing portion comprises a receiving member and a driving portion.

Abstract: An object of the invention is to provide a space-saving powder supply device capable of supplying a plurality of kinds of powder at one place. A powder supply device according to the present invention is provided with: a main body; a container for storing powder therein; a conveyance unit; and a plurality of stockers. The conveyance unit has a supply region which is a region for supplying the powder from the stocker to the container mounted on the upper side of the conveyance unit. The stocker has: a charge port through which the powder can be charged into the stocker; a supplier for supplying the powder stored in the stocker from the supply port. The stocker is connected to the main body, with the plurality of stockers being arranged radially around the supply region, and a center axis of the supplier being directed to a center of the supply region.

Abstract: A purpose of the invention is to provide a powder supply device having a dust collection unit to collect powdery dust released when powder is supplied from a lateral side, and having a space-saving and simplified structure. A powder supply device according to the present invention has a main body, a plurality of stockers and a dust collection unit. The stocker has a charge port and a supplier. The dust collection unit has a casing, an exhauster and a filtering member. The casing has a ceiling portion and a lateral side portion, with a side opposing said ceiling portion being opened to form a lid-shaped configuration. The lateral side portion has a notched portion into which the supplier is to be inserted. The filtering member is provided inside the casing and is positioned above the notched portion and below the ceiling portion in order to collect the powder.

Abstract: One object is to provide a particulate material supply apparatus of a simple configuration provided with leakage preventing portions configured to receive a particulate material falling out from a feed port during stop of supply of the particulate material and not to interfere with the supply of the particulate material from the feed port during supply of the particulate material. There is provided a particulate material supply apparatus of the present disclosure comprising a main body; a plurality of stockers; and a plurality of leakage preventing portions. The stocker comprises a charging port configured to cause the particulate material to be charged into inside of the stocker; and a feed portion configured to supply the particulate material stored inside of the stocker from a feed port. The leakage preventing portion comprises a receiving member and a driving portion.

Abstract: A power generation device converts vibrational energy into electric power using a vibrational power generation element in which an electret is provided on one substrate of substrates configured to be relatively movable while maintaining a mutually facing state, and supplies the electric power. A vibrational power generation element has the same configuration as the vibrational power generation element and converts vibrational energy into electric power. The vibrational power generation element is connected to a light-emitting diode via a bridge-type full wave rectifier circuit constituted by diodes, a smoothing circuit constituted by a capacitor, and a light-emitting diode drive circuit. A power generation state of the power generation device using the vibrational power generation element and the like is displayed by blinking of the light-emitting diode.

Abstract: There is provided a centrifugal compressor apparatus including a centrifugal compressor that centrifugally compresses a gas, an electric motor that rotatably drives the centrifugal compressor, a current detector that detects a drive current I of the electric motor, and an exhaust valve that discharges a compressed gas to a lower pressure section. The centrifugal compressor apparatus (A) detects the drive current I at a sampling cycle ts, (B) updates, as a current threshold, in real time, a value “(moving average)?n×(standard deviation)” for which a plurality of drive currents measured in a sampling period tp serves as a population, where n is a positive number in the range of 3 to 4 and, (C) determines that surging has occurred when the exhaust valve is closed and the drive current I is below the current threshold X, and (D) further opens the exhaust valve to discharge the compressed gas when determining that surging has occurred.

Abstract: A heat radiation sheet having high heat-radiation property and excellent handleability and having sheet properties permitting the sheet to cope with changes in use temperature thereof. Also provided is a heat radiation device using the sheet. The heat radiation sheet comprises: a binder component comprising: (A) a thermoplastic rubber component; (B) a thermosetting rubber component; and (C) a thermosetting rubber curing agent crosslinkable with the thermosetting rubber component (B); and an anisotropic graphite powder oriented into a specified direction in the binder component.

Abstract: A power generation device converts vibrational energy into electric power using a vibrational power generation element in which an electret is provided on one substrate of substrates configured to be relatively movable while maintaining a mutually facing state, and supplies the electric power. A vibrational power generation element has the same configuration as the vibrational power generation element and converts vibrational energy into electric power. The vibrational power generation element is connected to a light-emitting diode via a bridge-type full wave rectifier circuit constituted by diodes, a smoothing circuit constituted by a capacitor, and a light-emitting diode drive circuit. A power generation state of the power generation device using the vibrational power generation element and the like is displayed by blinking of the light-emitting diode.

