Patents by Inventor Toru Iwata

Toru Iwata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11031235
    Abstract: A substrate processing apparatus includes a driving magnet that is disposed correspondingly to a movable pin and that has a predetermined polar direction with respect to a radial direction of a rotary table, a pressing magnet that has a magnetic pole that gives an attractive magnetic force or a repulsive magnetic force between the driving magnet and the pressing magnet and that presses a support portion against a peripheral edge of a substrate by urging the support portion toward a contact position by means of the attractive magnetic force or the repulsive magnetic force, and a pressing-force changing unit that changes a magnitude of a pressing force against the peripheral edge of the substrate pressed by the support portion while keeping the magnitude higher than zero in response to rotation of the rotary table.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: June 8, 2021
    Inventors: Hiromichi Kaba, Akihiko Taki, Tomomi Iwata, Toru Edo, Kunio Yamada
  • Patent number: 11009139
    Abstract: A relief valve that includes a tube; a valve configured to slide along an inner wall of the tube in an axial direction, and a spring that urges the valve, wherein the valve has a hydraulic pressure receiving surface on a first axial side that is one side in the axial direction, and a spring abutment against which the spring abuts, on a second axial side opposite to the first axial side, and the tube has a discharge oil passage having an opening in the inner wall and extending through the inner wall in a radial direction.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: May 18, 2021
    Assignee: AISIN AW CO., LTD.
    Inventors: Tetsuya Shimizu, Toru Sugiyama, Masaya Iwata
  • Patent number: 10844243
    Abstract: Embodiments relate to a polishing composition including colloidal silica, pulverized wet-process silica particles, and at least one of a nitrogen-containing organic compound and a nitrogen-containing polymer compound. According to another embodiment, the polishing composition includes colloidal silica, pulverized wet-process silica particles, and a copolymer containing a monomer having a carboxylic acid group and a monomer having a sulfonic acid group as essential monomers. According to another embodiment, the polishing composition includes colloidal silica, pulverized wet-process silica particles, a nitrogen-containing organic compound and/or a nitrogen-containing polymer compound, and a copolymer containing a monomer having a carboxylic acid group and a monomer having a sulfonic acid group as essential monomers.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: November 24, 2020
    Assignee: YAMAGUCHI SEIKEN KOGYO CO., LTD.
    Inventors: Toru Iwata, Akina Ban, Yuka Ishida
  • Patent number: 10822525
    Abstract: Embodiments provide a polishing composition containing colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound. According to at leaset one embodiment, the water-soluble polymer compound is a copolymer containing a structural unit derived from an unsaturated aliphatic carboxylic acid and a structural unit derived from an unsaturated amide.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: November 3, 2020
    Assignee: YAMAGUCHI SEIKEN KOGYO CO., LTD.
    Inventors: Toru Iwata, Akira Sugawa
  • Patent number: 10696870
    Abstract: Embodiments provide a polishing composition for a magnetic disk substrate, which contains colloidal silica having an average primary particle size of 5 to 200 nm, fumed silica having an average particle size of 30 to 800 nm, pulverized wet-process silica particles having an average particle size of 100 to 1000 nm, and water. According to an embodiment, a ratio of the colloidal silica is 5 to 90% by mass, a ratio of the fumed silica is 5 to 90% by mass, and a ratio of the pulverized wet-process silica particles is 5 to 90% by mass with respect to all the silica particles, and a concentration of all the silica particles is 1 to 50% by mass.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: June 30, 2020
    Assignee: YAMAGUCHI SEIKEN KOGYO CO., LTD.
    Inventor: Toru Iwata
  • Patent number: 10577445
    Abstract: Embodiments relate to a polishing composition is an aqueous composition containing at least colloidal silica, wet-process silica particles, and a water-soluble polymer compound. The water-soluble polymer compound is a copolymer containing a monomer having a carboxylic acid group, a monomer having an amide group, and a monomer having a sulfonic acid group as essential monomers.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: March 3, 2020
    Assignee: YAMAGUCHI SEIKEN KOGYO CO., LTD.
    Inventor: Toru Iwata
  • Publication number: 20190119423
    Abstract: Embodiments relate to a polishing composition is an aqueous composition containing at least colloidal silica, wet-process silica particles, and a water-soluble polymer compound. The water-soluble polymer compound is a copolymer containing a monomer having a carboxylic acid group, a monomer having an amide group, and a monomer having a sulfonic acid group as essential monomers.
    Type: Application
    Filed: October 24, 2018
    Publication date: April 25, 2019
    Applicant: YAMAGUCHI SEIKEN KOGYO CO., LTD.
