Patents by Inventor Tooru Serizawa

Tooru Serizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8339743
    Abstract: A main object of the present invention is to provide a substrate for suspension which is produced at low costs and can sufficiently attain the prevention of damage by electrostatic discharge and restraint of noises. To attain the object, the present invention provides a substrate for suspension, comprising: a metallic substrate, an insulating layer formed on the metallic formed in substrate and having an opening from which the metallic substrate is exposed, a grounding-wiring layer formed on the insulating layer and arranged near the opening, and a ground terminal formed in the opening and contacting the metallic substrate and the grounding-wiring layer, characterized in that the ground terminal is made of a metal having a melting point of 450° C. or lower.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: December 25, 2012
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoichi Miura, Tooru Serizawa, Shinichiro Busujima
  • Publication number: 20120003567
    Abstract: A separator for flat-type polymer electrolyte fuel cells comprises a fuel-feed-side separator and an oxygen-feed-side separator, each comprising a collector portion in which n unit conductive substrates (n is an integer of 2 or more), each having a plurality of through-holes, are arrayed in flat configuration via gaps, and a pair of insulating frames which have n openings in alignment with an array position of the unit conductive substrates and are integrated in such a way as to hold the collector portion between them. The back-to-back (n?1) unit conductive substrates of the n unit conductive substrates in one of both separators, as counted from the end of its array direction, and the 2nd to nth unit conductive substrates of the n unit conductive substrates in another separator, as counted from the end of its array direction are successively joined together by means of (n?1) connecting hinges.
    Type: Application
    Filed: September 14, 2011
    Publication date: January 5, 2012
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Tooru SERIZAWA, Yasuhiro Uchida, Takanori Maeda, Hiroshi Yagi
  • Publication number: 20120000698
    Abstract: A main object of the present invention is to provide a substrate for suspension which is produced at low costs and can sufficiently attain the prevention of damage by electrostatic discharge and restraint of noises. To attain the object, the present invention provides a substrate for suspension, comprising: a metallic substrate, an insulating layer formed on the metallic formed in substrate and having an opening from which the metallic substrate is exposed, a grounding-wiring layer formed on the insulating layer and arranged near the opening, and a ground terminal formed in the opening and contacting the metallic substrate and the grounding-wiring layer, characterized in that the ground terminal is made of a metal having a melting point of 450° C. or lower.
    Type: Application
    Filed: September 9, 2011
    Publication date: January 5, 2012
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Yoichi MIURA, Tooru SERIZAWA, Shinichiro BUSUJIMA
  • Patent number: 8040635
    Abstract: A substrate for suspension which is produced at low costs and can sufficiently attain the prevention of damage by electrostatic discharge and restraint of noises. The substrate for suspension includes: a metallic substrate, an insulating layer formed on the metallic substrate and having an opening from which the metallic substrate is exposed, a grounding-wiring layer formed on the insulating layer and arranged near the opening, and a ground terminal formed in the opening and contacting the metallic substrate and the grounding-wiring layer. The ground terminal is made of a metal having a melting point of 450° C. or lower.
    Type: Grant
    Filed: June 20, 2007
    Date of Patent: October 18, 2011
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoichi Miura, Tooru Serizawa, Shinichiro Busujima
  • Patent number: 8039168
    Abstract: A separator for flat-type polymer electrolyte fuel cells comprises a fuel-feed-side separator and an oxygen-feed-side separator, each comprising a collector portion in which n unit conductive substrates (n is an integer of 2 or more), each having a plurality of through-holes, are arrayed in flat configuration via gaps, and a pair of insulating frames which have n openings in alignment with an array position of the unit conductive substrates and are integrated in such a way as to hold the collector portion between them. The back-to-back (n?1) unit conductive substrates of the n unit conductive substrates in one of both separators, as counted from the end of its array direction, and the 2nd to nth unit conductive substrates of the n unit conductive substrates in another separator, as counted from the end of its array direction are successively joined together by means of (n?1) connecting hinges.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: October 18, 2011
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Tooru Serizawa, Yasuhiro Uchida, Takanori Maeda, Hiroshi Yagi
  • Patent number: 7919212
    Abstract: The object of the invention is to provide a separator for fuel cells which is of improved strength and corrosion resistance and facilitates the assembling of unit cells. The separator comprises an electrically conductive resin layer formed by electrodeposition in such a way as to cover a metal substrate and a gasket component. The resin layer contains an electrically conductive material. The separator of the invention has thus an enhanced corrosion resistance, makes some considerable improvements in the assembling work efficiency of unit cells, and makes sure higher strength because of the use of the metal substrate.
