Patents by Inventor Toshihiko Saiwai

Toshihiko Saiwai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230126444
    Abstract: A heat exchanger having an outer tube through which a heating or cooling medium flows, a heat source that heats or cools the outer tube at a middle position at the exterior, and a heat-exchange part which can perform a heat exchange between the heating or cooling medium flows in the outer tube and the heat source; the heat-exchange part is provided with a porous body in a cylindrical shape being in close contact with an inner peripheral surface of the outer tube, at least one inside channel that is formed inside the porous body, and at least one valve that opens and closes the inside channel; and continuous pores that communicate with both ends of the flow direction of the heating or cooling medium and through which the heating or cooling medium can flow are formed.
    Type: Application
    Filed: February 10, 2021
    Publication date: April 27, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Toshihiko Saiwai, Koya Arai
  • Publication number: 20230097167
    Abstract: A heat-exchange pipe that is excellent in heat-exchange property in which a metal porous body is not easily dropped off form a metal pipe; which is provided with the metal pipe and the metal porous body made by joining a plurality of metal fibers bonded to an inner-wall surface of the metal pipe; at least some of the metal fibers in the metal porous body are partially bonded to the inner-wall surface of the metal pipe along a length direction, bended on the inner-wall surface of the metal pipe, and extend to leave from the inner-wall surface.
    Type: Application
    Filed: February 22, 2021
    Publication date: March 30, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventor: Toshihiko Saiwai
  • Patent number: 11590570
    Abstract: A material for porous metal body having a coil shape of a wire material wound in a helical shape, made of metal which having good thermal conductivity and can join by sintering; an average wire diameter Dw of the wire material is 0.05 mm to 2.00 mm inclusive, an average coil outer diameter Dc is 0.5 mm to 10.0 mm inclusive, a coil length L of 1 mm to 20 mm inclusive, and a winding number N is 1 to 10; and the plurality of materials for porous metal body are combined and sintered to form a metal porous body having a plurality of pores so that a pore ratio of the metal porous body is facilitated to be controlled.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: February 28, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventor: Toshihiko Saiwai
  • Patent number: 11373923
    Abstract: A heat sink including a metal-formed body having a base board part and two or more fin parts standing on a surface of the base board part and arranged in a parallel manner to each other, and one or more filled bodies consisting of a plurality of coiled metal-wire materials filled in one or more groove parts formed between the fin parts of the metal-formed body; the heat sink in which the coiled metal-wire materials have a first outer diameter at one end part and a second outer diameter at the other end part which is different from the first outer diameter; and the coiled metal-wire materials are metallurgically joined at partially to at least one of an inner surface of the groove parts of the metal-formed body and the other coiled metal-wire materials.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: June 28, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kotaro Watanabe, Toshihiko Saiwai
  • Patent number: 10981228
    Abstract: A high-quality porous aluminum sintered compact, which can be produced efficiently at a low cost; has an excellent dimensional accuracy with a low shrinkage ratio during sintering; and has sufficient strength, and a method of producing the porous aluminum sintered compact are provided. The porous aluminum sintered compact is the porous aluminum sintered compact (10) that includes aluminum substrates (11) sintered to each other. The junction (15), in which the aluminum substrates (11) are bonded to each other, includes the Ti—Al compound (16) and the Mg oxide (17). It is preferable that the pillar-shaped protrusions projecting toward the outside are formed on outer surfaces of the aluminum substrates (11), and the pillar-shaped protrusions include the junction (15).
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: April 20, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Ji-bin Yang, Koichi Kita, Toshihiko Saiwai, Koji Hoshino, Jun Katoh
  • Patent number: 10981230
    Abstract: A high quality porous aluminum body, which has excellent joint strength between the porous aluminum body and the aluminum bulk body, and a method of producing the porous aluminum complex, are provided. The porous aluminum complex (10) includes: a porous aluminum body (30) made of aluminum or aluminum alloy; and an aluminum bulk body (20) made of aluminum or aluminum alloy, the porous aluminum body (30) and the aluminum bulk body (20) being joined to each other. The junction (15) between the porous aluminum body (30) and the aluminum bulk body (20) includes a Ti—Al compound. It is preferable that pillar-shaped protrusions (32) projecting toward the outside are formed on outer surfaces of one of or both of the porous aluminum body (30) and the aluminum bulk body (20), and the pillar-shaped protrusions (32) include the junction (15).
