Patents by Inventor Tooru KONDOU

Tooru KONDOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200055978
    Abstract: A sheet-molding compound comprising a thickened thermosetting resin composition and reinforcing fiber bundles. The thermosetting resin composition comprises components (A), (B) and (D). The content of component (D) is 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the total amount of epoxy resin. The final viscosity of the thickened thermosetting resin composition is 150 Pa·s to 20000 Pa·s, and the minimum viscosity is 2 Pa·s to 600 Pa·s, the final viscosity being higher than the minimum viscosity.
    Type: Application
    Filed: October 16, 2019
    Publication date: February 20, 2020
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Akira OOTA, Masahiro Ichino, Takuya Teranishi, Tooru Kondou, Mitsuru Kutsuwada
  • Patent number: 10494475
    Abstract: A sheet-molding compound comprising a thickened thermosetting resin composition and reinforcing fiber bundles. The thermosetting resin composition comprises components (A), (B) and (D). The content of component (D) is 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the total amount of epoxy resin. The final viscosity of the thickened thermosetting resin composition is 150 Pa·s to 20000 Pa·s, and the minimum viscosity is 2 Pa·s to 600 Pa·s, the final viscosity being higher than the minimum viscosity.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: December 3, 2019
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Akira Oota, Masahiro Ichino, Takuya Teranishi, Tooru Kondou, Mitsuru Kutsuwada
  • Publication number: 20180142057
    Abstract: A sheet-molding compound comprising a thickened thermosetting resin composition and reinforcing fiber bundles. The thermosetting resin composition comprises components (A), (B) and (D). The content of component (D) is 10 parts by mass to 30 parts by mass with respect to 100 parts by mass of the total amount of epoxy resin. The final viscosity of the thickened thermosetting resin composition is 150 Pa·s to 20000 Pa·s, and the minimum viscosity is 2 Pa·s to 600 Pa·s, the final viscosity being higher than the minimum viscosity.
    Type: Application
    Filed: May 13, 2016
    Publication date: May 24, 2018
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Akira OOTA, Masahiro ICHINO, Takuya TERANISHI, Tooru KONDOU, Mitsuru KUTSUWADA