Abstract: A photosensitive resin composition contains: a polymer (A) having a terminal group represented by Formula (a1) and a repeating structural unit represented by Formula (a2); a crosslinking agent (B); and a photocation generator (C). Y represents a reactive group that reacts with the crosslinking agent (B) by action of a cation generated from the photocation generator (C) upon light irradiation; each X independently represents an oxygen atom, a sulfur atom, an ester bond, an amide bond, or —SO2—; R1 represents a divalent hydrocarbon group or a divalent group in which a functional group other than the reactive group and heterocycles is introduced into the divalent hydrocarbon group; and R2 represents a divalent hydrocarbon group, a divalent group in which a functional group other than the reactive group and heterocycles is introduced into the divalent hydrocarbon group, or a heterocycle-containing group that does not have the reactive group.

Abstract: There is shown a stack including a substrate material temporarily fixed on a support via a temporary fixing material, wherein the temporary fixing material includes a temporary fixing material layer (I) in contact with the support-facing surface of the substrate material, and a temporary fixing material layer (II) formed on the support-facing surface of the layer (I), wherein the temporary fixing material layer (I) is formed of a temporary fixing composition containing a polymer (A) and a release agent (B) which contains a functional group capable of reacting with the polymer (A) to form a chemical bond.

Abstract: There is shown a stack including a substrate material temporarily fixed on a support via a temporary fixing material, wherein the temporary fixing material includes a temporary fixing material layer (I) in contact with the support-facing surface of the substrate material, and a temporary fixing material layer (II) formed on the support-facing surface of the layer (I), wherein the temporary fixing material layer (I) is formed of a temporary fixing composition containing a polymer (A) and a release agent (B) which contains a functional group capable of reacting with the polymer (A) to form a chemical bond.

Abstract: A stack includes a substrate material that has a circuit surface and that is temporarily fixed on a support via a temporary fixing material. The temporary fixing material includes a temporary fixing material layer (I) that is in contact with the circuit surface of the substrate material and a temporary fixing material layer (II) that is formed on the support-facing surface of the layer (I). The temporary fixing material layer (I) is formed of a temporary fixing composition (i) that includes a thermoplastic resin (Ai), a polyfunctional (meth)acrylate compound (Bi), and a radical polymerization initiator (Ci), and the temporary fixing material layer (II) is formed of a temporary fixing composition (ii) that includes a thermoplastic resin (Aii) and a release agent (Dii).

Abstract: The invention provides a substrate treating method which can favorably prevent damages to a substrate when the substrate is separated from a support, thus achieving a high yield. The substrate treating method includes, in the sequence set forth, a step 1 of temporarily fixing a substrate onto a support via a temporary fixing material to form a stack, the temporary fixing material including at least a temporary fixing material (I) containing a cycloolefin polymer (A) and a compound (B) having a structure (b1) such as a dialkyl silicone structure, and a structure (b2) such as a polyoxyalkylene structure, a step 2 of processing the substrate and/or transporting the stack, and a step 3 of applying a force to the substrate or the support in a direction substantially perpendicular to the plane of substrate to separate the substrate from the support.

Abstract: The invention provides a substrate treating method which can favorably prevent damages to a substrate when the substrate is separated from a support, thus achieving a high yield. The substrate treating method includes, in the sequence set forth, a step 1 of temporarily fixing a substrate onto a support via a temporary fixing material to form a stack, the temporary fixing material including at least a temporary fixing material (I) containing a cycloolefin polymer (A) and a compound (B) having a structure (b1) such as a dialkyl silicone structure, and a structure (b2) such as a polyoxyalkylene structure, a step 2 of processing the substrate and/or transporting the stack, and a step 3 of applying a force to the substrate or the support in a direction substantially perpendicular to the plane of substrate to separate the substrate from the support.

Abstract: A flux composition includes an alditol (A) and a polymer (B) which has a repeating structural unit represented by Formula (1): (wherein R1 is a hydrogen atom or a methyl group, and Z is a hydroxyl group, an oxo group, a carboxyl group, a formyl group, an amino group, a nitro group, a mercapto group, a sulfo group, an oxazoline group, an imide group, a group having an amide structure, or a group having any of these groups). The flux composition allows substrates with bumps such as pillar bumps to be electrically connected to each other by reflowing of such bumps without causing any exposure of the bumps from the flux during reflowing, thus resulting in a satisfactory electrically connected structure.