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: April 20, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Ji-bin Yang, Koichi Kita, Toshihiko Saiwai, Koji Hoshino, Jun Katoh
  • Publication number: 20210090971
    Abstract: A heat sink including a metal-formed body having a base board part and two or more fin parts standing on a surface of the base board part and arranged in a parallel manner to each other, and one or more filled bodies consisting of a plurality of coiled metal-wire materials filled in one or more groove parts formed between the fin parts of the metal-formed body; the heat sink in which the coiled metal-wire materials have a first outer diameter at one end part and a second outer diameter at the other end part which is different from the first outer diameter; and the coiled metal-wire materials are metallurgically joined at partially to at least one of an inner surface of the groove parts of the metal-formed body and the other coiled metal-wire materials.
    Type: Application
    Filed: January 9, 2019
    Publication date: March 25, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kotaro Watanabe, Toshihiko Saiwai
  • Publication number: 20210023623
    Abstract: A material for porous metal body having a coil shape of a wire material wound in a helical shape, made of metal which having good thermal conductivity and can join by sintering; an average wire diameter Dw of the wire material is 0.05 mm to 2.00 mm inclusive, an average coil outer diameter Dc is 0.5 mm to 10.0 mm inclusive, a coil length L of 1 mm to 20 mm inclusive, and a winding number N is 1 to 10; and the plurality of materials for porous metal body are combined and sintered to form a metal porous body having a plurality of pores so that a pore ratio of the metal porous body is facilitated to be controlled.
    Type: Application
    Filed: January 16, 2019
    Publication date: January 28, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventor: Toshihiko Saiwai
  • Publication number: 20200224976
    Abstract: This copper porous body for vaporization members is a copper porous body for vaporization members used as a vaporization member which vaporizes a liquid phase medium that comes into contact with the vaporization member, the copper body is composed of a sintered body of a plurality of copper fibers, and has a stem having a three-dimensional network structure. A porosity is in a range of 65% or more and 95% or less, an opening diameter is in a range of 100 ?m or more and 2,000 ?m or less, and a standardized specific surface area SD=S×R defined as a product of a specific surface area S (m2/g) and a diameter R (m) of the copper fiber is in a range of 0.001 or more and 0.25 or less.
    Type: Application
    Filed: October 3, 2018
    Publication date: July 16, 2020
    Inventors: Toshihiko Saiwai, Jun Kato
  • Publication number: 20200149829
    Abstract: The purpose of the present invention is to improve the heat exchange performance of a heatsink. The heatsink includes: a substrate portion; a plurality of plate-like fin portions which rise integrally from a surface of the substrate portion and are arranged mutually in parallel, forming groove portions therebetween; and a porous body portion comprising at least one porous body with which the groove portions between the fin portions are filled and which has a three-dimensional mesh structure. The substrate portion and the fin portions comprise a solid non-porous material of aluminum. The porous body portion comprises a sintered body of aluminum fiber. The porous body portion is joined to the fin portions and the substrate portion via a sintered joint portion.
    Type: Application
    Filed: August 1, 2018
    Publication date: May 14, 2020
    Inventors: Kotaro Watanabe, Toshihiko Saiwai
  • Patent number: 10598446
    Abstract: A porous aluminum heat exchanger including: a porous aluminum body in which aluminum substrates are sintered each other; and a bulk body, which is an aluminum bulk body made of aluminum or aluminum alloy is provided. Pillar-shaped protrusions projecting toward an outside are formed on outer surfaces of the aluminum substrates, and pores of the porous aluminum body are configured to form flow channels of a heat medium.
