Patents by Inventor Tomonori Yamashita

Tomonori Yamashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11240455
    Abstract: The present technology relates to an AD conversion device, an AD conversion method, an image sensor, and an electronic apparatus that are able to achieve high-speed, low-power-consumption AD conversion. In a case where an electrical signal and a variable-level reference signal are compared by a comparator and the result of comparison is used to perform AD (Analog to Digital) conversion of the electrical signal, control is exercised in such a manner that a bias current flowing in the comparator to operate the comparator during a certain section of the reference signal including a section where the reference signal changes is increased from a first current, which is larger than 0 (zero), to a second current, which is larger than the first current. The present technology is applicable, for example, to AD conversion of an electrical signal.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: February 1, 2022
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Tomonori Yamashita, Yosuke Ueno, Atsumi Niwa
  • Publication number: 20210368125
    Abstract: Provided is an image sensor including: a pixel section configured to include a plurality of pixels arranged therein; and an AD conversion unit configured to perform analog-to-digital (AD) conversion on a pixel signal on the basis of a result of comparison between a first voltage of a signal, which is obtained by adding, via capacitances, the pixel signal of the pixel and a reference signal that linearly changes in a direction opposite to the pixel signal, with a second voltage serving as a reference.
    Type: Application
    Filed: May 20, 2021
    Publication date: November 25, 2021
    Applicant: Sony Semiconductor Solutions Corporation
    Inventors: Atsumi Niwa, Tomonori Yamashita, Takashi Moue, Yosuke Ueno
  • Publication number: 20210297622
    Abstract: In a solid-state imaging element in which AD conversion using a reference signal is performed, power consumption of a circuit that generates the reference signal is reduced. A pixel section outputs a pixel signal based on the light amount of incident light. A reference signal supply section generates a first reference signal and a second reference signal. A comparison section includes a first differential pair transistor to which the pixel signal and a signal based on the first reference signal are inputted and a second differential pair transistor to which the second reference signal is inputted. A counter section performs counting on the basis of a signal from the comparison section.
    Type: Application
    Filed: April 26, 2019
    Publication date: September 23, 2021
    Inventors: MASAHIRO SEGAMI, TOMONORI YAMASHITA, YOUHEI OOSAKO
  • Publication number: 20210246948
    Abstract: Provided is a sintered bearing formed mainly of an iron structure (33) and a copper structure (31) which are formed of a partially diffusion-alloyed powder (11) of an iron powder (12) and a copper powder (13). The sintered bearing includes a copper structure (31d) formed of a granular elemental copper powder (13?) having a grain diameter of 45 ?m or less, the ratio of the copper structure (31d) being 10 mass % or less. With this, a further increase in strength of the sintered bearing can be realized.
    Type: Application
    Filed: April 29, 2021
    Publication date: August 12, 2021
    Inventors: Tomonori YAMASHITA, Yoshinori ITO, Daisuke TAKEDA, Yuta OHASHI
  • Publication number: 20210185256
    Abstract: The present technology relates to an AD conversion device, an AD conversion method, an image sensor, and an electronic apparatus that are able to achieve high-speed, low-power-consumption AD conversion. In a case where an electrical signal and a variable-level reference signal are compared by a comparator and the result of comparison is used to perform AD (Analog to Digital) conversion of the electrical signal, control is exercised in such a manner that a bias current flowing in the comparator to operate the comparator during a certain section of the reference signal including a section where the reference signal changes is increased from a first current, which is larger than 0 (zero), to a second current, which is larger than the first current. The present technology is applicable, for example, to AD conversion of an electrical signal.
    Type: Application
    Filed: July 14, 2017
    Publication date: June 17, 2021
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Tomonori YAMASHITA, Yosuke UENO, Atsumi NIWA
  • Patent number: 11039098
    Abstract: Provided is an image sensor including: a pixel section configured to include a plurality of pixels arranged therein; and an AD conversion unit configured to perform analog-to-digital (AD) conversion on a pixel signal on the basis of a result of comparison between a first voltage of a signal, which is obtained by adding, via capacitances, the pixel signal of the pixel and a reference signal that linearly changes in a direction opposite to the pixel signal, with a second voltage serving as a reference.
