Toru Matsumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: If the moving direction of a suction nozzle during raising and lowering deviates from a vertical direction, appropriate work cannot be guaranteed because the holding position of a component by the suction nozzle will vary depending on the holding height of the component by the suction nozzle. Thus, a component loaded at a specified height (H) position from the upper surface of a stage is held by a suction nozzle, and that component is loaded at a specified position. Then, the component is imaged and the loading position (first height component loading position) of the component is calculated. Further, the component loaded on the stage is held by the suction nozzle and the component is loaded at the above specified position. Then, the component is imaged and the component loading position (second height component loading position) is calculated. Next, the deviation amount between the first height component loading position and the second height component loading position is calculated.
Abstract: A semiconductor device inspection apparatus is an apparatus for inspecting a semiconductor device which is an object to be inspected based on a result signal which is output in accordance with input of a test pattern signal to the semiconductor device, the apparatus including: an ultrasonic transducer, disposed to face the semiconductor device, which generates ultrasonic waves; a stage for moving a relative position of the semiconductor device and the ultrasonic transducer; a stimulation condition control unit for controlling a condition of stimulation by the ultrasonic waves applied to the semiconductor device; and an analysis unit for generating a measurement image based on the result signal which is output from the semiconductor device.
Abstract: A component supply device, including a stage on which components are scattered; an imaging device configured to image components scattered on the stage; a storage device configured to store first identification information capable of identifying a first component which is a component scheduled to be supplied from the stage and second identification information capable of identifying a second component which is a component not scheduled to be supplied from the stage; and a determination device configured to determine whether the first component is present on the stage based on the first identification information and imaging data from the imaging device, and to determine whether the second component is present on the stage based on the second identification information and imaging data from the imaging device.
Abstract: A component supply device that images stage on which multiple leaded components are supported in a scattered state, and holds a component supported on the stage using a component holding tool based on the image data, wherein multiple stages of different colors are prepared, and a stage from among the multiple stages a stage with a color different to a component that is planned to be supplied is removably attached to component support member. By this, for example, in a case in which a component planned to be supplied is white, by attaching a black stage to the component support section, due to the contrast between the background and the target object, it is possible to clearly recognize the white component supported on the black stage.
Abstract: Provided is a method for inspecting a semiconductor device which performs an inspection of a semiconductor device as an object to be inspected, including attaching an adhesive tape to a surface to be inspected of the semiconductor device, acquiring a first pattern image based on a light detected from a region including a surface of the surface to be inspected to which the adhesive tape is attached, inputting an electrical signal to the semiconductor device to which the adhesive tape is attached, acquiring a first heat generation image by detecting light according to heat radiation from the region including the surface to which the adhesive tape is attached in a state in which the electrical signal is input, and superimposing the first pattern image and the first heat generation image.
Abstract: A loose component supply device including: component support member 150 configured to support multiple components in a scattered state; component collection container 180 configured to collect the components supported on the component support member via an opening in the component collection container; and a container oscillating device configured to scatter the components collected inside the component collection container onto the component support surface by swinging the component collection container such that the opening of the collection container faces the component support member. By this, because components are scattered on the component support member directly form the component collection container, the cycle time is shortened, thereby improving practicality of a component supply device.
Abstract: A component supply device including a stage on which electronic components are scattered; a contacting section at a height so as to contact the electronic components on the stage; a slide device to relatively slide the stage and the contacting section; a dropping opening to allow the electronic components scattered on the stage caught by the contacting section to drop in accordance with the relative movement of the stage and the contacting section by the slide device; and a wall at a side opposite to a side of the dropping opening at which the electronic components scattered on the stage drop. The contacting section is provided to extend in a direction perpendicular to a sliding direction by the slide device, and at least a portion of the contacting section is inclined with respect to a straight direction along the sliding direction and an upper surface of the stage.
Abstract: A chuck according to an embodiment of the present invention includes first and second support portions 10 each of which has a repetition structure of a convex portion 11 and a concave portion 13 on a base. A substrate is held by bringing each convex portion 11 into contact with the substrate and exhausting gas in each concave portion 13 such that the concave portion 13 has a negative pressure with respect to a space between the first support portion 10 and the second support portion 10. At least one support portion of the first support portion 10 and the second support portion 10 includes at least four convex portions 11 and three concave portions 13.
Abstract: A work machine including a work head including a holding tool to pick up and hold a component, a rotating device to rotate the holding tool about an axis of the holding tool, a pivoting device to pivot the holding tool between a first attitude in which a distal end portion of the holding tool faces downward and a second attitude in which the distal end portion of the holding tool faces sideways; a moving device to move the work head; and a control device to control operation of the work head and the moving device, the control device including an operation control section to cause the holding tool to pivot from the first attitude to the second attitude, and to cause the holding tool to rotate from a holding angle that is a rotation angle when the component was picked up to a target angle.
Abstract: A stage device capable of performing piercing vibration and translational driving by using one actuator, and performing very low-speed driving in the translational driving with high accuracy. The stage device includes an X stage having a vibration actuator that includes an vibration element and a contact body, one of which is a movable body connected to an object to be driven, and drives the object to be driven in an X-axis direction, and a control section that controls driving of the vibration actuator. The control section causes two-phase AC voltages to be applied to an electromechanical energy conversion element to thereby excite predetermined vibrations in the vibration element, to drive the vibration actuator by switching between a movement mode for moving the object to be driven in the X-axis direction and a vibration mode for vibrating the object to be driven in the X-axis direction.
Abstract: A component supply device including a component storage device that stores a plurality of components, a component support member on which the components from the component storage device are dispersed, and a component return device that returns the components on the component support member to the component storage device, is provided. In a case where the necessary number of components exceeds the number of holdable components, return work of the components to the component container and dispersal work of the components to the component support section are carried out prior to holding the components from the component support section by the component holding tool.
Abstract: A device analysis apparatus is a device analysis apparatus for determining a quality of a power semiconductor device, including an application unit that applies a voltage signal to the power semiconductor device, a light detection unit that detects light from the power semiconductor device at a plurality of detection positions and outputs detection signals based on detection results, and a determination unit that determines the quality of the power semiconductor device based on temporal changes of the detection signals.
Abstract: A lens apparatus includes a base barrel, a lens movable to an object side and an image side relative to the base barrel, an actuator configured to move the lens, a drive board that includes an electric element configured to drive the actuator, and a board holding member configured to hold the drive board and attached to the base barrel from the object side.