Abstract: A circuit body routing structure includes a circuit body routed, with respect to a vehicle body having a rocker on which a center pillar is erected, along the rocker. The circuit body is formed of a long flat conductor having a conductor portion of a flat cross-sectional shape. The circuit body includes a linear portion disposed overlapping an upper surface of the rocker, and a detour portion disposed overlapping a side surface of the rocker on a vehicle interior side or a side surface of the center pillar on the vehicle interior side at a junction between the rocker and the center pillar.

Abstract: A light emitting device includes a support member, a semiconductor laser element, a light reflecting member, and a wavelength conversion member. The support member has a base and a cap that includes a light extraction window from which light is extracted upward. The semiconductor laser element is disposed within a space defined by the base and the cap. The light reflecting member is disposed in the space at a position where light from the semiconductor laser element is reflected toward the light extraction window. The wavelength conversion member is disposed between the semiconductor laser element and the light reflecting member, and includes a support surface that supports the light reflecting member, and a light incidence surface on which the light emitted by the semiconductor laser element is incident. Part of the wavelength conversion member is fitted into the light extraction window.

Abstract: A vehicle circuit body includes a flat routing member that forms a main line of the vehicle circuit body, and an electrical wire bundle that includes a plurality of electrical wires in a prescribed routing shape, in which a part of the electrical wire bundle which forms the main line is routed on the flat routing member.

Abstract: A light-emitting device includes: a semiconductor laser element; a supporting member located above the semiconductor laser element, the supporting member having a through-hole that allows light emitted from the semiconductor laser element to pass therethrough; a fluorescent member located in the through-hole, the fluorescent member containing a fluorescent material that is excitable by light emitted from the semiconductor laser element so as to emit light having a wavelength different from a wavelength of the light emitted from the semiconductor laser element; and a light-transmissive heat dissipating member including: a base portion, and a projecting portion projecting from the base portion into the through-hole. An upper surface of the projecting portion of the heat dissipating member is bonded to a lower surface of the fluorescent member. An upper surface of the base portion of the heat dissipating member is bonded to a lower surface of the supporting member.

Abstract: A tolerance absorbing structure of a first power supply distribution box includes a connection terminal to which one end part of a flat distribution member is connected and fixed; a storage case including a connection opening member into which the connection terminal is inserted and fixed to a vehicle body; an elastic support member configured to support the connection terminal freely movably in a three-dimensional direction with respect to the connection opening member; and a flexible conductor configured to connect a substrate connection part of a circuit conductor stored in the storage case and the connection terminal with an extra length.

Abstract: A method of manufacturing a light emitting device includes: disposing a first glass that does not contain a fluorescent material on a light-reflecting member; disposing a fluorescent material containing member on the light-reflecting member via the first glass; fusing the first glass to the fluorescent material containing member at a first temperature to fix the fluorescent material containing member to the light-reflecting member; placing a second glass containing a second fluorescent material on a light emitting surface side of the fluorescent material containing member; fusing the second glass to at least one of the light-reflecting member and the first glass at a second temperature that is lower than the first temperature; and disposing a light emitting element such that light emitted from the light emitting element is irradiated on a light incident surface of the fluorescent material containing member.

Abstract: An inspection operator can perform a hammering inspection without operation to move an inspection device to a location to be inspected, and the hammering inspection can also be performed to the location to be inspected where a vehicle has difficulty in entering. An inspection system includes a flying device including a hammering inspection unit that performs an inspection and a flying unit that flies with the hammering inspection unit, a ground-side device that is fixedly installed at a position relative to a location to be inspected and detects a position of the flying device, and a flight instruction unit that controls the flying device in such a way that a forwarding direction of the flying device is a direction from the ground-side device to the location to be inspected based on the position of the flying device.

Abstract: There is provided a routing structure of a circuit body in a rocker formed on a vehicle body. The circuit body routing structure has a recessed housing groove formed along an extending direction of the rocker on a side surface of the rocker at a vehicle interior side, a circuit body that is formed of a long flat conductor having a conductor portion of a flat cross-sectional shape and that is housed in the housing groove and routed on the rocker, and an interior material that is mounted on the rocker so as to cover an upper surface and the side surface of the rocker, and that holds the circuit body in the housing groove.

Abstract: A circuit body routing structure includes a circuit body routed, with respect to a vehicle body having a rocker on which a center pillar is erected, along the rocker. The circuit body is formed of a long flat conductor having a conductor portion of a flat cross-sectional shape. The circuit body includes a linear portion disposed overlapping an upper surface of the rocker, and a detour portion disposed overlapping a side surface of the rocker on a vehicle interior side or a side surface of the center pillar on the vehicle interior side at a junction between the rocker and the center pillar.

Abstract: A tolerance absorbing structure of a first power supply distribution box includes a connection terminal to which one end part of a flat distribution member is connected and fixed; a storage case including a connection opening member into which the connection terminal is inserted and fixed to a vehicle body; an elastic support member configured to support the connection terminal freely movably in a three-dimensional direction with respect to the connection opening member; and a flexible conductor configured to connect a substrate connection part of a circuit conductor stored in the storage case and the connection terminal with an extra length.

Abstract: A light-emitting device includes: a semiconductor laser element; a supporting member located above the semiconductor laser element, the supporting member having a through-hole that allows light emitted from the semiconductor laser element to pass therethrough; a fluorescent member located in the through-hole, the fluorescent member containing a fluorescent material that is excitable by light emitted from the semiconductor laser element so as to emit light having a wavelength different from a wavelength of the light emitted from the semiconductor laser element; and a light-transmissive heat dissipating member including: a base portion, and a projecting portion projecting from the base portion into the through-hole. An upper surface of the projecting portion of the heat dissipating member is bonded to a lower surface of the fluorescent member. An upper surface of the base portion of the heat dissipating member is bonded to a lower surface of the supporting member.