    Type: Grant
    Filed: February 19, 2018
    Date of Patent: June 15, 2021
    Assignee: Sony Semiconductor Solutions Corporation
    Inventors: Atsumi Niwa, Tomonori Yamashita, Takashi Moue, Yosuke Ueno
  • Patent number: 10907685
    Abstract: A sintered bearing (1) contains as main components iron, copper, a metal having a lower melting point than copper, and a solid lubricant. The sintered bearing (1) includes a surface layer (S1) and a base part (S2). The surface layer (S1) is formed mainly of flat copper powder arranged so as to be thinned in a thickness direction. In the base part (S2), an iron structure (33) and a copper structure (31c) brought into contact with the iron structure are formed of partially diffusion-alloyed powder in which copper powder is partially diffused in iron powder. Thus, a sintered bearing which achieves a balance between wear resistance of a bearing surface and strength of the bearing, and realizes low cost can be provided.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: February 2, 2021
    Assignee: NTN CORPORATION
    Inventors: Yoshinori Ito, Tomonori Yamashita
  • Publication number: 20210011468
    Abstract: A substrate processing system includes: an acquiring unit configured to acquire process data of each step when each step included in a predetermined process is executed under different control conditions; an extracting unit configured to divide each step into a first section in which the process data fluctuates and a second section in which the process data is converged, and extract first data belonging to the first section and second data belonging to the second section from the process data; and a monitoring unit configured to monitor the process data by comparing one or both of an evaluation value that evaluates the first data and an evaluation value that evaluates the second data with corresponding upper and lower limit values.
    Type: Application
    Filed: July 2, 2020
    Publication date: January 14, 2021
    Inventors: Nobutoshi TERASAWA, Noriaki KOYAMA, Tomonori YAMASHITA, Takazumi TANAKA, Takehiro KINOSHITA, Fumiaki NAGAI, Eiji KIKAMA
  • Patent number: 10840936
    Abstract: Provided is an AD conversion unit that includes a comparator to compare an electric signal with a reference signal having a variable level, and performs AD conversion of the electric signal by using a result of the comparison between the electric signal and the reference signal by the comparator. An attenuation unit attenuates the electric signal supplied to the comparator with the amplitude of the electric signal.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: November 17, 2020
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Masako Hasegawa, Ryuta Okamoto, Tomonori Yamashita, Atsumi Niwa, Yosuke Ueno
  • Publication number: 20200277989
    Abstract: Provided is a method of manufacturing a sintered bearing including, on an inner peripheral surface, a cylindrical portion and a one-side increased-diameter portion (increased-diameter portion), which are provided so as to be continuous in the axial direction. When sizing is performed on a sintered compact, the cylindrical portion and the one-side increased-diameter portion are molded on an inner peripheral surface of the sintered compact by press-fitting a cylindrical portion molding surface formed on a core into an inner peripheral surface of the sintered compact from the one side in the axial direction, and then by pressing a one-side increased-diameter portion molding surface provided so as to be continuous with the cylindrical portion molding surface in the axial direction against an inner peripheral surface of the sintered compact under a state in which an outer peripheral surface of the sintered compact is retained by a die.
    Type: Application
    Filed: May 19, 2020
    Publication date: September 3, 2020
    Inventors: Tomonori YAMASHITA, Yoshinori ITO, Takashi YAMAGUCHI
  • Publication number: 20200260034
    Abstract: A solid-state image pick-up device of the present disclosure includes a pixel array unit obtained by disposing a plurality of unit pixels, each of which includes a photoelectric conversion unit, in a matrix form, an amplifier unit that adjusts a level of a pixel signal output from a unit pixel through a vertical signal line provided to correspond to column arrangement of the pixel array unit, a sample and hold unit that samples and holds a pixel signal passing through the amplifier unit, and an analog-digital conversion unit that converts the pixel signal output from the sample and hold unit into a digital signal. Further, the sample and hold unit includes at least three capacitors that hold pixel signals and performs fetching of a pixel signal to one capacitor and outputting of an image signal fetched to another capacitor in advance to the analog-digital conversion unit in parallel.