Abstract: A semiconductor device can reduce the number of bonding wires. The semiconductor device includes two or more semiconductor elements each of which has electrodes on a first main surface and a second main surface, an electrode plate that has one surface which is bonded to electrodes on the first main surfaces of the semiconductor elements, with a first bonding material layer interposed therebetween, and extends over the electrodes on the first main surfaces of the two or more semiconductor elements, and a conductive plate that includes a first lead terminal and a semiconductor element bonding portion which is bonded to electrodes on the second main surfaces of the semiconductor elements. A second bonding material layer is interposed therebetween, and is connected to the electrodes on the second main surfaces of the two or more semiconductor elements.

Abstract: A miniaturized semiconductor device includes a frame body having an opening region formed in a central portion, an insulating substrate which is provided in the opening region of the frame body and on which semiconductor chips are mounted, lead portions, each including an inclined portion that is at least partially exposed to the opening region formed in the frame body and extends so as to be inclined with respect to an end surface forming the opening region, and a bonding wire that is bonded between the lead portion and the semiconductor chip by ultrasonic bonding.

Abstract: The thermal conductive sheet of the present invention includes a base sheet and, on one surface of the base sheet, a metal foil (C) that has a thickness of from 1 to 30% of a thickness of the base sheet. The base sheet includes a binder component (A) that exhibits elasticity at room temperature and a graphite powder (B) that has anisotropy, and the graphite powder (B) is oriented in a thickness direction.

Abstract: A miniaturized semiconductor device includes a frame body having an opening region formed in a central portion, an insulating substrate which is provided in the opening region of the frame body and on which semiconductor chips are mounted, lead portions, each including an inclined portion that is at least partially exposed to the opening region formed in the frame body and extends so as to be inclined with respect to an end surface forming the opening region, and a bonding wire that is bonded between the lead portion and the semiconductor chip by ultrasonic bonding.

Abstract: A miniaturized semiconductor device includes a frame body having an opening region formed in a central portion, an insulating substrate which is provided in the opening region of the frame body and on which semiconductor chips are mounted, lead portions, each including an inclined portion that is at least partially exposed to the opening region formed in the frame body and extends so as to be inclined with respect to an end surface forming the opening region, and a bonding wire that is bonded between the lead portion and the semiconductor chip by ultrasonic bonding.

Abstract: A semiconductor device includes a plurality of semiconductor elements; first semiconductor chips including first semiconductor elements, the first semiconductor elements being defined as semiconductor elements in the plurality of semiconductor elements and having a current flowing greater than that of the other semiconductor elements; second semiconductor chips having second semiconductor elements, the second semiconductor elements being defined as semiconductor elements in the plurality of semiconductor elements for controlling the first semiconductor elements; an insulating substrate having a first wiring pattern bonded with the first semiconductor chips; and an insulating member having a second wiring pattern mounted with the second semiconductor chips.

Abstract: A miniaturized semiconductor device includes a frame body having an opening region formed in a central portion, an insulating substrate which is provided in the opening region of the frame body and on which semiconductor chips are mounted, lead portions, each including an inclined portion that is at least partially exposed to the opening region formed in the frame body and extends so as to be inclined with respect to an end surface forming the opening region, and a bonding wire that is bonded between the lead portion and the semiconductor chip by ultrasonic bonding.

Abstract: A semiconductor device includes an insulating circuit substrate mounted with at least one semiconductor element; a resin case having a bottom surface portion attached with the insulating circuit substrate and a side surface portion enclosing a periphery of the bottom surface portion; a lead molded integrally with the resin case and provided on a periphery of the insulating circuit substrate to be positioned on a surface of the bottom surface portion inside the resin case, the lead partially extending from inside the resin case to outside the resin case; and a sealing resin filled inside the resin case. A depressed portion is formed on two sides of the lead along a peripheral edge of the bottom surface portion inside the resin case.

Abstract: A wafer level package has a first wafer having a plurality of chips mounted or formed thereon in a plane, and a second wafer that is opposed to the first wafer. The first wafer and the second wafer are joined while a seal frame that seals a periphery of each chip is interposed therebetween. A gap is formed between the seal frames of the chips adjacent to each other. A partial connect part that partially connects the seal frames to each other is provided in the gap formed between the seal frames of the chips adjacent to each other.

Abstract: A semiconductor device can reduce the number of bonding wires. The semiconductor device includes two or more semiconductor elements each of which has electrodes on a first main surface and a second main surface, an electrode plate that has one surface which is bonded to electrodes on the first main surfaces of the semiconductor elements, with a first bonding material layer interposed therebetween, and extends over the electrodes on the first main surfaces of the two or more semiconductor elements, and a conductive plate that includes a first lead terminal and a semiconductor element bonding portion which is bonded to electrodes on the second main surfaces of the semiconductor elements. A second bonding material layer is interposed therebetween, and is connected to the electrodes on the second main surfaces of the two or more semiconductor elements.