Abstract: A semiconductor device includes: a semiconductor substrate; a plurality of metal terminals that are formed on a surface of the semiconductor substrate on the opposite side to a circuit-forming surface; and a resin that is formed on the surface of the semiconductor substrate on the opposite side to the circuit-forming surface, and covers at least part of side surfaces of the metal terminals, wherein upper surfaces of the metal terminals are exposed from the resin.

Abstract: A wiring board includes a first conductor constituting a signal line, a second conductor constituting a ground conductor or a power conductor, a dielectric layer disposed between and separately the first and second conductors, and a third conductor arranged between the first and second conductor, the third conductor being connected to the second conductor, and having a width narrower than that of the first conductor, the third conductor entirely opposing the first conductor, the entire portion of the third conductor being covered by the first conductor.

Abstract: An optical module with a first optical waveguide substrate having end faces; a second optical waveguide substrate which includes a first optical waveguide, a second optical waveguide, and end faces, the second optical waveguide substrate having an opening between the first optical waveguide and the second optical waveguide; and a first deflection device which is mounted in the opening, wherein one of the end faces of the first optical waveguide substrate and one of the end faces of the second optical waveguide substrate are coupled to each other.

Abstract: An optical module with a plurality of optical waveguide substrates having element mounting openings and end surfaces which are adhered to each other with an optical adhesive; and a plurality of light deflecting element arrays mounted to the respective element mounting openings of the plurality of optical waveguide substrates, the plurality of light deflecting element arrays including a plurality of light deflecting elements.

Abstract: An optical module with a first optical waveguide substrate having end faces; a second optical waveguide substrate which includes a first optical waveguide, a second optical waveguide, and end faces, the second optical waveguide substrate having an opening between the first optical waveguide and the second optical waveguide; and a first deflection device which is mounted in the opening, wherein one of the end faces of the first optical waveguide substrate and one of the end faces of the second optical waveguide substrate are coupled to each other.

Abstract: An optical module with a plurality of optical waveguide substrates having element mounting openings and end surfaces which are adhered to each other with an optical adhesive; and a plurality of light deflecting element arrays mounted to the respective element mounting openings of the plurality of optical waveguide substrates, the plurality of light deflecting element arrays including a plurality of light deflecting elements.

Abstract: An optoelectronic component is mounted at a precise position on a waveguide substrate so as to reduce loss in propagating light, and electrically connect electrodes on the waveguide substrate and the optoelectronic component. The waveguide substrate has an optical waveguide and a recessed portion for mounting the optoelectronic component, and electrodes are arranged on the recessed portion. A great number of globular elastic conductive particles are distributed on the bottom surface of the recessed portion. Thereafter, the optoelectronic component is placed in the recessed portion so as to press the globular elastic conductive particles, and alignment between the optical waveguide in the waveguide substrate and an optical waveguide in the optoelectronic component is adjusted. Then, the optoelectronic component is fixed to the waveguide substrate with an optical adhesive while the alignment is precisely adjusted.

Abstract: An optoelectronic component is mounted at a precise position on a waveguide substrate so as to reduce loss in propagating light, and electrically connect electrodes on the waveguide substrate and the optoelectronic component. The waveguide substrate has an optical waveguide and a recessed portion for mounting the optoelectronic component, and electrodes are arranged on the recessed portion. A great number of globular elastic conductive particles are distributed on the bottom surface of the recessed portion. Thereafter, the optoelectronic component is placed in the recessed portion so as to press the globular elastic conductive particles, and alignment between the optical waveguide in the waveguide substrate and an optical waveguide in the optoelectronic component is adjusted. Then, the optoelectronic component is fixed to the waveguide substrate with an optical adhesive while the alignment is precisely adjusted.

Abstract: The instant invention has an exemplified object to provide an inkjet head and recording device having such an inkjet head with a simpler structure as achieves higher quality of printing inexpensively than the conventional. The pressure-chamber plate of this invention is slit or divided into a plurality of elements.

Abstract: A water-repellent coating having a higher wiping resistance against a wiper and capable of being formed by a more simplified process than was previously possible. The method of forming the water-repellent coating comprises a flat hard body and a plating-processed fluoric polymer which are formed on a nozzle plate having a nozzle as a substrate around the nozzle.