Abstract: A method and structures for protectively enclosing and sealing optoelectronic modules having emitter or detector diode arrays aligned with optical fiber facets in optoelectronic transmitters and receivers. A non-hermetic enclosure provides mechanical protection of the components during alignment and assembly of the module. A substantially hermetic enclosure provides additional protection of optoelectronic components against airborne contaminants or moisture. The protective enclosures physically encompass the diode array chip with its delicate wire bonds and also provide a liquid containment dam for easier application of resin for protective encapsulation of the diode array chip. Dual resin encapsulation may include a first resin layer chosen for transparency and a harder setting covering layer. These protective variants can be implemented in different combinations offering varying degrees of protection of the optical components.

Abstract: High data rate interconnections between foldable parts of a cellular telephone handset, such as the handset keypad and handset display portions, are made by free space optical data transmission between light emitting devices such as laser diodes or LEDs and photodiodes, without use of optical waveguides or cables between the foldable parts.

Abstract: A pedal actuated seat lifter has a mounting plate fastened between a toilet bowl and its seat using existing bolts holding the seat in place. A floor pedal transmits lifting force through a chain or the like to a lever and lifting arm hinged to the mounting plate. The seat lifter can be provided as a kit of parts for relatively simple assembly and installation on an existing toilet fixture without use of adhesives or alteration of the toilet fixture, the floor or walls.

Abstract: A circuit board has embedded optical fibers terminating in fiber ends which face into holes defined in the circuit board and optoelectronic emitter or detector modules mounted in the holes in optical coupling with the fiber ends. Each module is electrically connected to circuit traces on the circuit board and is optically coupled to one or more optical fibers terminating on a side surface of the hole. The modules have an optical axis oriented into the hole and a reflector supported in the hole for optically coupling the photo emitter/detector module with the fiber ends on the side surface of the hole.

Abstract: A circuit board has embedded optical fibers terminating in fiber ends which face into holes defined in the circuit board and optoelectronic emitter or detector modules mounted in the holes in optical coupling with the fiber ends. Each module is electrically connected to circuit traces on the circuit board and is optically coupled to one or more optical fibers terminating on a side surface of the hole. The modules have an optical axis oriented into the hole and a reflector supported in the hole for optically coupling the photo emitter/detector module with the fiber ends on the side surface of the hole.

Abstract: Optical fibers are embedded in a fiber layer contained between top and bottom surfaces of a circuit board. The optical fibers have fiber ends facing into holes or cavities defined in the insulating board. Optoelectronic emitter and detector elements are mounted in the holes in optical coupling with the fiber ends. The board also has layers of conductive traces for interconnecting electronic components and devices mounted on the board and for electrically connecting the optoelectronic emitter and detector devices to corresponding transmitter and receiver modules.

Abstract: A temperature compensated laser diode transmitter circuit includes a laser diode, a driver circuit for supplying an a.c. drive current to the laser diode, a thermistor arranged to thermally sense the laser diode, a current source having a first and a second current output controlled by the thermistor, the first current output connected to the driver for temperature compensating the drive current, and the second current output connected to supply a temperature compensated bias current to the laser diode.

Abstract: An optoelectronic module has an optoelectronic receiver or transmitter supported in optical alignment with optical fibers on a common substrate assembly. The module is optically prealigned and can be mounted through a hole in an enclosure containing transmitter or receiver circuits to make a complete optoelectronic package. The module may be hermetically and electromagnetically sealed to the enclosure. In one form of the invention, the optical fibers terminate at a rear face of the module, and the module can be coupled to a conventional fiber optic connector.

Abstract: An optical interconnect is disclosed that couples multiple optical fibers to an array of optoelectronic devices. The interconnect includes a multiple optical fiber connector and an optoelectronic board. The multiple fiber connector can be mechanically attached to or detached from the board.

Abstract: An integrated mounting assembly has optical fibers supported between a grooved substrate and a clamping substrate, one or both substrates being mounted to a base substrate. The base substrate also provides integrated support for a submount which carries an optoelectronic device, e.g., a laser diode. Optical coupling of the device to the optical fibers is achieved by referencing the submount to the base without need for active optical alignment of the device. Mounting of the integrated optoelectronic assembly in a housing of an optoelectronic package can be made hermetic and electromagnetically shielded.

Abstract: An optical interconnect is disclosed that couples multiple optical fibers to an array of optoelectronic devices. The interconnect includes a multiple optical fiber connector and an optoelectronic board. The multiple fiber connector can be mechanically attached to or detached from the board.