Patents by Inventor Toshihiko Kitaura

Toshihiko Kitaura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4956132
    Abstract: A method of applying a mold-releasing agent to the molding surfaces of a mold after cleaning the surface. This method involves inserting a mold-releasing sheet between said molding surfaces of a mold coating the molding surfaces with the mold releasing agent by heating and pressing the mold-releasing sheet to cure it, and removing the cured sheet from the molding surfaces of the mold. This mold-releasing sheet is composed of (i) uncured rubber, (ii) a curing agent, and (iii) a mold releasing agent. The uncured rubber can be selected from a group consisting of chloroprene rubber, butadiene rubber, nitrile rubber, ethylene-propylene terpolymer rubber, styrene-butadiene rubber, polyisoprene rubber, butyl rubber, silicone rubber, and fluoridated rubber.
    Type: Grant
    Filed: November 7, 1988
    Date of Patent: September 11, 1990
    Assignee: Nitto Denko Corporation
    Inventors: Toshihiko Kitaura, Akio Nakamura, Masayuki Sakamoto, Kouichi Takashima, Kiyotaka Hirakawa, Matao Mizota
  • Patent number: 4935175
    Abstract: A mold-cleaning composition and sheet comprising an uncured rubber composition comprising an uncured rubber and a curing agent, and at least one removal aid selected from imidazoles and imidazolines, and a method for cleaning a mold using the mold-cleaning sheet, are disclosed. The mold-cleaining sheet is suitably used to clean molding surfaces of a mold or to remove contaminants such as burr formed at peripheries thereof in the continuous production of semiconductor devices by transfer molding.
    Type: Grant
    Filed: December 11, 1987
    Date of Patent: June 19, 1990
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Toshihiko Kitaura, Akio Nakamura, Masayuki Sakamoto, Kouichi Takashima, Kiyotaka Hirakawa, Matao Mizota
  • Patent number: 3943623
    Abstract: A method of assembling split, hollow package sections housing an electronic element, having an internal lead wire and having external lead wires extending outwardly therefrom, wherein the package sections are adhesively secured together with external lead wires interposed between the mating surfaces by a fibrous sheet carried by the mating surface of the base portion with the sheet impregnated with a partially-cured plastic polymer.
    Type: Grant
    Filed: August 23, 1974
    Date of Patent: March 16, 1976
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Kazunori Mizutani, Toshihiko Kitaura, Minoru Noo