    Inventor: Toru IWATA
  • Publication number: 20190010358
    Abstract: Embodiments relate to a polishing composition including colloidal silica, pulverized wet-process silica particles, and at least one of a nitrogen-containing organic compound and a nitrogen-containing polymer compound. According to another embodiment, the polishing composition includes colloidal silica, pulverized wet-process silica particles, and a copolymer containing a monomer having a carboxylic acid group and a monomer having a sulfonic acid group as essential monomers. According to another embodiment, the polishing composition includes colloidal silica, pulverized wet-process silica particles, a nitrogen-containing organic compound and/or a nitrogen-containing polymer compound, and a copolymer containing a monomer having a carboxylic acid group and a monomer having a sulfonic acid group as essential monomers.
    Type: Application
    Filed: July 3, 2018
    Publication date: January 10, 2019
    Applicant: YAMAGUCHI SEIKEN KOGYO CO., LTD.
    Inventors: Toru IWATA, Akina BAN, Yuka ISHIDA
  • Publication number: 20180273803
    Abstract: Embodiments provide a polishing composition for a magnetic disk substrate, which contains colloidal silica having an average primary particle size of 5 to 200 nm, fumed silica having an average particle size of 30 to 800 nm, pulverized wet-process silica particles having an average particle size of 100 to 1000 nm, and water. According to an embodiment, a ratio of the colloidal silica is 5 to 90% by mass, a ratio of the fumed silica is 5 to 90% by mass, and a ratio of the pulverized wet-process silica particles is 5 to 90% by mass with respect to all the silica particles, and a concentration of all the silica particles is 1 to 50% by mass.
    Type: Application
    Filed: March 23, 2018
    Publication date: September 27, 2018
    Applicant: YAMAGUCHI SEIKEN KOGYO CO., LTD.
    Inventor: Toru IWATA
  • Publication number: 20180215953
    Abstract: Embodiments provide a polishing composition containing colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound. According to at leaset one embodiment, the water-soluble polymer compound is a copolymer containing a structural unit derived from an unsaturated aliphatic carboxylic acid and a structural unit derived from an unsaturated amide.
    Type: Application
    Filed: March 26, 2018
    Publication date: August 2, 2018
    Applicant: YAMAGUCHI SEIKEN KOGYO CO., LTD.
    Inventors: Toru IWATA, Akira SUGAWA
  • Patent number: 9862863
    Abstract: Embodiments of the invention provide a polishing composition including colloidal silica having an average particle size of 5 to 200 nm and pulverized wet-process silica particles having an average particle size of 0.1 to 1.0 ?m, wherein a value of the ratio of the average particle size of the wet-process silica particles to that of the colloidal silica is from 2.0 to 30.0. The polishing composition, according to various embodiments, achieves a high polishing rate and has a good surface smoothness, without the use of alumina particles.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: January 9, 2018
    Assignee: YAMAGUCHI SEIKEN KOGYO CO., LTD.
    Inventors: Toru Iwata, Akira Sugawa
  • Patent number: 9856401
    Abstract: Embodiments of the invention provide a polishing composition including colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound, wherein the water-soluble polymer compound is a polymer or copolymer having a constituent unit derived from an unsaturated aliphatic carboxylic acid. Various embodiments achieve a high polishing rate and obtain a good surface smoothness and end-face shape without the use of alumina particles.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: January 2, 2018
    Assignee: YAMAGUCHI SEIKEN KOGYO CO., LTD.
    Inventors: Toru Iwata, Akira Sugawa
  • Publication number: 20170015868
    Abstract: Embodiments of the invention provide a polishing composition including colloidal silica, pulverized wet-process silica particles, and a water-soluble polymer compound, wherein the water-soluble polymer compound is a polymer or copolymer having a constituent unit derived from an unsaturated aliphatic carboxylic acid. Various embodiments achieve a high polishing rate and obtain a good surface smoothness and end-face shape without the use of alumina particles.
    Type: Application
    Filed: September 28, 2016
    Publication date: January 19, 2017
    Applicant: YAMAGUCHI SEIKEN KOGYO CO., LTD.
    Inventors: Toru IWATA, Akira SUGAWA
  • Publication number: 20170015867
    Abstract: Embodiments of the invention provide a polishing composition including colloidal silica having an average particle size of 5 to 200 nm and pulverized wet-process silica particles having an average particle size of 0.1 to 1.0 ?m, wherein a value of the ratio of the average particle size of the wet-process silica particles to that of the colloidal silica is from 2.0 to 30.0. The polishing composition, according to various embodiments, achieves a high polishing rate and has a good surface smoothness, without the use of alumina particles.
    Type: Application
    Filed: September 28, 2016
    Publication date: January 19, 2017
    Applicant: YAMAGUCHI SEIKEN KOGYO CO., LTD.
