Abstract: A first transistor is turned on during operation of a circuit block, to connect a substrate of the transistor to a first substrate voltage line. A second transistor is turned on during non-operation of the circuit block, to connect the substrate of the transistor to a second substrate voltage line. ON resistance of the second transistor is higher than that of the first transistor. A source-to-substrate voltage of the transistor being not in operation is set to be higher than that of the transistor being in operation. When a semiconductor integrated circuit switches from the operation state to the non-operation state, its substrate voltage changes gradually to a second substrate voltage. Charging/discharging currents of the substrate voltage can be dispersed so that it is possible to suppress current consumption in shifting from the operation state to the non-operation state and reduce a standby current in the non-operation state.

Abstract: A first transistor is turned on during operation of a circuit block, to connect a substrate of the transistor to a first substrate voltage line. A second transistor is turned on during non-operation of the circuit block, to connect the substrate of the transistor to a second substrate voltage line. ON resistance of the second transistor is higher than that of the first transistor. A source-to-substrate voltage of the transistor being not in operation is set to be higher than that of the transistor being in operation. When a semiconductor integrated circuit switches from the operation state to the non-operation state, its substrate voltage changes gradually to a second substrate voltage. Charging/discharging currents of the substrate voltage can be dispersed so that it is possible to suppress current consumption in shifting from the operation state to the non-operation state and reduce a standby current in the non-operation state.

Abstract: A semiconductor integrated circuit, comprising a circuit unit having a predetermined function such as a level shifter circuit or a driver transistor circuit by a combination of a plurality of transistors, is disclosed. Among a plurality of the transistors of the circuit unit, the source potential of at least one transistor adapted to turn off during the standby period of the circuit unit is changed. Preferably, the semiconductor integrated circuit is configured to reduce the sub-threshold current flowing between the source and the drain of at least one transistor adapted to turn off during the standby period of the circuit unit by changing the source potential at a timing based on the standby period of the circuit unit in such a manner that a predetermined bias voltage is applied between the gate and the source of the transistor. A method of switching the source potential of at least one transistor in the semiconductor integrated circuit having the configuration described above is also disclosed.

Abstract: A variable delay circuit includes a first gate having a first delay amount, and a second gate having a second delay amount greater than the first delay amount. A difference between the first delay amount and the second delay time is less than the first delay amount.

Abstract: A variable delay circuit includes a first gate having a first delay amount, and a second gate having a second delay amount greater than the first delay amount. A difference between the first delay amount and the second delay time is less than the first delay amount.

Abstract: According to a semiconductor memory for one aspect of the present invention, a memory cell transistor is formed in a P-type first well region which is formed at the surface of a P-type semiconductor substrate, and a back bias voltage is applied to the P-type first well region and the P-type substrate. Further, an N-type retrograde region is formed by implanting a high energy N-type impurity, so that a deeper, N-type second well region is formed by employing the N-type retrograde region. Further, a P-type third well region is formed in the N-type second well region, and a P-type emitter region is also formed therein. Thus, together the P-type emitter region, the N-type second well region, and the P-type third well region constitute a lateral PNP transistor. In addition, the ground voltage is maintained for the P-type third well region, which serves as a collector region.

Abstract: A semiconductor device having the function of generating an internal clock signal delayed by a predetermined phase by adjusting the phase of an external clock signal, includes a first clock phase circuit for roughly adjusting the phase of the external clock signal; and a second clock phase adjusting circuit for controlling the phase of the internal clock signal with higher accuracy than the first clock phase adjusting circuit. The semiconductor device having such a construction executes phase comparisons by the first and second clock phase adjusting circuits independently of each other, and when a phase control operation by the second clock phase adjusting circuit is made subordinate to that of the first clock phase adjusting circuit, the delay time of each of a plurality of delay elements inside the first clock phase adjusting circuit is set to a value larger than a power source jitter resulting from a noise of a power source and a jitter of the external clock signal.

Abstract: A semiconductor integrated circuit producing a given output voltage includes first and second operational amplifiers, and first and second transistors. The first and second operational amplifiers detect a voltage difference between a voltage applied to an input terminal and at least one reference voltage. The first and second transistors are turned ON or turned OFF according to the levels of voltages output from the first and second operational amplifiers. The first operational amplifier receives the output voltage at the input terminal. When the level of the output voltage becomes lower than the reference voltage, the first operational amplifier allows the first transistor to operate so as to raise the output voltage. In contrast, the second operational amplifier receives the output voltage at the input terminal. When the level of the output voltage exceeds the reference voltage, the second operational amplifier allows the second transistor to operate so as to lower the output voltage.

Abstract: A semiconductor device has a DLL circuit or the like for adjusting the phase of an external clock and producing an internal clock that lags behind by a given phase. The semiconductor device further includes a clock frequency judging unit for judging the frequency of a first clock on the basis of an indication signal indicating a delay value of the first clock in the DLL circuit or the like to output a control signal; and a clock selecting unit for selecting either one of the first clock and the second clock, in response to the control signal.

