Patents by Inventor Tooru Serizawa
Tooru Serizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8339743Abstract: A main object of the present invention is to provide a substrate for suspension which is produced at low costs and can sufficiently attain the prevention of damage by electrostatic discharge and restraint of noises. To attain the object, the present invention provides a substrate for suspension, comprising: a metallic substrate, an insulating layer formed on the metallic formed in substrate and having an opening from which the metallic substrate is exposed, a grounding-wiring layer formed on the insulating layer and arranged near the opening, and a ground terminal formed in the opening and contacting the metallic substrate and the grounding-wiring layer, characterized in that the ground terminal is made of a metal having a melting point of 450° C. or lower.Type: GrantFiled: September 9, 2011Date of Patent: December 25, 2012Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoichi Miura, Tooru Serizawa, Shinichiro Busujima
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Publication number: 20120003567Abstract: A separator for flat-type polymer electrolyte fuel cells comprises a fuel-feed-side separator and an oxygen-feed-side separator, each comprising a collector portion in which n unit conductive substrates (n is an integer of 2 or more), each having a plurality of through-holes, are arrayed in flat configuration via gaps, and a pair of insulating frames which have n openings in alignment with an array position of the unit conductive substrates and are integrated in such a way as to hold the collector portion between them. The back-to-back (n?1) unit conductive substrates of the n unit conductive substrates in one of both separators, as counted from the end of its array direction, and the 2nd to nth unit conductive substrates of the n unit conductive substrates in another separator, as counted from the end of its array direction are successively joined together by means of (n?1) connecting hinges.Type: ApplicationFiled: September 14, 2011Publication date: January 5, 2012Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Tooru SERIZAWA, Yasuhiro Uchida, Takanori Maeda, Hiroshi Yagi
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Publication number: 20120000698Abstract: A main object of the present invention is to provide a substrate for suspension which is produced at low costs and can sufficiently attain the prevention of damage by electrostatic discharge and restraint of noises. To attain the object, the present invention provides a substrate for suspension, comprising: a metallic substrate, an insulating layer formed on the metallic formed in substrate and having an opening from which the metallic substrate is exposed, a grounding-wiring layer formed on the insulating layer and arranged near the opening, and a ground terminal formed in the opening and contacting the metallic substrate and the grounding-wiring layer, characterized in that the ground terminal is made of a metal having a melting point of 450° C. or lower.Type: ApplicationFiled: September 9, 2011Publication date: January 5, 2012Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Yoichi MIURA, Tooru SERIZAWA, Shinichiro BUSUJIMA
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Patent number: 8040635Abstract: A substrate for suspension which is produced at low costs and can sufficiently attain the prevention of damage by electrostatic discharge and restraint of noises. The substrate for suspension includes: a metallic substrate, an insulating layer formed on the metallic substrate and having an opening from which the metallic substrate is exposed, a grounding-wiring layer formed on the insulating layer and arranged near the opening, and a ground terminal formed in the opening and contacting the metallic substrate and the grounding-wiring layer. The ground terminal is made of a metal having a melting point of 450° C. or lower.Type: GrantFiled: June 20, 2007Date of Patent: October 18, 2011Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoichi Miura, Tooru Serizawa, Shinichiro Busujima
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Patent number: 8039168Abstract: A separator for flat-type polymer electrolyte fuel cells comprises a fuel-feed-side separator and an oxygen-feed-side separator, each comprising a collector portion in which n unit conductive substrates (n is an integer of 2 or more), each having a plurality of through-holes, are arrayed in flat configuration via gaps, and a pair of insulating frames which have n openings in alignment with an array position of the unit conductive substrates and are integrated in such a way as to hold the collector portion between them. The back-to-back (n?1) unit conductive substrates of the n unit conductive substrates in one of both separators, as counted from the end of its array direction, and the 2nd to nth unit conductive substrates of the n unit conductive substrates in another separator, as counted from the end of its array direction are successively joined together by means of (n?1) connecting hinges.Type: GrantFiled: October 4, 2005Date of Patent: October 18, 2011Assignee: Dai Nippon Printing Co., Ltd.Inventors: Tooru Serizawa, Yasuhiro Uchida, Takanori Maeda, Hiroshi Yagi
