Patents by Inventor Toshifumi Inamasu

Toshifumi Inamasu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190312006
    Abstract: A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a rotator configured to rotate the first holder and the second holder relatively; a moving device configured to move the first holder and the second holder relatively in a horizontal direction; three position measurement devices disposed at the first holder or the second holder rotated by the rotator and configured to measure a position of the first holder or the second holder; and a controller configured to control the rotator and the moving device based on measurement results of the three position measurement devices.
    Type: Application
    Filed: October 10, 2017
    Publication date: October 10, 2019
    Inventors: Takashi Nakamitsu, Shuhei Matsumoto, Toshifumi Inamasu
  • Patent number: 10373847
    Abstract: A bonding apparatus includes an upper holding unit, a lower holding unit, a pushing unit and an attracting/holding unit. The upper holding unit is configured to hold a first substrate from a top surface thereof which is a non-bonding surface. The lower holding unit is provided under the upper holding unit and is configured to hold a second substrate from a bottom surface thereof while allowing the second substrate to face the first substrate. The pushing unit is configured to press a central portion of the first substrate from above to bring the central portion of the first substrate into contact with the second substrate. The attracting/holding unit is configured to be moved up and down with respect to the upper holding unit and hold a part of the top surface of the first substrate by attraction before the first substrate is held by the upper holding unit.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: August 6, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Toshifumi Inamasu
  • Patent number: 10340248
    Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: July 2, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Masataka Matsunaga, Takashi Koga, Takeshi Tamura, Takahiro Masunaga, Yuji Mimura, Masaru Honda, Toshifumi Inamasu, Satoshi Nishimura
  • Publication number: 20180019225
    Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.
    Type: Application
    Filed: July 7, 2017
    Publication date: January 18, 2018
    Inventors: Masataka MATSUNAGA, Takashi KOGA, Takeshi TAMURA, Takahiro MASUNAGA, Yuji MIMURA, Masaru HONDA, Toshifumi INAMASU, Satoshi NISHIMURA
  • Publication number: 20180019140
    Abstract: A bonding apparatus includes an upper holding unit, a lower holding unit, a pushing unit and an attracting/holding unit. The upper holding unit is configured to hold a first substrate from a top surface thereof which is a non-bonding surface. The lower holding unit is provided under the upper holding unit and is configured to hold a second substrate from a bottom surface thereof while allowing the second substrate to face the first substrate. The pushing unit is configured to press a central portion of the first substrate from above to bring the central portion of the first substrate into contact with the second substrate. The attracting/holding unit is configured to be moved up and down with respect to the upper holding unit and hold a part of the top surface of the first substrate by attraction before the first substrate is held by the upper holding unit.
    Type: Application
    Filed: July 10, 2017
    Publication date: January 18, 2018
    Inventor: Toshifumi Inamasu
  • Patent number: 9468946
    Abstract: A wiping pad includes: a scraping edge provided to cross a long side direction of a discharge port and come into contact with the discharge port and nozzle side surfaces, and a lead-out passage provided ahead of the scraping edge in a moving direction along a nozzle long side direction to drain a treatment solution scraped away with the scraping edge, wherein the lead-out passage is a V-shaped groove formed along the moving direction on a pad upper surface side, and the V-shaped groove has the scraping edge formed at a rear end edge portion thereof and is formed to gradually increase in groove width and depth toward a front thereof from the scraping edge.
    Type: Grant
    Filed: January 17, 2013
    Date of Patent: October 18, 2016
    Assignee: Tokyo Electron Limited
    Inventors: Toshifumi Inamasu, Yukio Ogasawara, Kei Tashiro
  • Publication number: 20140373779
    Abstract: A wiping pad includes: a scraping edge provided to cross a long side direction of a discharge port and come into contact with the discharge port and nozzle side surfaces, and a lead-out passage provided ahead of the scraping edge in a moving direction along a nozzle long side direction to drain a treatment solution scraped away with the scraping edge, wherein the lead-out passage is a V-shaped groove formed along the moving direction on a pad upper surface side, and the V-shaped groove has the scraping edge formed at a rear end edge portion thereof and is formed to gradually increase in groove width and depth toward a front thereof from the scraping edge.
    Type: Application
    Filed: January 17, 2013
    Publication date: December 25, 2014
    Inventors: Toshifumi Inamasu, Yukio Ogasawara, Kei Tashiro
  • Patent number: 8307778
    Abstract: Jet lines C1, C3, C5, . . . extending in an X-direction and suction lines C2, C4, C6, . . . extending in the X-direction are arranged alternately at a fixed pitch W in a Y-direction. Jet openings 88 are arranged at fixed intervals 3D on the jet lines C2n?1, suction openings 90 are arranged at fixed intervals 3D on the suction lines C2n, and the jet openings 88 and the suction openings 90 on the adjacent ones of the jet lines C2n?1 and the suction lines C2n are spaced apart from each other by a fixed distance D with respect to the X-direction. Slots 88a and 90a are extended straight from the upper ends of the jet openings 88 and the upper ends of the suction openings 90, respectively, in a carrying direction (the X-direction) and a direction opposite the carrying direction.
