Abstract: A laser machining apparatus includes an actuator that changes relative positions of a machining head and a workpiece; a control unit that controls in machining execution the laser oscillator, the machining head, and the actuator based on a machining parameter; a machining state observation unit that detects, from process light that is light generated from the workpiece by laser beam irradiation, light intensities in a plurality of predetermined wavelength bands as a plurality of optical sensor signals; a feature extraction unit that extracts at least one of features, the features being obtainable from an index of correlation between the plurality of optical sensor signals and from one of the optical sensor signals; and a correction quantity calculation unit that determines the machining parameter to be corrected as a correction parameter and a correction quantity for the correction parameter based on the at least one of the features.

Abstract: A laser machining apparatus includes an output ratio control unit that changes an output ratio between a first laser beam and a second laser beam having different propagation characteristics; a superimposing optical system that multiplexes the first laser beam and the second laser beam; an optical fiber in which beam propagation characteristics of a combined laser beam at an exit varies depending on the output ratio, the combined laser beam being a laser beam obtained by combination of the first laser beam and the second laser beam; and a condensing optical system that performs machining of a workpiece by concentrating, on the workpiece, the beam emitted from the optical fiber.

Abstract: A semiconductor laser device includes semiconductor laser elements emitting laser beams having different wavelengths from each other and a partial reflection element. The semiconductor laser elements and the partial reflection element constitute respective ends of an external resonator. Further, there is a transmissive wavelength dispersion element located on optical paths of the laser beams between the semiconductor laser elements and the partial reflection element and at a position where the laser beams are superimposed. The transmissive wavelength dispersion element has a wavelength dispersion property, and changes traveling directions of the laser beams in a first plane including the optical axes of the laser beams to combine the laser beams to have one optical axis. Also, there is an asymmetric refraction optical element located on an optical path between the transmissive wavelength dispersion element and the partial reflection element.

Abstract: A laser machining apparatus includes: a laser oscillator that emits laser light having a plurality of wavelengths; a transmission diffractive optical element that allows the laser light to pass therethrough; a machining lens that concentrates the laser light that has passed through the transmission diffractive optical element; a distance adjustment mechanism that changes a distance between the transmission diffractive optical element and the machining lens; and an angle adjustment mechanism that changes an angle of the transmission diffractive optical element to switch between a state in which the laser light is dispersed by the transmission diffractive optical element and then enters the machining lens and a state in which the laser light enters the machining lens without being dispersed by the transmission diffractive optical element.

Abstract: A wavelength combining laser apparatus includes: a semiconductor laser emitting laser beams in an optical-axial direction perpendicular to a laser beam combining direction; a wavelength combining element combining the laser beams in the laser beam combining direction into a single laser beam; a cross-coupling reduction optical system having positive power in the laser beam combining direction perpendicular to an optical axis of the single laser beam output from the wavelength combining element; and a partially-reflective mirror reflecting the single laser beam having passed through the cross-coupling reduction optical system and also allowing the single laser beam to transmit through and exit the partially-reflective mirror.

Abstract: A laser device includes a plurality of laser diodes that generate laser light beams having different wavelengths from each other, a partial reflective mirror constituting a resonator along with the laser diodes, a wavelength dispersive element set in the resonator, which combines parts of the laser light beams outputted by the laser diodes to each other, emits the combined parts of the laser light beams as a first laser light beam toward the partial reflective mirror, and emits other parts of the laser light beams as second laser light beams in directions different from the direction toward the partial reflective mirror, and an output detecting unit detecting intensities of the second laser light beams.

Abstract: A laser device includes a plurality of laser diodes that generate laser light beams having different wavelengths from each other, a partial reflective mirror constituting a resonator along with the laser diodes, a wavelength dispersive element set in the resonator, which combines parts of the laser light beams outputted by the laser diodes to each other, emits the combined parts of the laser light beams as a first laser light beam toward the partial reflective mirror, and emits other parts of the laser light beams as second laser light beams in directions different from the direction toward the partial reflective mirror, and an output detecting unit detecting intensities of the second laser light beams.

Abstract: A laser machining device includes a plurality of oscillators to emit laser beams having different wavelengths from each other; a machining head to emit laser beams emitted from the respective oscillators to a machining object; a plurality of transmission fibers to transmit the laser beams to the machining head; a wavelength dispersion element; and a focusing lens to superpose the laser beams emitted from the transmission fibers, wherein the wavelength dispersion element is arranged at a position at which the laser beams are superposed by the focusing lens.

Abstract: A laser oscillator includes: an external resonator configured to include laser media to emit laser beams having different wavelengths; and a partially reflective mirror to transmit part of the laser beams and reflect and return a remainder toward the laser media. The external resonator includes therein: a diffraction grating to perform wavelength coupling on the laser beams having different wavelengths emitted from the laser media so as to superimpose the laser beams into one laser beam and to emit, to the partially reflective mirror, the one laser beam; and a prism that is placed between the laser media and the diffraction grating and that superimposes the laser beams into one laser beam on the diffraction grating, the prism including two surfaces forming an apex angle, one of the two surfaces being an incident surface and another of the two surfaces being an exit surface.

Abstract: A laser oscillator includes: a plurality of laser media to emit laser beams having different wavelengths; a diffraction grating to emit, in a superimposed state, the laser beams incident from the laser media; a partially reflective element to reflect part of the laser beams emitted from the diffraction grating and return the part of the laser beams to the diffraction grating, and to transmit a remainder; and a plurality of lenses each disposed between a corresponding one of the laser media and the diffraction grating. The lenses are each disposed in an optical path formed between a corresponding one of the laser media and the diffraction grating, and the lenses superimpose the laser beams from the laser media on an incident surface of the diffraction grating such that the laser beams have an equal outer diameter.

