Patents by Inventor Toshihiro Hosoi
Toshihiro Hosoi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11950376Abstract: There is provided a copper-clad laminate in which transmission characteristics exhibited by a resin layer can be further improved while sufficient peel strength between a copper foil and the resin layer is ensured. The laminate includes a copper foil; an adhesive layer including a polyphenylene ether resin, a polyimide resin, an olefin-based resin, a liquid crystal polymer, a polyester resin, a polystyrene resin, a hydrocarbon elastomer, a benzoxazine resin, an active ester resin, a cyanate ester resin, a bismaleimide resin, a butadiene resin, a hydrogenated or non-hydrogenated styrene butadiene resin, an epoxy resin, a fluororesin, a vinyl-group-containing resin, or the like; and a resin layer. The maximum height Sz at a copper foil surface on the adhesive layer side is 6.8 ?m or less. The dielectric loss tangent value of the adhesive layer at 1 GHz, ?a, is equal to or less than that of the resin layer, ?r.Type: GrantFiled: March 7, 2019Date of Patent: April 2, 2024Assignee: MITSUI MINING & SMELTING CO., LTD.Inventors: Toshihiro Hosoi, Toshifumi Matsushima
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Patent number: 11890853Abstract: There is provided a resin laminate including a first layer composed of a first resin composition and a second layer composed of a second resin composition. The first resin composition includes a resin component including an epoxy resin, a diamine compound, and a polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 60 to 85 parts by weight based on 100 parts of the first resin composition, and the content of the polyimide resin is 20 to 60 parts by weight based on 100 parts of the resin component. The second resin composition includes a resin component including an epoxy resin and a diamine compound but is free of polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 70 to 90 parts by weight based on 100 parts of the second resin composition.Type: GrantFiled: January 19, 2021Date of Patent: February 6, 2024Assignee: MITSUI MINING & SMELTING CO., LTD.Inventors: Yoshihiro Yoneda, Toshihiro Hosoi, Tetsuro Sato
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Publication number: 20230365784Abstract: A resin composition is provided including: coated particles, each including a core containing a metal oxide and a coating layer containing an aluminum hydrous oxide and provided on a surface of the core; and a resin. The metal oxide is represented by MxOy, where M represents at least one element selected from the group consisting of Ba, Ti, Sr, Pb, Zr, La, Ta, Ca, and Bi, and x and y each represent a number determined from a stoichiometric ratio according to the valence of the metal element M. The resin composition has an atomic ratio Al/(M+Al) of 0.05 or more and 0.7 or less, as determined by XPS for the particles contained in the resin composition.Type: ApplicationFiled: September 14, 2021Publication date: November 16, 2023Inventors: Toshihiro HOSOI, Yoshihiro YONEDA, Tetsuro SATO, Hitohiko IDE, Hiromi MATSUURA, Kouichi KAWARATANI
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Publication number: 20230238181Abstract: A double-sided copper-clad laminate that includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 ?m or more and 3.3 ?m or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.Type: ApplicationFiled: April 4, 2023Publication date: July 27, 2023Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Ryuji ISHIZUKA, Yoshihiro YONEDA, Toshihiro HOSOI, Yuji KAGEYAMA
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Patent number: 11670455Abstract: There is provided a double-sided copper-clad laminate for forming a capacitor that can exhibit excellent properties in voltage endurance and peel strength, while ensuring high capacitor capacity, when used as a capacitor. This double-sided copper-clad laminate includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 ?m or more and 3.3 ?m or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.Type: GrantFiled: June 4, 2021Date of Patent: June 6, 2023Assignee: MITSUI MINING & SMELTING CO., LTD.Inventors: Ryuji Ishizuka, Yoshihiro Yoneda, Toshihiro Hosoi, Yuji Kageyama
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Publication number: 20230107922Abstract: There is provided a resin laminate including a first layer composed of a first resin composition and a second layer composed of a second resin composition. The first resin composition includes a resin component including an epoxy resin, a diamine compound, and a polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 60 to 85 parts by weight based on 100 parts of the first resin composition, and the content of the polyimide resin is 20 to 60 parts by weight based on 100 parts of the resin component. The second resin composition includes a resin component including an epoxy resin and a diamine compound but is free of polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 70 to 90 parts by weight based on 100 parts of the second resin composition.Type: ApplicationFiled: January 19, 2021Publication date: April 6, 2023Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Yoshihiro YONEDA, Toshihiro HOSOI, Tetsuro SATO