    Type: Grant
    Filed: April 6, 2007
    Date of Patent: April 5, 2011
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hiroshi Yagi, Tooru Serizawa, Yasuhiro Uchida, Koichi Suzuki
  • Patent number: 7679925
    Abstract: A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.
    Type: Grant
    Filed: July 20, 2006
    Date of Patent: March 16, 2010
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yoshitaka Fukuoka, Tooru Serizawa, Hiroshi Yagi, Osamu Shimada, Hiroyuki Hirai, Yuji Yamaguchi
  • Publication number: 20090190263
    Abstract: A substrate for suspension which is produced at low costs and can sufficiently attain the prevention of damage by electrostatic discharge and restraint of noises. The substrate for suspension includes: a metallic substrate, an insulating layer formed on the metallic substrate and having an opening from which the metallic substrate is exposed, a grounding-wiring layer formed on the insulating layer and arranged near the opening, and a ground terminal formed in the opening and contacting the metallic substrate and the grounding-wiring layer. The ground terminal is made of a metal having a melting point of 450° C. or lower.
    Type: Application
    Filed: June 20, 2007
    Publication date: July 30, 2009
    Inventors: Yoichi Miura, Tooru Serizawa, Shinichiro Busujima
  • Publication number: 20090155663
    Abstract: A separator for flat-type polymer electrolyte fuel cells comprises a fuel-feed-side separator and an oxygen-feed-side separator, each comprising a collector portion in which n unit conductive substrates (n is an integer of 2 or more), each having a plurality of through-holes, are arrayed in flat configuration via gaps, and a pair of insulating frames which have n openings in alignment with an array position of the unit conductive substrates and are integrated in such a way as to hold the collector portion between them. The back-to-back (n?1) unit conductive substrates of the n unit conductive substrates in one of both separators, as counted from the end of its array direction, and the 2nd to nth unit conductive substrates of the n unit conductive substrates in another separator, as counted from the end of its array direction are successively joined together by means of (n?1) connecting hinges.
    Type: Application
    Filed: October 4, 2005
    Publication date: June 18, 2009
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Tooru Serizawa, Yasuhiro Uchida, Takanori Maeda, Hiroshi Yagi
  • Publication number: 20080113253
    Abstract: A separator comprises a resin layer formed by electrodeposition in such a way as to cover a metal substrate having a groove in at least one surface thereof. The resin layer is composed of an electrically conductive material and a water-repellent material, or the resin layer contains an electrically conductive material, and is designed such that at least a portion of the resin layer positioned at the groove is covered with a water-repellent layer. Consequently, it is possible to provide a separator for a polymer electrolyte type fuel cell, which is less susceptible of flooding, has improved strength and corrosion resistance, and can be fabricated at lower costs.
    Type: Application
    Filed: October 17, 2006
    Publication date: May 15, 2008
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Hiroshi Yagi, Tooru Serizawa, Yasuhiro Uchida
  • Publication number: 20080090108
    Abstract: The object of the invention is to provide a separator of high strength plus high corrosion resistance which makes it possible to easily fabricate a polymer electrolyte type fuel cell having an extremely limited contact resistance with unit cells of an increased effective area, and a process for the fabrication of such separators. The invention provides a polymer electrolyte type fuel cell that comprises a metal substrate having a groove formed in at least one surface, an electrically conductive resin layer formed by electrodeposition in such a way as to cover the metal substrate, and a gas diffusion layer located on the surface of said metal substrate having a groove.