Abstract: A wavelength combining laser apparatus includes: a semiconductor laser emitting laser beams in an optical-axial direction perpendicular to a laser beam combining direction; a wavelength combining element combining the laser beams in the laser beam combining direction into a single laser beam; a cross-coupling reduction optical system having positive power in the laser beam combining direction perpendicular to an optical axis of the single laser beam output from the wavelength combining element; and a partially-reflective mirror reflecting the single laser beam having passed through the cross-coupling reduction optical system and also allowing the single laser beam to transmit through and exit the partially-reflective mirror.

Abstract: A laser machining device includes a plurality of oscillators to emit laser beams having different wavelengths from each other; a machining head to emit laser beams emitted from the respective oscillators to a machining object; a plurality of transmission fibers to transmit the laser beams to the machining head; a wavelength dispersion element; and a focusing lens to superpose the laser beams emitted from the transmission fibers, wherein the wavelength dispersion element is arranged at a position at which the laser beams are superposed by the focusing lens.

Abstract: A laser device causes, with a plurality of laser media that generate laser beams having wavelengths different from one another, a convergent lens to cause laser beams each emitted from the plurality of laser media to overlap one another on a dispersive element to form a single combined beam. The dispersive element is positioned where the plurality of laser beams are caused to overlap one another by the convergent lens to form a single beam, causes a portion of the plurality of laser beams to return back toward the laser media as a first laser beam flux, and outputs another portion of the plurality of laser beams as a second laser beam flux having a single optical axis.

Abstract: A laser oscillator includes: a plurality of laser media to emit laser beams having different wavelengths; a diffraction grating to emit, in a superimposed state, the laser beams incident from the laser media; a partially reflective element to reflect part of the laser beams emitted from the diffraction grating and return the part of the laser beams to the diffraction grating, and to transmit a remainder; and a plurality of lenses each disposed between a corresponding one of the laser media and the diffraction grating. The lenses are each disposed in an optical path formed between a corresponding one of the laser media and the diffraction grating, and the lenses superimpose the laser beams from the laser media on an incident surface of the diffraction grating such that the laser beams have an equal outer diameter.

Abstract: A laser device causes, with a plurality of laser media that generate laser beams having wavelengths different from one another, a convergent lens to cause laser beams each emitted from the plurality of laser media to overlap one another on a dispersive element to form a single combined beam. The dispersive element is positioned where the plurality of laser beams are caused to overlap one another by the convergent lens to form a single beam, causes a portion of the plurality of laser beams to return back toward the laser media as a first laser beam flux, and outputs another portion of the plurality of laser beams as a second laser beam flux having a single optical axis.

Abstract: A laser oscillation apparatus includes a wave plate and a diffraction grating disposed between a laser beam source and a partial reflection mirror. The wave plate changes polarization directions of laser beams emitted from semiconductor lasers to a second direction perpendicular to a first direction. The diffraction grating is disposed at a position where laser beams polarized in the first direction are superposed into one beam and laser beams whose polarization directions are changed to the second direction are superposed into one beam, superposes laser beams polarized in the first direction to have one optical axis, superposes laser beams polarized in the second direction to have one optical axis, and outputs superposed laser beams toward the partial reflection mirror. The laser oscillation apparatus includes a birefringent element to combine laser beams having mutually different optical axes output from the partial reflection mirror into one laser beams having one optical axis.

Abstract: A laser oscillation apparatus includes a wave plate and a diffraction grating disposed between a laser beam source and a partial reflection mirror. The wave plate changes polarization directions of laser beams emitted from semiconductor lasers to a second direction perpendicular to a first direction. The diffraction grating is disposed at a position where laser beams polarized in the first direction are superposed into one beam and laser beams whose polarization directions are changed to the second direction are superposed into one beam, superposes laser beams polarized in the first direction to have one optical axis, superposes laser beams polarized in the second direction to have one optical axis, and outputs superposed laser beams toward the partial reflection mirror. The laser oscillation apparatus includes a birefringent element to combine laser beams having mutually different optical axes output from the partial reflection mirror into one laser beams having one optical axis.

Abstract: A laser oscillator includes: an external resonator configured to include laser media to emit laser beams having different wavelengths; and a partially reflective mirror to transmit part of the laser beams and reflect and return a remainder toward the laser media. The external resonator includes therein: a diffraction grating to perform wavelength coupling on the laser beams having different wavelengths emitted from the laser media so as to superimpose the laser beams into one laser beam and to emit, to the partially reflective mirror, the one laser beam; and a prism that is placed between the laser media and the diffraction grating and that superimposes the laser beams into one laser beam on the diffraction grating, the prism including two surfaces forming an apex angle, one of the two surfaces being an incident surface and another of the two surfaces being an exit surface.

Abstract: A laser machining apparatus includes: a laser oscillator that emits laser light (L) having a plurality of wavelengths; a transmission diffractive optical element (21) that allows the laser light (L) to pass therethrough; a machining lens (3) that concentrates the laser light (L) that has passed through the transmission diffractive optical element (21); a distance adjustment mechanism (31) that changes a distance between the transmission diffractive optical element (21) and the machining lens (3); and an angle adjustment mechanism (32) that changes an angle of the transmission diffractive optical element (21) to switch between a state in which the laser light (L) is dispersed by the transmission diffractive optical element (21) and then enters the machining lens (3) and a state in which the laser light (L) enters the machining lens (3) without being dispersed by the transmission diffractive optical element (21).

Abstract: A laser processing method that can reduce warpage occurring in a glass and reduce a stress generated on the glass at a time of releasing a protective material from the glass. The laser processing method includes: forming the protective materials on both surfaces of the glass; processing the glass by radiating a laser beam onto the glass together with the protective materials after the protective material formation; and releasing the protective materials from the glass after the laser processing.