Patents by Inventor Toshihiko Ohta

Toshihiko Ohta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210070679
    Abstract: A process for producing one or both of tetrafluoroethylene and hexafluoropropylene, which includes pyrolyzing a low molecular weight fluorine compound by continuous reaction in a microreactor.
    Type: Application
    Filed: November 16, 2020
    Publication date: March 11, 2021
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Toshihiko OHTA, Hideki Nakaya, Mai Hirai, Takashi Yasuhara, Atsushi Noguchi
  • Patent number: 7091870
    Abstract: A terminal system has a mass spectrometric for inspecting of dangerous substances is installed in an inspection area, and a support system for determining whether or not a dangerous substance is present and identifying the type of the substance, based on the mass spectrometric data on the target element that has been measured by the mass spectrometric, is installed in a security service enterprise's office. Both systems are connected to each other via a communication network so that they can exchange information. Thus, the support system can send the determination result of dangerous substances and a precautions guide to the terminal system via the communication network.
    Type: Grant
    Filed: February 21, 2002
    Date of Patent: August 15, 2006
    Assignees: Hitachi, Ltd., NOF Corporation
    Inventors: Hirofumi Tsutsumi, Keiko Nakashige, Seiji Tanaka, Yoshihiro Nishikawa, Yasuaki Takada, Toshihiko Ohta, Akio Torii, Tomoyuki Hisada, Kenji Kusumoto
  • Patent number: 6770877
    Abstract: A method and apparatus for analyzing vapors generated from explosives in which vapors containing nitrogen monoxide and/or nitrogen dioxide are generated by decomposing explosives by increasing the temperature of the explosives, primary ions and neutral molecules are generated from air. The generated primary ions and the nitrogen monoxide and/or nitrogen dioxide contained in the generated vapors are allowed to react with each other in an area inhibited or prevented from being penetrated by the generated neutral molecules, and the nitrogen monoxide and/or nitrogen dioxide contained in the generated vapors is ionized. The ionized nitrogen monoxide and/or nitrogen dioxide is subjected to mass spectrometry, and an amount of the nitrogen monoxide and/or nitrogen dioxide contained in the generated vapors by decomposing the explosives is determined.
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: August 3, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Toshihiko Ohta, Kenji Kusumoto, Yasuaki Takada, Hisashi Nagano
  • Publication number: 20040113067
    Abstract: The present invention provides a method for analyzing vapors generated from explosives, capable of collecting a sample with ease, and stably analyzing the vapors generated from explosives in a short time and with high accuracy, and an analysis apparatus to be used for the analysis method.
    Type: Application
    Filed: June 10, 2003
    Publication date: June 17, 2004
    Inventors: Toshihiko Ohta, Kenji Kusumoto, Yasuaki Takada, Hisashi Nagano
  • Patent number: 6542666
    Abstract: Wavelength multiplex transmission is realized in which the temperature dependency of an EDFA is compensated for in relation to the wavelengths which are used. A first and a second long-period grating which have different periods from each other are formed in an optical fiber, ensuring that the peak wavelength of a waveform representing an optical transmission loss characteristic of the first long-period grating side is located on the shorter wavelength side than a transmission band and a peak wavelength of a waveform representing an optical transmission loss characteristic of the second long-period grating side is located on the longer wavelength side within the transmission band.
    Type: Grant
    Filed: March 12, 2001
    Date of Patent: April 1, 2003
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Toshiaki Tsuda, Shigehito Yodo, Kazuyo Mizuno, Yu Mimura, Toshihiko Ohta, Yoshihiro Emori, Shu Namiki
  • Publication number: 20030035624
    Abstract: A bandpass filter for a predetermined wavelength range is comprised of a pair of uniform fiber gratings each having a cutoff characteristic with a sharp inclination for prohibiting transmission of light in a longer wavelength range and a shorter wavelength range adjacent to the predetermined wavelength range, and a pair of chirped fiber gratings each having a wide cutoff band characteristic for prohibiting transmission of the light in a longer wavelength range and a shorter wavelength range adjacent to the predetermined wavelength range. The uniform fiber gratings and chirped fiber gratings are formed on the same light propagation path. A dielectric multilayer filter or an arrayed-waveguide grating is integrally incorporated to realize a fiber-based optical component which has a wavelength transmission characteristic suitable for use in a WDM system.