    Type: Application
    Filed: April 2, 2007
    Publication date: April 17, 2008
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Yasuhiro Uchida, Hiroshi Yagi, Tooru Serizawa
  • Publication number: 20070238005
    Abstract: The object of the invention is to provide a separator for fuel cells which is of improved strength and corrosion resistance and facilitates the assembling of unit cells. The separator comprises an electrically conductive resin layer formed by electrodeposition in such a way as to cover a metal substrate and a gasket component. The resin layer contains an electrically conductive material. The separator of the invention has thus an enhanced corrosion resistance, makes some considerable improvements in the assembling work efficiency of unit cells, and makes sure higher strength because of the use of the metal substrate.
    Type: Application
    Filed: April 6, 2007
    Publication date: October 11, 2007
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Hiroshi Yagi, Tooru Serizawa, Yasuhiro Uchida, Koichi Suzuki
  • Publication number: 20060254050
    Abstract: A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.
    Type: Application
    Filed: July 20, 2006
    Publication date: November 16, 2006
    Applicants: Dai Nippon Printing Co., Ltd., D.T. Circuit Technology Co., Ltd.
    Inventors: Yoshitaka Fukuoka, Tooru Serizawa, Hiroshi Yagi, Osamu Shimada, Hiroyuki Hirai, Yuji Yamaguchi
  • Patent number: 7100276
    Abstract: A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.
    Type: Grant
    Filed: December 29, 2004
    Date of Patent: September 5, 2006
    Assignees: Dai Nippon Printing Co., Ltd., D.T. Circuit Technology Co., Ltd.
    Inventors: Yoshitaka Fukuoka, Tooru Serizawa, Hiroshi Yagi, Osamu Shimada, Hiroyuki Hirai, Yuji Yamaguchi
  • Publication number: 20050126820
    Abstract: A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.
    Type: Application
    Filed: December 29, 2004
    Publication date: June 16, 2005
    Applicants: Dai Nippon Printing Co., Ltd., D.T. Circuit Technology Co., Ltd.
    Inventors: Yoshitaka Fukuoka, Tooru Serizawa, Hiroshi Yagi, Osamu Shimada, Hiroyuki Hirai, Yuji Yamaguchi
  • Patent number: 6894875
    Abstract: A magnetic head suspension includes an insulating base (12), wiring parts (13) formed on one surface of the insulating base (12) including a conductive metal layer, an elastic metal plate (14) provided on the other surface of the insulating base (12), and a wiring protecting layer (19) covering the wiring parts (13). The wiring protecting layer (19) is formed by subjecting a dry film containing an epoxy resin, an acrylic resin and a polymer containing aromatic rings to exposure and developing processes.
    Type: Grant
    Filed: April 16, 2002
    Date of Patent: May 17, 2005
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Tooru Serizawa, Terutoshi Momose, Nobuhiro Sakihama, Youichi Nagai, Tsuyoshi Yamazaki, Michiaki Uchiyama, Midori Chiba
  • Patent number: 6872893
    Abstract: A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.
    Type: Grant
    Filed: June 4, 2002
    Date of Patent: March 29, 2005
    Assignees: Dai Nippon Printing Co., Ltd., D.T. Circuit Technology Co., Ltd.
    Inventors: Yoshitaka Fukuoka, Tooru Serizawa, Hiroshi Yagi, Osamu Shimada, Hiroyuki Hirai, Yuji Yamaguchi
  • Publication number: 20020179329
    Abstract: A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.
    Type: Application
    Filed: June 4, 2002
    Publication date: December 5, 2002
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Yoshitaka Fukuoka, Tooru Serizawa, Hiroshi Yagi, Osamu Shimada, Hiroyuki Hirai, Yuji Yamaguchi
  • Publication number: 20020181157
    Abstract: A magnetic head suspension includes an insulating base (12), wiring parts (13) formed on one surface of the insulating base (12) including a conductive metal layer, an elastic metal plate (14) provided on the other surface of the insulating base (12), and a wiring protecting layer (19) covering the wiring parts (13). The wiring protecting layer (19) is formed by subjecting a dry film containing an epoxy resin, an acrylic resin and a polymer containing aromatic rings to exposure and developing processes.
    Type: Application
    Filed: April 16, 2002
    Publication date: December 5, 2002
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Tooru Serizawa, Terutoshi Momose, Nobuhiro Sakihama, Youichi Nagai, Tsuyoshi Yamazaki, Michiaki Uchiyama, Midori Chiba