    Inventors: Toru IWATA, Akira SUGAWA
  • Patent number: 9356589
    Abstract: An interchannel skew adjustment circuit adjusts signal skew between a first channel and a second channel. The circuit includes a phase adjustment circuit configured to receive a signal of the first channel, delay the signal by a discretely variable delay amount, and output a delayed signal; a channel coupling circuit configured to receive the signal output from the phase adjustment circuit and a signal of the second channel, and detect a phase difference between these two signals; and a controller configured to control the delay amount in the phase adjustment circuit based on a result detected by the channel coupling circuit. This interchannel skew adjustment circuit adjusts the interchannel signal skew only at a sender or a receiver, thereby reducing the circuit area and the power consumption.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: May 31, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tsuyoshi Ebuchi, Toru Iwata, Yoshihide Komatsu, Yuji Yamada, Shinya Miyazaki, Tsuyoshi Hiraki
  • Patent number: 9081318
    Abstract: It is an object of the present invention to provide a ferrite carrier core material and a ferrite carrier for an electrophotographic developer, which have an excellent charging property, hardly cause carrier scattering due to cracking and chipping of the core material, and have a prolonged life, and methods for manufacturing these, and an electrophotographic developer using the ferrite carrier. For this object, the ferrite carrier core material and a ferrite carrier for an electrophotographic developer, wherein (1) the ferrite composition contains 0.5 to 2.5% by weight of Sr, and the presence amount of Sr—Fe oxides satisfies a specific conditional expression, (2) the distribution in the number of the shape factor SF-2 is in a specific range, (3) the BET specific surface area is 0.15 to 0.30 m2/g, (4) the average particle diameter D50 is 20 to 35 ?m, and (5) the magnetization is 50 to 65 Am2/kg.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: July 14, 2015
    Assignee: POWDERTECH CO., LTD.
    Inventors: Tomoyuki Suwa, Toru Iwata, Koji Aga
  • Patent number: 9046110
    Abstract: A crossflow fan includes a rotary impeller formed by curved blades 42. Each of the blades 42 has an outer peripheral edge 43 close to the centrifugal side of the impeller and an inner peripheral edge 44 close to the rotation axis side of the impeller. A plurality of cutouts 45 are formed in the outer peripheral edge 43 and spaced apart at predetermined intervals. Dimples 48 for changing a boundary layer from a laminar flow to a turbulent flow are formed in a negative pressure surface 4q of each blade 42 in the vicinity of the outer peripheral edge 43 to prevent the gas flowing around the blade 42 from separating from the blade 42.
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: June 2, 2015
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Hironobu Teraoka, Shimei Tei, Toru Iwata
  • Patent number: 8895218
    Abstract: Employment of a carrier core material for an electrophotographic developer containing 0.8 to 5% by weight of Mg, 0.1 to 1.5% by weight of Ti, 60 to 70% by weight of Fe and 0.2 to 2.5% by weight of Sr and having an amount of Sr dissolved with a pH4 standard solution of 80 to 1000 ppm, a carrier using the core material and a process for producing them, and an electrophotographic developer using the carrier.
    Type: Grant
    Filed: January 12, 2010
    Date of Patent: November 25, 2014
    Assignee: Powdertech Co., Ltd.
    Inventors: Takashi Kojima, Toru Iwata, Koji Aga
  • Patent number: 8884680
    Abstract: In a signal electric potential conversion circuit, a capacitor has one end receiving an input signal CIN, and the other end connected to a termination node N1. A conversion circuit receives a potential IN of the termination node N1. A connection element is provided between a power supply VDDH and the termination node N1, and an impedance of the connection element is reduced when the potential IN is lower than a first potential. Another connection element is provided between the termination node N1 and a ground power supply, and an impedance of the connection element is reduced when the potential IN is higher than a second potential.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: November 11, 2014
    Assignee: Panasonic Corporation
    Inventor: Toru Iwata
  • Patent number: 8784060
    Abstract: A centrifugal fan has a circular main plate driven and rotated by a motor rotary shaft, a plurality of blades fixed to an outer circumferential portion of the main plate and spaced apart at predetermined intervals in a circumferential direction of the main plate, and a side plate attached to ends of the blades opposite to the main plate. An air inlet port is formed at the center of the side plate. The side plate inclines outward in centrifugal directions from the air inlet port and has an arcuate cross section with a predetermined radius of curvature. A dead water region reducing space is formed between the blades and the side plate. The dead water region reducing space forms a smooth flow between the two surfaces of each blade, bringing about desirable blade performance.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: July 22, 2014
    Assignee: Daikin Industries, Ltd.
    Inventors: Toru Iwata, Zhiming Zheng