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Patent number: 7919212Abstract: The object of the invention is to provide a separator for fuel cells which is of improved strength and corrosion resistance and facilitates the assembling of unit cells. The separator comprises an electrically conductive resin layer formed by electrodeposition in such a way as to cover a metal substrate and a gasket component. The resin layer contains an electrically conductive material. The separator of the invention has thus an enhanced corrosion resistance, makes some considerable improvements in the assembling work efficiency of unit cells, and makes sure higher strength because of the use of the metal substrate.Type: GrantFiled: April 6, 2007Date of Patent: April 5, 2011Assignee: Dai Nippon Printing Co., Ltd.Inventors: Hiroshi Yagi, Tooru Serizawa, Yasuhiro Uchida, Koichi Suzuki
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Patent number: 7679925Abstract: A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.Type: GrantFiled: July 20, 2006Date of Patent: March 16, 2010Assignee: Dai Nippon Printing Co., Ltd.Inventors: Yoshitaka Fukuoka, Tooru Serizawa, Hiroshi Yagi, Osamu Shimada, Hiroyuki Hirai, Yuji Yamaguchi
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Publication number: 20090190263Abstract: A substrate for suspension which is produced at low costs and can sufficiently attain the prevention of damage by electrostatic discharge and restraint of noises. The substrate for suspension includes: a metallic substrate, an insulating layer formed on the metallic substrate and having an opening from which the metallic substrate is exposed, a grounding-wiring layer formed on the insulating layer and arranged near the opening, and a ground terminal formed in the opening and contacting the metallic substrate and the grounding-wiring layer. The ground terminal is made of a metal having a melting point of 450° C. or lower.Type: ApplicationFiled: June 20, 2007Publication date: July 30, 2009Inventors: Yoichi Miura, Tooru Serizawa, Shinichiro Busujima
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Publication number: 20090155663Abstract: A separator for flat-type polymer electrolyte fuel cells comprises a fuel-feed-side separator and an oxygen-feed-side separator, each comprising a collector portion in which n unit conductive substrates (n is an integer of 2 or more), each having a plurality of through-holes, are arrayed in flat configuration via gaps, and a pair of insulating frames which have n openings in alignment with an array position of the unit conductive substrates and are integrated in such a way as to hold the collector portion between them. The back-to-back (n?1) unit conductive substrates of the n unit conductive substrates in one of both separators, as counted from the end of its array direction, and the 2nd to nth unit conductive substrates of the n unit conductive substrates in another separator, as counted from the end of its array direction are successively joined together by means of (n?1) connecting hinges.Type: ApplicationFiled: October 4, 2005Publication date: June 18, 2009Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Tooru Serizawa, Yasuhiro Uchida, Takanori Maeda, Hiroshi Yagi
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Publication number: 20080113253Abstract: A separator comprises a resin layer formed by electrodeposition in such a way as to cover a metal substrate having a groove in at least one surface thereof. The resin layer is composed of an electrically conductive material and a water-repellent material, or the resin layer contains an electrically conductive material, and is designed such that at least a portion of the resin layer positioned at the groove is covered with a water-repellent layer. Consequently, it is possible to provide a separator for a polymer electrolyte type fuel cell, which is less susceptible of flooding, has improved strength and corrosion resistance, and can be fabricated at lower costs.Type: ApplicationFiled: October 17, 2006Publication date: May 15, 2008Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Hiroshi Yagi, Tooru Serizawa, Yasuhiro Uchida
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Publication number: 20080090108Abstract: The object of the invention is to provide a separator of high strength plus high corrosion resistance which makes it possible to easily fabricate a polymer electrolyte type fuel cell having an extremely limited contact resistance with unit cells of an increased effective area, and a process for the fabrication of such separators. The invention provides a polymer electrolyte type fuel cell that comprises a metal substrate having a groove formed in at least one surface, an electrically conductive resin layer formed by electrodeposition in such a way as to cover the metal substrate, and a gas diffusion layer located on the surface of said metal substrate having a groove.Type: ApplicationFiled: April 2, 2007Publication date: April 17, 2008Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Yasuhiro Uchida, Hiroshi Yagi, Tooru Serizawa