Abstract: A wavelength conversion member includes a light-reflecting member and a phosphor-containing layer. The light-reflecting member is configured to reflect laser light. The phosphor-containing layer includes a base component provided on the light-reflecting member and one or more projecting portions protruding from the base component toward a direction away from the light-reflecting member. Each of the one or more projecting portions is configured to be irradiated with laser light. Each of the one or more projecting portions is smaller than the base component and larger than a spot of the laser light to be irradiated.

Abstract: A region extending over a predetermined distance from a first latch claw center portion, out of an end part on one side in the longitudinal direction of a first latch claw opening, toward one side in the longitudinal direction is bulged radially inward to form a first latch claw while both sides of the center portion do not form the first latch claw. A region extending over a predetermined distance from a second latch claw center portion, out of an end part on the other side in the longitudinal direction of a second latch claw opening, toward the other side in the longitudinal direction is bulged radially outward to form a second latch claw while both sides of the center portion do not form the second latch claw.

Abstract: A light-emitting device includes: a semiconductor laser element; a supporting member located above the semiconductor laser element, the supporting member having a through-hole that allows light emitted from the semiconductor laser element to pass therethrough; a fluorescent member located in the through-hole, the fluorescent member containing a fluorescent material that is excitable by light emitted from the semiconductor laser element so as to emit light having a wavelength different from a wavelength of the light emitted from the semiconductor laser element; and a light-transmissive heat dissipating member including: a base portion, and a projecting portion projecting from the base portion into the through-hole. An upper surface of the projecting portion of the heat dissipating member is bonded to a lower surface of the fluorescent member. An upper surface of the base portion of the heat dissipating member is bonded to a lower surface of the supporting member.

Abstract: Provided is a method for producing a negative electrode for an electric storage device, the method comprising the steps of: preparing a negative electrode composition comprising a negative electrode active material that reversibly carries a sodium ion, metal sodium, and a liquid dispersion medium for dispersing them; allowing a negative electrode current collector to hold the negative electrode composition; evaporating at least part of the liquid dispersion medium from the negative electrode composition held by the negative electrode current collector, thereby giving a negative electrode precursor comprising the negative electrode active material, the metal sodium, and the negative electrode current collector; and bringing the negative electrode precursor into contact with an electrolyte having sodium ion conductivity, thereby doping the negative electrode active material with sodium eluted from the metal sodium.

Abstract: A wavelength conversion member includes a light-reflecting member configured to reflect laser light, and a phosphor-containing layer disposed on the light-reflecting member. The phosphor-containing layer includes one or more projecting portions each configured to be irradiated with laser light. An area of each projecting portion is larger than an area of a spot of the laser light in a plan view. A light source device includes the wavelength-converting member and one or more laser elements. The wavelength-converting member is arranged at a position so that laser light emitted from the one or more laser elements are irradiated on a corresponding one of the one or more projecting portions.

Abstract: A method of manufacturing a light emitting device includes: disposing a first glass that does not contain a fluorescent material on a light-reflecting member; disposing a fluorescent material containing member on the light-reflecting member via the first glass; fusing the first glass to the fluorescent material containing member at a first temperature to fix the fluorescent material containing member to the light-reflecting member; placing a second glass containing a second fluorescent material on a light emitting surface side of the fluorescent material containing member; fusing the second glass to at least one of the light-reflecting member and the first glass at a second temperature that is lower than the first temperature; and disposing a light emitting element such that light emitted from the light emitting element is irradiated on a light incident surface of the fluorescent material containing member.

Abstract: A light emitting device includes a semiconductor laser element, a support member and a wavelength conversion member. The support member defines a through-hole through which laser light emitted from the semiconductor laser element passes. The wavelength conversion member has a lateral surface fixed to an inner wall of the through-hole, a first main surface having a first region to which the laser light is incident, a second main surface opposite to the first main surface, and an inclined surface connected to the second main surface and the lateral surface. The inclined surface is inclined such that a thickness of a peripheral portion of the wavelength conversion member is thinner than a thickness of a center portion of the wavelength conversion member. The inclined surface partially overlaps with the first region of the first main surface in plan view.

Abstract: A laser diode device includes a semiconductor laser element, a transmissive member, and phosphor-containing members. The transmissive member is disposed separately from the semiconductor laser element and includes a plurality of recessed portions on a side opposite to a side in which light from the semiconductor laser element enters and within a region that is irradiated with the light from the semiconductor laser element. The phosphor-containing members are disposed in the plurality of recessed portions. A portion of light enters and passes through the transmissive member between the phosphor-containing members and exits the transmissive member without passing through the phosphor-containing members.

Abstract: Provided is a method for producing a negative electrode for an electric storage device, the method comprising the steps of: preparing a negative electrode composition comprising a negative electrode active material that reversibly carries a sodium ion, metal sodium, and a liquid dispersion medium for dispersing them; allowing a negative electrode current collector to hold the negative electrode composition; evaporating at least part of the liquid dispersion medium from the negative electrode composition held by the negative electrode current collector, thereby giving a negative electrode precursor comprising the negative electrode active material, the metal sodium, and the negative electrode current collector; and bringing the negative electrode precursor into contact with an electrolyte having sodium ion conductivity, thereby doping the negative electrode active material with sodium eluted from the metal sodium.