Patents by Inventor Tomotaka Sakatani

Tomotaka Sakatani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060076673
    Abstract: A semiconductor device has a plurality of external connection lead terminals including an input lead terminal, an output lead terminal, and an RF grounding lead terminal, a heat dissipation plate connected to the RF grounding lead terminal, a semiconductor device and a printed circuit board each mounted on the heat dissipation plate, and a mold resin for sealing the semiconductor device, the printed circuit board, and the heat dissipation plate such that at least a part of the back surface of the heat dissipation plate is exposed. The semiconductor device amplifies a signal inputted to the input lead terminal and outputs the amplified signal from the output lead terminal.
    Type: Application
    Filed: September 15, 2005
    Publication date: April 13, 2006
    Inventors: Masayuki Miyaji, Sadao Nagata, Hirotada Taniuchi, Yorito Ota, Takahiro Iwakiri, Tomotaka Sakatani