    Type: Application
    Filed: September 4, 2018
    Publication date: August 13, 2020
    Inventors: TAKASHI MOUE, YOSUKE UENO, TOMONORI YAMASHITA, KAZUNORI HASEBE
  • Patent number: 10718370
    Abstract: A connecting rod module (1) includes: a connecting rod (10), which is formed of a sintered metal; and bearing raceway rings (outer rings (21, 31)), which are press-fitted into a through-hole (11a, 12a), respectively. The connecting rod (10) has a Young's modulus of from 120 GPa or more to 180 GPa or less. The outer rings (21, 31) each have a Young's modulus of from more than 180 GPa to 240 Gpa or less. When T represents a radial thickness of each of the outer rings (21, 31), D represents an inner diameter dimension of each of the through-holes (11a, 12a), and I represents an interference between the outer ring (21) and a peripheral wall of the through-hole (11a) or between the outer ring (31) and a peripheral wall of the through-hole (12a), the following equations are established: T=(0.05˜0.15)×D; and I=(0.0004˜0.004)×D.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: July 21, 2020
    Assignee: NTN CORPORATION
    Inventors: Tomonori Yamashita, Takehiro Matsuzuki
  • Patent number: 10718371
    Abstract: A connecting rod module (1) includes: a connecting rod (10), which is formed of a sintered metal; and bearing raceway rings (outer rings (21, 31)), which are press-fitted into a through-hole (11a, 12a), respectively. The connecting rod (10) has a Young's modulus of from 120 GPa or more to 180 GPa or less. The outer rings (21, 31) each have a Young's modulus of from more than 180 GPa to 240 GPa or less. When T represents a radial thickness of each of the outer rings (21, 31), D represents an inner diameter dimension of each of the through-holes (11a, 12a), and I represents an interference between the outer ring (21) and a peripheral wall of the through-hole (11a) or between the outer ring (31) and a peripheral wall of the through-hole (12a), the following equations are established: T=(0.05˜0.15)×D; and I=(0.0004˜0.004)×D.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: July 21, 2020
    Assignee: NTN CORPORATION
    Inventors: Tomonori Yamashita, Takehiro Matsuzuki
  • Publication number: 20200217355
    Abstract: A connecting rod module (1) includes: a connecting rod (10), which is formed of a sintered metal; and bearing raceway rings (outer rings (21, 31)), which are press-fitted into a through-hole (11a, 12a), respectively. The connecting rod (10) has a Young's modulus of from 120 GPa or more to 180 GPa or less. The outer rings (21, 31) each have a Young's modulus of from more than 180 GPa to 240 GPa or less. When T represents a radial thickness of each of the outer rings (21, 31), D represents an inner diameter dimension of each of the through-holes (11a, 12a), and I represents an interference between the outer ring (21) and a peripheral wall of the through-hole (11a) or between the outer ring (31) and a peripheral wall of the through-hole (12a), the following equations are established: T=(0.05˜0.15)×D; and I=(0.0004˜0.004)×D.
    Type: Application
    Filed: March 3, 2020
    Publication date: July 9, 2020
    Inventors: Tomonori YAMASHITA, Takehiro MATSUZUKI
  • Patent number: 10697496
    Abstract: A sintered bearing includes a cylindrical portion, one-side increased-diameter portion and another-side increased-diameter portion. A metal structure of the another-side increased-diameter portion has a higher density than a metal structure of a core portion of the sintered compact. A metal structure of the cylindrical portion has an expansion along a direction of ironing by the sizing core and a higher density than the metal structure of the another-side increased-diameter portion. A metal structure of the one-side increased-diameter portion has an expansion along a direction of ironing by the sizing core and a higher density than the metal structure of the cylindrical portion.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: June 30, 2020
    Assignee: NTN CORPORATION
    Inventors: Tomonori Yamashita, Yoshinori Ito, Takashi Yamaguchi
  • Publication number: 20200053308
    Abstract: Provided is an image sensor including: a pixel section configured to include a plurality of pixels arranged therein; and an AD conversion unit configured to perform analog-to-digital (AD) conversion on a pixel signal on the basis of a result of comparison between a first voltage of a signal, which is obtained by adding, via capacitances, the pixel signal of the pixel and a reference signal that linearly changes in a direction opposite to the pixel signal, with a second voltage serving as a reference.