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Publication number: 20070238005Abstract: The object of the invention is to provide a separator for fuel cells which is of improved strength and corrosion resistance and facilitates the assembling of unit cells. The separator comprises an electrically conductive resin layer formed by electrodeposition in such a way as to cover a metal substrate and a gasket component. The resin layer contains an electrically conductive material. The separator of the invention has thus an enhanced corrosion resistance, makes some considerable improvements in the assembling work efficiency of unit cells, and makes sure higher strength because of the use of the metal substrate.Type: ApplicationFiled: April 6, 2007Publication date: October 11, 2007Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Hiroshi Yagi, Tooru Serizawa, Yasuhiro Uchida, Koichi Suzuki
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Publication number: 20060254050Abstract: A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.Type: ApplicationFiled: July 20, 2006Publication date: November 16, 2006Applicants: Dai Nippon Printing Co., Ltd., D.T. Circuit Technology Co., Ltd.Inventors: Yoshitaka Fukuoka, Tooru Serizawa, Hiroshi Yagi, Osamu Shimada, Hiroyuki Hirai, Yuji Yamaguchi
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Patent number: 7100276Abstract: A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.Type: GrantFiled: December 29, 2004Date of Patent: September 5, 2006Assignees: Dai Nippon Printing Co., Ltd., D.T. Circuit Technology Co., Ltd.Inventors: Yoshitaka Fukuoka, Tooru Serizawa, Hiroshi Yagi, Osamu Shimada, Hiroyuki Hirai, Yuji Yamaguchi
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Publication number: 20050126820Abstract: A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.Type: ApplicationFiled: December 29, 2004Publication date: June 16, 2005Applicants: Dai Nippon Printing Co., Ltd., D.T. Circuit Technology Co., Ltd.Inventors: Yoshitaka Fukuoka, Tooru Serizawa, Hiroshi Yagi, Osamu Shimada, Hiroyuki Hirai, Yuji Yamaguchi
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Magnetic head suspension with both protected wiring and unprotected wiring, in addition to terminals
Patent number: 6894875Abstract: A magnetic head suspension includes an insulating base (12), wiring parts (13) formed on one surface of the insulating base (12) including a conductive metal layer, an elastic metal plate (14) provided on the other surface of the insulating base (12), and a wiring protecting layer (19) covering the wiring parts (13). The wiring protecting layer (19) is formed by subjecting a dry film containing an epoxy resin, an acrylic resin and a polymer containing aromatic rings to exposure and developing processes.Type: GrantFiled: April 16, 2002Date of Patent: May 17, 2005Assignee: Dai Nippon Printing Co., Ltd.Inventors: Tooru Serizawa, Terutoshi Momose, Nobuhiro Sakihama, Youichi Nagai, Tsuyoshi Yamazaki, Michiaki Uchiyama, Midori Chiba -
Patent number: 6872893Abstract: A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.Type: GrantFiled: June 4, 2002Date of Patent: March 29, 2005Assignees: Dai Nippon Printing Co., Ltd., D.T. Circuit Technology Co., Ltd.Inventors: Yoshitaka Fukuoka, Tooru Serizawa, Hiroshi Yagi, Osamu Shimada, Hiroyuki Hirai, Yuji Yamaguchi
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Publication number: 20020179329Abstract: A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.Type: ApplicationFiled: June 4, 2002Publication date: December 5, 2002Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Yoshitaka Fukuoka, Tooru Serizawa, Hiroshi Yagi, Osamu Shimada, Hiroyuki Hirai, Yuji Yamaguchi
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Publication number: 20020181157Abstract: A magnetic head suspension includes an insulating base (12), wiring parts (13) formed on one surface of the insulating base (12) including a conductive metal layer, an elastic metal plate (14) provided on the other surface of the insulating base (12), and a wiring protecting layer (19) covering the wiring parts (13). The wiring protecting layer (19) is formed by subjecting a dry film containing an epoxy resin, an acrylic resin and a polymer containing aromatic rings to exposure and developing processes.Type: ApplicationFiled: April 16, 2002Publication date: December 5, 2002Applicant: Dai Nippon Printing Co., Ltd.Inventors: Tooru Serizawa, Terutoshi Momose, Nobuhiro Sakihama, Youichi Nagai, Tsuyoshi Yamazaki, Michiaki Uchiyama, Midori Chiba