    Type: Application
    Filed: April 24, 2002
    Publication date: February 20, 2003
    Inventors: Keiichiro Saito, Toshihiko Ohta
  • Publication number: 20030009661
    Abstract: A terminal system 1 which has mass spectrometric means for inspecting for dangerous substances is installed in an inspection area, and a support system 2 for determining whether or not a dangerous substance is present and identifying the type of the substance, based on the mass spectrometric data on the target element that has been measured by said mass spectrometric means, is installed in a security service enterprise's office. Both systems are connected to each other via a communication network so that they can exchange information. Thus, the support system 2 can send the determination result of dangerous substances and a precautions guide to the terminal system 1 via said communication network 3. The security service enterprise conducts equipment management, such as maintenance and checkups, and operation administration of the security system, thereby making it easier for a user to introduce this security system.
    Type: Application
    Filed: February 21, 2002
    Publication date: January 9, 2003
    Inventors: Hirofumi Tsutsumi, Keiko Nakashige, Seiji Tanaka, Yoshihiro Nishikawa, Yasuaki Takada, Toshihiko Ohta, Akio Torii, Tomoyuki Hisada, Kenji Kusumoto
  • Patent number: 6410881
    Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.
    Type: Grant
    Filed: June 18, 2001
    Date of Patent: June 25, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura
  • Patent number: 6404946
    Abstract: An arrayed waveguide grating type optical multiplexer/demultiplexer including an arrayed waveguide grating having a plurality of channel waveguides. Concave end faces of input-side and output-side slab waveguides are connected to opposite ends of the diffraction grating. At least one input waveguide and at least one output waveguide are connected to the other concave end faces of the input-side and output-side slab waveguides, respectively. The focal length of the output-side slab waveguide end face is longer than the focal length of the input-side slab waveguide end face. The optical multiplexer/demultiplexer has a sufficiently flat wavelength-dependent spectrum response in passing channel spacings, and helps construct an optical wavelength multiple communication system having a good signal-to-noise ratio.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: June 11, 2002
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Takeshi Nakajima, Kanji Tanaka, Toshihiko Ohta, Shiro Nakamura
  • Patent number: 6377723
    Abstract: A plate-shaped member (8a) whose linear expansion coefficient is larger than that of a substrate (1) is provided on the rear side of the substrate (1) of an arrayed waveguide diffraction grating (11) which divides, by a diffraction effect of an array waveguide (40), lights of a plurality of wavelengths from those having a plurality of wavelengths different from each other, which are inputted from an optical input waveguide (2), and outputs these lights from the respective optical output waveguides (6). A light transmission feature of the respective output lights includes a light transmission feature for causing lights to be transmitted, centering around the center wavelengths of light transmission, which are different from each other, wherein the center wavelengths of light transmission shifts to the long wavelength side by a temperature rise.
    Type: Grant
    Filed: September 13, 2000
    Date of Patent: April 23, 2002
    Assignee: The Furukawa Electric Co., Ltd
    Inventors: Tsunetoshi Saito, Toshihiko Ohta
  • Publication number: 20020025115
    Abstract: Wavelength multiplex transmission is realized in which the temperature dependency of an EDFA is compensated for in relation to the wavelengths which are used. A first and a second long-period grating which have different periods from each other are formed in an optical fiber, ensuring that the peak wavelength of a waveform representing an optical transmission loss characteristic of the first long-period grating side is located on the shorter wavelength side than a transmission band and a peak wavelength of a waveform representing an optical transmission loss characteristic of the second long-period grating side is located on the longer wavelength side within the transmission band.
    Type: Application
    Filed: March 12, 2001
    Publication date: February 28, 2002
    Inventors: Toshiaki Tsuda, Shigehito Yodo, Kazuyo Mizuno, Yu Mimura, Toshihiko Ohta, Yoshihiro Emori, Shu Namiki
  • Publication number: 20010039725
    Abstract: This invention provides a process for manufacturing electronic circuits, according to which soldering can be carried out without using flux by applying a metal surface treatment procedure which allows oxide film, organic matters, carbon or the like on the surface of metal to be easily removed without using complex process nor unfavorably affecting electronic devices or circuit substrates.
    Type: Application
    Filed: June 18, 2001
    Publication date: November 15, 2001
    Applicant: Hitachi, Ltd.
    Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura
  • Publication number: 20010036335
    Abstract: The temperature dependency of an EDFA is compensated in a wavelength of 1570 to 1600 nm to realize a wavelength division multiplexing transmission. First and second long period gratings different in grating period from each other are formed in an optical fiber. The peak wavelength of the waveform of the light transmission loss characteristic of the first long period grating is formed on the shorter wavelength side than a transmission band. The peak wavelength of the waveform of the light transmission loss characteristic of the second long period grating is formed on the longer wavelength side than a transmission band.
