Patents by Inventor Toru Arimoto

Toru Arimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat pipe hinge structure for electronic device
    Patent number: 6507490
    Abstract: A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portion. The hinge portion is made of a low heat-conductive material to fix the heat pipe hinge member on at least one housing portion of the pair of housing portions.
    Type: Grant
    Filed: January 28, 2002
    Date of Patent: January 14, 2003
    Assignee: The Furakawa Electric Co., Ltd.
    Inventors: Chiyoshi Sasaki, Hiroaki Maekawa, Junji Sotani, Masaru Ohmi, Isao Tsukada, Toru Arimoto
  • Heat pipe hinge structure for electronic device
    Publication number: 20020064027
    Abstract: A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portions. The hinge portion is made of a low heat-conductive material to fox the heat pipe hinge member on at least one housing portion of the pair of housing portions.
    Type: Application
    Filed: January 28, 2002
    Publication date: May 30, 2002
    Inventors: Chiyoshi Sasaki, Hiroaki Maekawa, Junji Sotani, Masaru Ohmi, Isao Tsukada, Toru Arimoto
  • Heat pipe hinge structure for electronic device
    Patent number: 6377452
    Abstract: A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portions. The hinge portion is made of a low heat-conductive material to fix the heat pipe hinge member on at least one housing portion of the pair of housing portions.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: April 23, 2002
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Chiyoshi Sasaki, Hiroaki Maekawa, Junji Sotani, Masaru Ohmi, Isao Tsukada, Toru Arimoto