    Type: Grant
    Filed: July 2, 2015
    Date of Patent: March 24, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Toshihiko Saiwai, Koichi Kita, Ji-bin Yang, Koji Hoshino
  • Patent number: 10543531
    Abstract: A porous aluminum sintered material is provided. The porous aluminum sintered material includes aluminum substrates sintered each other, wherein pillar-shaped protrusions projecting toward an outside are formed on outer surfaces of the aluminum substrates, the porous aluminum sintered material has junctions in which the aluminum substrates are bonded each other through the pillar-shaped protrusions, the junctions include a Ti—Al compound, and a eutectic alloy phase including Al and Si is provided on surface layers of the junctions.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: January 28, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Toshihiko Saiwai, Ji-bin Yang, Koichi Kita
  • Patent number: 10532407
    Abstract: A porous copper sintered material (10) includes: a plurality of copper fibers (11) sintered each other, wherein the copper fibers (11) are made of copper or copper alloy, a diameter R of the copper fibers (11) is in a range of 0.02 mm or more and 1.0 mm or less, and a ratio L/R of a length L of the copper fibers to the diameter R is in a range of 4 or more and 2500 or less (11), redox layers (12) formed by redox treatment are provided on surfaces of copper fibers (11, 11), and concavities and convexities are formed by the redox layer (12), and each of redox layers (12, 12) formed on each of the copper fibers (11) is integrally bonded in a junction of the copper fibers (11).
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: January 14, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koichi Kita, Koji Hoshino, Toshihiko Saiwai, Jun Katoh
  • Publication number: 20190381568
    Abstract: This porous copper body includes: a skeleton which is formed of a sintered body of a plurality of copper fibers and has a three-dimensional network structure, wherein the copper fibers forming the skeleton consist of copper or a copper alloy, and the copper fibers have a diameter R in a range of 0.01 mm to 1.0 mm, a ratio L/R of a length L to the diameter R in a range of 4 to 200, and a circularity of a cross section orthogonal to a length direction in a range of 0.2 to 0.9, and the porous copper body has a porosity of 50% to 95%.
    Type: Application
    Filed: January 18, 2018
    Publication date: December 19, 2019
    Inventors: Jun Kato, Koichi Kita, Toshihiko Saiwai
  • Patent number: 10493528
    Abstract: A porous copper body including a skeleton having a three-dimensional network structure is provided. An oxidation-reduction layer formed by an oxidation-reduction treatment is provided on a surface of the skeleton, and the oxygen concentration of the entirety of the skeleton is set to be 0.025 mass % or less.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: December 3, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koichi Kita, Jun Kato, Toshihiko Saiwai
  • Patent number: 10478895
    Abstract: A high-quality porous aluminum sintered compact, which can be produced efficiently at a low cost; has an excellent dimensional accuracy with a low shrinkage ratio during sintering; and has sufficient strength, and a method of producing the porous aluminum sintered compact are provided. The porous aluminum sintered compact is the porous aluminum sintered compact that includes aluminum substrates sintered each other. The junction, in which the aluminum substrates are bonded each other, includes the Ti—Al compound and the eutectic element compound capable of eutectic reaction with Al. It is preferable that the pillar-shaped protrusions projecting toward the outside are formed on outer surfaces of the aluminum substrates, and the pillar-shaped protrusions include the junction.
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: November 19, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Ji-Bin Yang, Koichi Kita, Toshihiko Saiwai, Koji Hoshino, Jun Katoh
  • Patent number: 10478896
    Abstract: A porous copper body including a skeleton having a three-dimensional network structure is provided. An oxidation-reduction layer formed by an oxidation-reduction treatment is provided on a surface of the skeleton, and the average crystal grain size of an entirety including the skeleton and the oxidation-reduction layer is 5% or more of the diameter of the skeleton.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: November 19, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koichi Kita, Jun Kato, Toshihiko Saiwai
  • Publication number: 20190076927
    Abstract: The porous copper body of the disclosure includes a skeleton having a three-dimensional network structure, in which a porosity is in a range of 50% to 90% and a porosity-normalized electrical conductivity ?N which is defined by dividing a electrical conductivity of the porous copper body, measured by a 4-terminal sensing, by an apparent density ratio of the porous copper body is 20% IACS or higher.
    Type: Application
    Filed: April 7, 2017
    Publication date: March 14, 2019
    Inventors: Jun Kato, Koichi Kita, Toshihiko Saiwai
  • Publication number: 20180297118
    Abstract: A porous copper body including a skeleton having a three-dimensional network structure is provided. A porous layer having unevenness is formed on a surface of the skeleton, the specific surface area is set to be 0.01 m2/g or greater, and the porosity is set to be in a range of 50% to 90%.
    Type: Application
    Filed: May 24, 2016
    Publication date: October 18, 2018
    Inventors: Koichi Kita, Jun Kato, Toshihiko Saiwai
  • Patent number: D940769
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: January 11, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Toshihiko Saiwai, Fumio Sakamoto