Abstract: A semiconductor memory has memory cells arranged in arrays, direct-type sense amplifiers arranged in each column of the memory cells, for writing and reading data to and from a memory cell to be accessed, column selection lines for selecting sense amplifiers that are in a column that involves the memory cell to be accessed, write-only column selection lines for selecting sense amplifiers that are in a row that involves the memory cell to be accessed if the memory cell is accessed to write data thereto, and local drivers. The sense amplifiers are grouped, in each row, into sense amplifier blocks. The write-only column selection lines consist of first selection lines for selecting sense amplifier blocks that are in the row that involves the memory cell to be accessed for data write and second selection lines for selecting sense amplifiers that are contained in the selected sense amplifier blocks.

Abstract: In a semiconductor integrated circuit having the function of executing a pre-charge operation of a data bus when data is transferred to the data bus from a plurality of driver circuits connected to the data bus, a reset circuit for executing the pre-charge operation of the data bus is constituted so as to start the pre-charge operation of the data bus upon receiving an end timing of a strobe signal. Preferably, the reset circuit detects that the data bus reaches a pre-charge level for executing the pre-charge operation, and then terminates the pre-charge operation. On the other hand, in a semiconductor integrated circuit having a data latch function by a pipeline system when the data is read out from a memory cell, etc.

Abstract: In a data bus amplifier activation method for a semiconductor memory device having a memory cell array, a column selection circuit for selecting a column in the memory cell array, a read data bus for transferring read data, output from the column selected by the column selection circuit, to a read data bus amplifier, and a write data bus for transferring write data, output from a write data bus amplifier, to the column selected by the column selection circuit, the read data bus amplifier or the write data bus amplifier is activated by detecting the selection of the column effected by the column selection circuit.

Abstract: The present invention relates to a memory device including memory cells each formed of a cell transistor connected to bit and word line and a cell capacitor. The memory device includes a pre-charging circuit for pre-charging bit line to a first voltage, a sense amplifier for detecting voltages of bit lines and driving the bit lines to a second voltage for H level or a third voltage for L level, and a word line driving circuit for driving word lines to make the writing voltage for H level of the cell capacitor to a fourth voltage lower than the second voltage. The present invention is characterized in that the first voltage is lower than an intermediate value between the second and third voltages. According to the present invention, it becomes possible to prevent the voltage V.sub.

Abstract: A semiconductor memory device includes a memory cell connected to a bit line and a word line, a bit line precharge circuit which precharges the bit line to a ground voltage, and a word decoder which sets the word line to a negative voltage when the word line is not selected.

Abstract: This invention is a memory device with a structure that has eliminated the logic circuit using I/O mask signal DQM from within the critical path from the clock CLK to the predecoder and column decoder for generating column selection signal CL. The logic circuit using I/O mask signal DQM within the critical path for generating column selection signals is eliminated, and the time from when the clock is supplied until the column selection signal is generated is made as short as possible. On the other hand, to make an I/O mask possible during burst write mode, drive control of the write amplifier is performed based on I/O mask signal DQM. Specifically, activation of the write amplifier is prohibited or allowed in response to the I/O mask signal DQM.

Abstract: A variable delay circuit includes a first gate having a first delay amount, and a second gate having a second delay amount greater than the first delay amount. A difference between the first delay amount and the second delay time is less than the first delay amount.

Abstract: A semiconductor memory device includes at least one cell block including an array of memory cells, a plurality of sense amplifiers which temporarily hold data of the memory cells, a first data bus connected to the plurality of sense amplifiers via first gates, and a second data bus having a direct electrical connection to the first data bus and being laid out to extend through a position of the at least one cell block.

Abstract: An electronic device includes a first circuit which refers to an external clock and thus produces a first internal clock, and a second circuit which refers to the first internal clock and thus produces a second internal clock. The first circuit has a first phase error between the external clock and the first internal clock, and the second circuit has a second phase error between the first internal clock and the second internal clock. The first phase error has a sign reverse to that of the second phase error.

Abstract: An inductive load drive circuit includes a transistor for pulling-in an excitation current having a predetermined polarity and generated by an inductive load. The transistor is turned-on by a first idling loop when a drive voltage of the inductive load has a negative polarity, and the transistor is turned-on by a second idling loop when the drive voltage has a positive polarity. Though both of the first idling loop and the second idling operate on the basis of the drive voltage, in pulling the excitation current into the circuit, the drive voltage reaches a lower limit of a dynamic range at a time that the first idling loop is suitably operated while the drive voltage reaches an upper limit of the dynamic range at a time that the second idling loop is suitably operated.

Abstract: Disclosed is a semiconductor memory having a self-amplifying cell structure, using (1) a writing transistor and (2) a reading transistor with a floating gate as a charge storage node for each memory cell, and a method of fabricating the memory cell. The writing transistor and reading transistor are of opposite conductivity type to each other; for example, the writing transistor uses a P-channel MOS transistor and the reading transistor (having the floating gate) uses an N-channel MOS transistor. The floating gate of the reading transistor is connected to a single bit line through a source-drain path of the writing transistor, the source-drain path of the reading transistor is connected between the single bit line and a predetermined potential, and the gate electrodes of the writing and reading transistors are connected to a single word line. At least the reading transistor can be formed in a trench, and the word line can be formed overlying the writing transistor and the reading transistor in the trench.