Patents by Inventor Toshiharu Hiji

Toshiharu Hiji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7015710
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: March 21, 2006
    Assignee: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Patent number: 6937042
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: August 30, 2005
    Assignee: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Patent number: 6919732
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: July 19, 2005
    Assignee: Genesis Technology Incorporation
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Patent number: 6917211
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: July 12, 2005
    Assignee: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Patent number: 6903563
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: June 7, 2005
    Assignee: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Patent number: 6900647
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Grant
    Filed: February 12, 2004
    Date of Patent: May 31, 2005
    Assignee: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Publication number: 20050007130
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Application
    Filed: August 2, 2004
    Publication date: January 13, 2005
    Applicant: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Publication number: 20050001644
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Application
    Filed: August 2, 2004
    Publication date: January 6, 2005
    Applicant: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Publication number: 20050001643
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Application
    Filed: August 2, 2004
    Publication date: January 6, 2005
    Applicant: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Publication number: 20050001642
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Application
    Filed: August 2, 2004
    Publication date: January 6, 2005
    Applicant: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Kato, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Publication number: 20050001641
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Application
    Filed: August 2, 2004
    Publication date: January 6, 2005
    Applicant: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Kato, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Publication number: 20040160236
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Application
    Filed: February 12, 2004
    Publication date: August 19, 2004
    Applicant: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Patent number: 6710608
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Grant
    Filed: February 19, 2002
    Date of Patent: March 23, 2004
    Assignee: Mitsubishi Materials Corporation
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Publication number: 20020186030
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Application
    Filed: February 19, 2002
    Publication date: December 12, 2002
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Publication number: 20010032708
    Abstract: An electrode plate which can provide a uniformly-etched surface to an etching surface of a plate to be etched is disclosed, which is used for a plasma etching equipment having such a structure that an electrode plate having a plurality of small vertical through holes is arranged opposite to an etching surface at a prescribed distance from the etching surface, and an etching gas which is introduced into the plasma etching equipment is jetted from the small vertical through holes of the electrode plate and plasma is generated between the etching surface and the surface of the electrode plate to carry out etching, and is characterized in that the electrode plate is composed of high-pure silicon having a cast structure which is formed by a unidirectional solidification perpendicular to the etching surface, thereby to make it possible to form a uniformly-etched surface.
    Type: Application
    Filed: May 30, 2001
    Publication date: October 25, 2001
    Applicant: Mitsubishi Materials Corporation
    Inventors: Akifumi Mishima, Toshiharu Hiji, Yoshinobu Nakada, Tamotsu Mori
  • Publication number: 20010019276
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Application
    Filed: May 23, 1997
    Publication date: September 6, 2001
    Inventors: HIDEAKI YOSHIDA, TOSHINORI ISHII, ATUSHI MATSUDA, MITSUYOSHI UEKI, NORIYOSHI TACHIKAWA, TADASHI NAKAMURA, NAOKI KATOU, SHOU TAI, HAYATO SASAKI, NAOHUMI IWAMOTO, AKIHUMI MISHIMA, TOSHIHARU HIJI, AKIHIRO MASUDA
  • Patent number: 4354301
    Abstract: There is disclosed a method for manufacturing a stripe-patterned metal plate or composite material. Plural kinds of metal sheet blanks having different colors are placed one upon another to provide a layer structure. The metal sheets of the layer structure are bonded to each other directly and metallurgically in a solid state to provide a layer-structured plate. The layer-structured plate is cut in a direction along a face extending at a predetermined angle to a layer face thereof to provide at least one thin metal plate intermediate. The metal plate intermediate is inserted into a complementary hole formed through a solid package of metal. Then, the package containing the metal plate intermediate is hot rolled into a predetermined length with its width remaining substantially unchanged so that the metal plate intermediate is simultaneously extended at a predetermined reduction rate with its width remaining substantially unchanged.
    Type: Grant
    Filed: August 25, 1981
    Date of Patent: October 19, 1982
    Assignee: Mitsubushi Kinzoku Kabushiki Kaisha
    Inventors: Yo Takeuchi, Masaki Morikawa, Chuji Tanaka, Toshiharu Hiji, Hiroshi Ikeda