    Type: Application
    Filed: February 19, 2018
    Publication date: February 13, 2020
    Applicant: Sony Semiconductor Solutions Corporation
    Inventors: Atsumi Niwa, Tomonori Yamashita, Takashi Moue, Yosuke Ueno
  • Publication number: 20190305792
    Abstract: The present technology relates to a sensor, a driving method, and an electronic device that are capable of improving the dynamic range and noise of AD conversion. An AD conversion unit includes a comparator configured to compare an electric signal with a reference signal having a variable level, and performs AD conversion of the electric signal by using a result of the comparison between the electric signal and the reference signal by the comparator. An attenuation unit attenuates the electric signal supplied to the comparator in accordance with the amplitude of the electric signal. The present technology is applicable to, for example, a case where AD conversion is performed on an electric signal.
    Type: Application
    Filed: July 14, 2017
    Publication date: October 3, 2019
    Inventors: MASAKO HASEGAWA, RYUTA OKAMOTO, TOMONORI YAMASHITA, ATSUMI NIWA, YOSUKE UENO
  • Publication number: 20190257356
    Abstract: A sintered bearing (1) contains as main components iron, copper, a metal having a lower melting point than copper, and a solid lubricant. The sintered bearing (1) includes a surface layer (S1) and a base part (S2). The surface layer (S1) is formed mainly of flat copper powder arranged so as to be thinned in a thickness direction. In the base part (S2), an iron structure (33) and a copper structure (31c) brought into contact with the iron structure are formed of partially diffusion-alloyed powder in which copper powder is partially diffused in iron powder. Thus, a sintered bearing which achieves a balance between wear resistance of a bearing surface and strength of the bearing, and realizes low cost can be provided.
    Type: Application
    Filed: May 3, 2019
    Publication date: August 22, 2019
    Inventors: Yoshinori ITO, Tomonori YAMASHITA
  • Publication number: 20180274583
    Abstract: A connecting rod module (1) includes: a connecting rod (10), which is formed of a sintered metal; and bearing raceway rings (outer rings (21, 31)), which are press-fitted into a through-hole (11a, 12a), respectively. The connecting rod (10) has a Young's modulus of from 120 GPa or more to 180 GPa or less. The outer rings (21, 31) each have a Young's modulus of from more than 180 GPa to 240 Gpa or less. When T represents a radial thickness of each of the outer rings (21, 31), D represents an inner diameter dimension of each of the through-holes (11a, 12a), and I represents an interference between the outer ring (21) and a peripheral wall of the through-hole (11a) or between the outer ring (31) and a peripheral wall of the through-hole (12a), the following equations are established: T=(0.05˜0.15)×D; and I=(0.0004˜0.004)×D.
    Type: Application
    Filed: August 31, 2016
    Publication date: September 27, 2018
    Inventors: Tomonori YAMASHITA, Takehiro MATSUZUKI
  • Publication number: 20180112712
    Abstract: Provided is a method of manufacturing a sintered bearing including, on an inner peripheral surface, a cylindrical portion and a one-side increased-diameter portion (increased-diameter portion), which are provided so as to be continuous in the axial direction. When sizing is performed on a sintered compact, the cylindrical portion and the one-side increased-diameter portion are molded on an inner peripheral surface of the sintered compact by press-fitting a cylindrical portion molding surface formed on a core into an inner peripheral surface of the sintered compact from the one side in the axial direction, and then by pressing a one-side increased-diameter portion molding surface provided so as to be continuous with the cylindrical portion molding surface in the axial direction against an inner peripheral surface of the sintered compact under a state in which an outer peripheral surface of the sintered compact is retained by a die.
    Type: Application
    Filed: March 7, 2016
    Publication date: April 26, 2018
    Inventors: Tomonori YAMASHITA, Yoshinori ITO, Takashi YAMAGUCHI