    Type: Grant
    Filed: July 5, 2007
    Date of Patent: November 13, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Toshifumi Inamasu, Fumihiko Ikeda, Kenya Shinozaki, Yoshitaka Otsuka
  • Patent number: 7908995
    Abstract: A stage apparatus in which a rectangular substrate which is levitated over a stage is transferred such that a pair of sides of the rectangular substrate are substantially parallel to a transfer direction and the other pair of sides of the rectangular substrate are substantially perpendicular to the transfer direction. The stage includes a plurality of gas spray ports to spray a gas and a plurality of suction ports to attract the rectangular substrate by suction. The rectangular substrate is levitated at a predetermined height from the surface of the stage in a substantially horizontal posture by means of suction of a suction mechanism through the plurality of suction ports and gas spray of a gas spray mechanism through the plurality of gas spray ports.
    Type: Grant
    Filed: January 19, 2006
    Date of Patent: March 22, 2011
    Assignee: Tokyo Electron Limited
    Inventors: Toshifumi Inamasu, Tsuyoshi Yamasaki, Kazuhito Miyazaki
  • Patent number: 7905195
    Abstract: The present invention provides a floating-type substrate conveying and processing apparatus that floats a substrate to be processed. The device includes a floating stage that floats the substrate, a liquid supplier placed above the floating stage via the substrate to supply a process liquid to a surface of the substrate, and a moving mechanism for holding the substrate as detachable at opposite ends of the substrate, at a floating height of the substrate, and for moving the substrate on the floating stage. The floating stage is formed of a porous member and has a plurality of suction apertures airtightly defined in a porous portion of the porous member. The floating stage injects gas through the porous portion and sucks gas through the suction apertures to float the substrate placed on the porous portion.
    Type: Grant
    Filed: July 14, 2006
    Date of Patent: March 15, 2011
    Assignee: Tokyo Electron Limited
    Inventors: Tsuyoshi Yamasaki, Toshifumi Inamasu, Kenya Shinozaki, Kimio Motoda
  • Publication number: 20090311434
    Abstract: Formation of banded irregularities in a process liquid film formed on a substrate being carried by a flotation carrying system is reduced or suppressed effectively. Jet lines C1, C3, C5, . . . extending in an X-direction and suction lines C2, C4, C6, . . . extending in the X-direction are arranged alternately at a fixed pitch W in a Y-direction. Jet openings 88 are arranged at fixed intervals 3D on the jet lines C2n?1, suction openings 90 are arranged at fixed intervals 3D on the suction lines C2n, and the jet openings 88 and the suction openings 90 on the adjacent ones of the jet lines C2n?1 and the suction lines C2n are spaced apart from each other by a fixed distance D with respect to the X-direction. Slots 88a and 90a are extended straight from the upper ends of the jet openings 88 and the upper ends of the suction openings 90, respectively, in a carrying direction (the X-direction) and a direction opposite the carrying direction.
    Type: Application
    Filed: July 5, 2007
    Publication date: December 17, 2009
    Applicant: Tokyo Electron Limited
    Inventors: Toshifumi Inamasu, Fumihiko Ikeda, Kenya Shinozaki, Yoshitaka Otsuka
  • Publication number: 20090047103
    Abstract: A stage apparatus in which a rectangular substrate which is levitated over a stage is transferred such that a pair of sides of the rectangular substrate are substantially parallel to a transfer direction and the other pair of sides of the rectangular substrate are substantially perpendicular to the transfer direction. The stage includes a plurality of gas spray ports to spray a gas and a plurality of suction ports to attract the rectangular substrate by suction. The rectangular substrate is levitated at a predetermined height from the surface of the stage in a substantially horizontal posture by means of suction of a suction mechanism through the plurality of suction ports and gas spray of a gas spray mechanism through the plurality of gas spray ports.
    Type: Application
    Filed: January 19, 2006
    Publication date: February 19, 2009
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Toshifumi Inamasu, Tsuyoshi Yamasaki, Kazuhito Miyazaki
  • Publication number: 20070017442
    Abstract: The present invention provides a floating-type substrate conveying and processing apparatus that floats a substrate to be processed. The device includes a floating stage that floats the substrate, a liquid supplier placed above the floating stage via the substrate to supply a process liquid to a surface of the substrate, and a moving mechanism for holding the substrate as detachable at opposite ends of the substrate, at a floating height of the substrate, and for moving the substrate on the floating stage. The floating stage is formed of a porous member and has a plurality of suction apertures airtightly defined in a porous portion of the porous member. The floating stage injects gas through the porous portion and sucks gas through the suction apertures to float the substrate placed on the porous portion.
    Type: Application
    Filed: July 14, 2006
    Publication date: January 25, 2007
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Tsuyoshi Yamasaki, Toshifumi Inamasu, Kenya Shinozaki, Kimio Motoda