    Type: Application
    Filed: January 25, 2001
    Publication date: November 1, 2001
    Inventors: Toshiaki Tsuda, Shigehito Yodo, Yusei Shirasaka, Kazuyo Mizuno, Toshihiko Ohta, Yoshihiro Emori, Shu Namiki
  • Patent number: 6269998
    Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: August 7, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura
  • Patent number: 6172858
    Abstract: The present invention provides a thin film head having a magnetoresistance effect element which includes at least two magnetic films, a nonmagnetic film sandwiched between the magnetic films, and leads connected to the magnetoresistance effect element wherein the width of one of the magnetic films, which essentially responds to a signal magnetic field, is not more than a distance between leads. The present invention provides a thin film head having a magnetoresistance effect element which includes at least two magnetic films and a nonmagnetic film sandwiched between the magnetic films, which makes use of a change in magnetic resistance caused by spin-dependent scattering, wherein at least a portion of one magnetic films, which essentially respond to a signal magnetic field extends in a direction same as that of the signal magnetic field.
    Type: Grant
    Filed: January 7, 2000
    Date of Patent: January 9, 2001
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroaki Yoda, Yuichi Ohsawa, Kohichi Tateyama, Reiko Kondoh, Toshihiko Ohta, Junichi Akiyama, Hitoshi Iwasaki
  • Patent number: 6161748
    Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.
    Type: Grant
    Filed: March 30, 2000
    Date of Patent: December 19, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura
  • Patent number: 6133135
    Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.
    Type: Grant
    Filed: June 1, 1999
    Date of Patent: October 17, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura
  • Patent number: 6046891
    Abstract: The present invention provides a thin film head having a magnetoresistance effect element which includes at least two magnetic films, a nonmagnetic film sandwiched between the magnetic films, and leads connected to the magnetoresistance effect element wherein the width of one of the magnetic films, which essentially responds to a signal magnetic field, is not more than a distance between leads. The present invention provides a thin film head having a magnetoresistance effect element which includes at least two magnetic films and a nonmagnetic film sandwiched between the magnetic films, which makes use of a change in magnetic resistance caused by spin-dependent scattering, wherein at least a portion of one magnetic films, which essentially respond to a signal magnetic field, extends in a direction same as that of the signal magnetic field.
    Type: Grant
    Filed: February 11, 1998
    Date of Patent: April 4, 2000
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroaki Yoda, Yuichi Ohsawa, Kohichi Tateyama, Reiko Kondoh, Toshihiko Ohta, Junichi Akiyama, Hitoshi Iwasaki
  • Patent number: 5981786
    Abstract: A process for producing a (meth)acrylate derivative including reacting a compound of formula (1) (wherein R.sup.1 is H or CH.sub.3 ; A is C.sub.1 -C.sub.10 alkylene; and p is 1 to 10) with a chloro-dioxaphosphorus compound of formula (2) (wherein q is 0 or 1) in the presence of a secondary amine of formula (3) (wherein R.sup.2 and R.sub.3 are each C.sub.3 -C.sub.8 alkyl, cycloalkyl, C.sub.6 -C.sub.9 aryl, arylalkyl, etc.) to produce a (meth)acrylate derivative of formula (4) and further reacting the same with a tertiary amine of formula (5) (wherein R.sup.4, R.sup.5 and R.sup.6 are each C.sub.1 -C.sub.4 alkyl etc.) to provide a (meth)acrylate derivative of formula (6).
    Type: Grant
    Filed: January 27, 1999
    Date of Patent: November 9, 1999
    Assignee: NOF Corporation
    Inventors: Shigeru Kitano, Toshihiko Ohta, Hiroshi Suzuki, Akio Hayashi, Yoshishige Murata, Kazuo Matsuyama, Kenichiro Nakamoto
  • Patent number: 5940728
    Abstract: A process for manufacturing electronic circuits, according to which soldering can be carried out without using flux by applying a metal surface treatment procedure which allows oxide film, organic matters, carbon or the like on the surface of metal to be easily removed without using a complex process nor unfavorably affecting electronic devices or circuit substrates. A process of connecting an electronic device and a circuit substrate by means of solder comprises the steps of irradiating the solder with a laser beam to clean the solder, aligning and mounting the electronic device on the circuit substrate, and hot-melting said solder in a low-oxygen content atmosphere to bond the electronic device and the circuit substrate.
    Type: Grant
    Filed: May 15, 1996
    Date of Patent: August 17, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Kaoru Katayama, Hiroshi Fukuda, Shinichi Kazui, Toshihiko Ohta, Yasuhiro Iwata, Mitsugu Shirai, Mitsunori Tamura