Patents by Inventor Tomoya DAIZO

Tomoya DAIZO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220013448
    Abstract: A wiring substrate includes a resin insulating layer, a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer, a conductor pad formed on the resin insulating layer and connected to the via conductor, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post formed on the conductor pad and protruding from the coating insulating layer. The conductor pad is formed such that a central axis of the conductor pad is shifted in a predetermined direction with respect to a central axis of the via conductor, and the metal post is formed such that a central axis of the metal post is shifted in the predetermined direction with respect to the central axis of the conductor pad.
    Type: Application
    Filed: June 28, 2021
    Publication date: January 13, 2022
    Applicant: IBIDEN CO., LTD.
    Inventors: Isao OHNO, Tomoya DAIZO, Yoji SAWADA, Kazuhiko KURANOBU
  • Publication number: 20220015234
    Abstract: A wiring substrate includes a resin insulating layer, a conductor pad formed on the resin insulating layer, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post connected to the conductor pad and protruding from the coating insulating layer such that a gap is formed between the metal post and the conductor pad at a peripheral edge of the metal post. The coating insulating layer is formed such that the coating insulating layer has an interposed portion formed in the gap between the metal post and the conductor pad at the peripheral edge of the metal post.
    Type: Application
    Filed: June 28, 2021
    Publication date: January 13, 2022
    Applicant: IBIDEN CO., LTD.
    Inventors: Isao OHNO, Tomoya DAIZO, Yoji SAWADA, Kazuhiko KURANOBU
  • Publication number: 20220013455
    Abstract: A wiring substrate includes a resin insulating layer, a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer, a conductor pad formed on the resin insulating layer and connected to the via conductor, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post formed on the conductor pad and protruding from the coating insulating layer. The via conductor is formed such that the via conductor is increased in diameter toward the conductor pad, and the metal post is formed such that the metal post is increased in diameter toward the conductor pad.
    Type: Application
    Filed: June 29, 2021
    Publication date: January 13, 2022
    Applicant: IBIDEN CO., LTD.
    Inventors: Isao OHNO, Tomoya DAIZO, Yoji SAWADA, Kazuhiko KURANOBU
  • Publication number: 20220013409
    Abstract: A method for manufacturing a wiring substrate includes forming multiple conductor pads on an insulating layer such that the conductor pads include multiple first conductor pads and multiple second conductor pads, forming multiple protruding parts on surfaces of the first conductor pads of the conductor pads, respectively, forming a resin layer such that the resin layer covers the insulating layer and the conductor pads, exposing, from the resin layer, end portions of the protruding parts on the opposite side with respect to the insulating layer, forming, in the resin layer, multiple openings such that the openings expose surfaces of the second conductor pads of the conductor pads, respectively; and forming a coating film on the surfaces of the second conductor pads exposed in the openings.
    Type: Application
    Filed: June 29, 2021
    Publication date: January 13, 2022
    Applicant: IBIDEN CO., LTD.
    Inventors: Isao OHNO, Tomoya DAIZO, Yoji SAWADA, Kazuhiko KURANOBU
  • Publication number: 20210257224
    Abstract: A manufacturing method of a wiring substrate includes forming an interlayer insulating layer on a substrate, forming a metal film on a surface of the insulating layer such that the metal film covers the surface of the insulating layer, etching a surface of the metal film on the opposite side with respect to the insulating layer such that the surface of the metal film is roughened, forming a dry film on the roughened surface of the metal film such that the dry film has an opening formed in the dry film, forming an electrolytic plating film in the opening using the metal film as a power feeding layer, removing the dry film from the metal film, and removing part of the metal film exposed from the plating film by the dry film removing such that the part of the metal film is removed from the surface of the insulating layer.
    Type: Application
    Filed: January 27, 2021
    Publication date: August 19, 2021
    Applicant: IBIDEN CO., LTD.
    Inventors: Kazuhiko KURANOBU, Tomoya DAIZO
  • Patent number: 9401320
    Abstract: A combined substrate includes a first substrate having multiple first metal posts, a second substrate having multiple second metal posts such that the second metal posts are positioned to oppose the first metal posts, respectively, and multiple solder structures interposed between the first metal posts and the second metal posts, respectively. The first metal posts and/or the second metal posts have recessed surfaces formed such that the solder structures are formed on the recessed surfaces, respectively.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: July 26, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Tomoya Daizo, Takema Adachi, Takeshi Furusawa, Wataru Nakamura, Yuki Ito, Yuki Yoshikawa, Tomoyoshi Hirabayashi
  • Publication number: 20150255433
    Abstract: A combined substrate includes a first substrate having multiple first metal posts, a second substrate having multiple second metal posts such that the second metal posts are positioned to oppose the first metal posts, respectively, and multiple solder structures interposed between the first metal posts and the second metal posts, respectively. The first metal posts and/or the second metal posts have recessed surfaces formed such that the solder structures are formed on the recessed surfaces, respectively.
    Type: Application
    Filed: March 4, 2015
    Publication date: September 10, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Tomoya DAIZO, Takema Adachi, Takeshi Furusawa, Wataru Nakamura, Yuki Ito, Yuki Yoshikawa, Tomoyoshi Hirabayashi
  • Publication number: 20150156880
    Abstract: A printed wiring board includes a core substrate, a first build-up layer formed on first surface of the substrate and having a recess formed to accommodate an electronic component, a second build-up layer formed on second surface of the substrate, and multiple pads including first pads on the first layer, second pads on the second layer, and third pads in bottom surface of the recess. The first and second layers have interlayer insulating layers, the insulating layers in interior portion of the first layer between the substrate and the bottom surface of the recess has number of insulating layers equal to number of insulating layers in the second layer, and the insulating layers in exterior portion of the first layer between the core substrate and the surface of the first layer has number of insulating layers greater than number of insulating layers in the second layer.
    Type: Application
    Filed: November 28, 2014
    Publication date: June 4, 2015
    Applicant: IBIDEN CO., LTD.
    Inventor: Tomoya DAIZO