Abstract: A support information display method is provided with an acquiring process for acquiring a first image by photographing, via a camera provided in a head mount display, a predetermined part of a substrate processing apparatus as a maintenance object, an estimating process for estimating the support information related to the predetermined part in the first image from information stored in a database, an image creating process for creating a second image by converting the support information estimated in the estimating process into an image, and a displaying process for displaying the second image on the head mount display in order for the operator to visually recognize the support information.

Abstract: An alignment apparatus for aligning a wafer includes a mounting unit, an imaging unit, an elevation unit, and a controlling unit. The control unit outputs a control signal for controlling the elevation unit such that a luminance variation between the outer side and the inner side of the wafer obtained by the imaging unit becomes the same as a luminance variation obtained when the imaging unit is focused, for estimating a warpage state of the wafer based on an amount of relative movement of the imaging unit and the mounting unit with respect to a relative height position of the imaging unit and the mounting unit obtained when the imaging unit is focused on a reference wafer having no warpage, and for detecting the alignment mark of the wafer by the imaging unit by rotating the mounting unit in a state where the imaging unit is focused.

Abstract: An alignment apparatus for aligning a wafer includes a mounting unit, an imaging unit, an elevation unit, and a controlling unit. The control unit outputs a control signal for controlling the elevation unit such that a luminance variation between the outer side and the inner side of the wafer obtained by the imaging unit becomes the same as a luminance variation obtained when the imaging unit is focused, for estimating a warpage state of the wafer based on an amount of relative movement of the imaging unit and the mounting unit with respect to a relative height position of the imaging unit and the mounting unit obtained when the imaging unit is focused on a reference wafer having no warpage, and for detecting the alignment mark of the wafer by the imaging unit by rotating the mounting unit in a state where the imaging unit is focused.

Abstract: A support information display method is provided with an acquiring process for acquiring a first image by photographing, via a camera provided in a head mount display, a predetermined part of a substrate processing apparatus as a maintenance object, an estimating process for estimating the support information related to the predetermined part in the first image from information stored in a database, an image creating process for creating a second image by converting the support information estimated in the estimating process into an image, and a displaying process for displaying the second image on the head mount display in order for the operator to visually recognize the support information.

Abstract: A heat dissipating structure for an electronic component of the present invention includes a main board on which electronic components are mounted, a heat sink disposed facing the main board and contacting a plurality of the electronic components on the main board, a heat pipe disposed on the heat sink, an arm branching from the heat sink and elastically deformable in relation to the heat sink, and a cooling fan located at the end portion of the heat pipe.

Abstract: An electronic apparatus includes a drive for recording/reproducing a recording medium, and a sound absorbing member having a Helmholtz resonator for insulating sounds at a predetermined frequency among sounds generated by the drive.

Abstract: A heat dissipating structure for an electronic component of the present invention includes a main board on which electronic components are mounted, a heat sink disposed facing the main board and contacting a plurality of the electronic components on the main board, a heat pipe disposed on the heat sink, an arm branching from the heat sink and elastically deformable in relation to the heat sink, and a cooling fan located at the end portion of the heat pipe.

Abstract: An electronic apparatus includes a drive for recording/reproducing a recording medium, and a sound absorbing member having a Helmholtz resonator for insulating sounds at a predetermined frequency among sounds generated by the drive.

Abstract: An interlock system can discriminate a controller in which an abnormality occurs in a control system of a semiconductor manufacturing apparatus in which a plurality of controllers are connected through a network. A processing system contains at least one processing chamber which performs a semiconductor manufacturing process. A conveyance system takes an object to be processed in and out of the processing chamber. The control system includes at least one apparatus controller, which controls the processing system and the conveyance system, and an equipment controller, which manages the apparatus controller. The apparatus controller and the equipment controller are communicably connected through a network.

Abstract: An interlock system can discriminate a controller in which an abnormality occurs in a control system of a semiconductor manufacturing apparatus in which a plurality of controllers are connected through a network. A processing system contains at least one processing chamber which performs a semiconductor manufacturing process. A conveyance system takes an object to be processed in and out of the processing chamber. The control system includes at least one apparatus controller, which controls the processing system and the conveyance system, and an equipment controller, which manages the apparatus controller. The apparatus controller and the equipment controller are communicably connected through a network.