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Publication number: 20220351906Abstract: There is provided a double-sided copper-clad laminate for forming a capacitor that can exhibit excellent properties in voltage endurance and peel strength, while ensuring high capacitor capacity, when used as a capacitor. This double-sided copper-clad laminate includes an adhesive layer and a copper foil in order on each of both surfaces of a resin film, the resin film is in a cured state at 25° C., and each of the copper foils has a maximum peak height Sp of 0.05 ?m or more and 3.3 ?m or less as measured in accordance with ISO 25178 on a surface on a side being in contact with the adhesive layer.Type: ApplicationFiled: June 4, 2021Publication date: November 3, 2022Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Ryuji ISHIZUKA, Yoshihiro YONEDA, Toshihiro HOSOI, Yuji KAGEYAMA
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Publication number: 20220162418Abstract: There is provided a resin composition that can greatly improve voltage endurance while ensuring high capacitance and excellent circuit adhesion, when used as the dielectric layer of a capacitor. This resin composition includes a binder component including bisphenol S, an epoxy resin curing agent having a phenolic hydroxyl group, and an epoxy resin; and a dielectric filler.Type: ApplicationFiled: February 7, 2020Publication date: May 26, 2022Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Toshihiro HOSOI, Kenshiro FUKUDA, Yoshihiro YONEDA, Tomohiro ISHINO, Tetsuro SATO
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Patent number: 11310910Abstract: A resin composition for use in a dielectric layer of a capacitor device or a capacitor-embedded printed circuit board is provided in which the resin composition can improve stability in capacitance and insulation properties of the capacitor device under high temperature and high humidity and ensures high adhesion of the dielectric layer to the device. The resin composition comprises a resin component and a dielectric filler. The resin component comprises an epoxy resin, an active ester resin, and an aromatic polyamide resin.Type: GrantFiled: March 9, 2018Date of Patent: April 19, 2022Assignee: MITSUI MINING & SMELTING CO., LTD.Inventors: Yoshihiro Yoneda, Toshifumi Matsushima, Toshihiro Hosoi, Kenshiro Fukuda
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Patent number: 11166383Abstract: There is provided a resin-coated copper foil including a resin layer having excellent dielectric characteristics suitable for high frequency applications, exhibiting high interlayer adhesion and heat resistance in the case where the resin layer is used in a copper-clad laminate or printed circuit board. The resin-coated copper foil of the present invention includes a copper foil and a resin layer on at least one side of the copper foil. The resin layer comprises a resin mixture containing an epoxy resin, a polyimide resin, and an aromatic polyamide resin; and an imidazole curing catalyst.Type: GrantFiled: July 8, 2016Date of Patent: November 2, 2021Assignee: MITSUI MINING & SMELTING CO., LTD.Inventors: Yoshihiro Yoneda, Toshifumi Matsushima, Toshihiro Hosoi, Fujio Kuwako
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Publication number: 20210029823Abstract: There is provided a copper-clad laminate in which transmission characteristics exhibited by a resin layer can be further improved while sufficient peel strength between a copper foil and the resin layer is ensured. The laminate includes a copper foil; an adhesive layer including a polyphenylene ether resin, a polyimide resin, an olefin-based resin, a liquid crystal polymer, a polyester resin, a polystyrene resin, a hydrocarbon elastomer, a benzoxazine resin, an active ester resin, a cyanate ester resin, a bismaleimide resin, a butadiene resin, a hydrogenated or non-hydrogenated styrene butadiene resin, an epoxy resin, a fluororesin, a vinyl-group-containing resin, or the like; and a resin layer. The maximum height Sz at a copper foil surface on the adhesive layer side is 6.8 ?m or less. The dielectric loss tangent value of the adhesive layer at 1 GHz, ?a, is equal to or less than that of the resin layer, ?r.Type: ApplicationFiled: March 7, 2019Publication date: January 28, 2021Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Toshihiro HOSOI, Toshifumi MATSUSHIMA
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Publication number: 20200362169Abstract: A resin composition for use in a dielectric layer of a capacitor is provided that can control a decrease in capacitance or dielectric constant at high temperature and ensure high dielectric characteristics and high adhesion of the composition to a circuit. The resin composition contains a resin component containing an epoxy resin, a diamine compound, and a polyimide resin; and a dielectric filler composed of a metal oxide containing at least two elements selected from the group consisting of Ba, Ti, Sr, Pb, Zr, La, Ta, and Bi. The content of the dielectric filler is 60 to 85 parts by weight on the basis of 100 parts by weight of solid content in the resin composition.Type: ApplicationFiled: January 18, 2019Publication date: November 19, 2020Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Yoshihiro YONEDA, Toshihiro HOSOI, Kenshiro FUKUDA, Toshifumi MATSUSHIMA
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Publication number: 20200008298Abstract: A resin composition for use in a dielectric layer of a capacitor device or a capacitor-embedded printed circuit board is provided in which the resin composition can improve stability in capacitance and insulation properties of the capacitor device under high temperature and high humidity and ensures high adhesion of the dielectric layer to the device. The resin composition comprises a resin component and a dielectric filler. The resin component comprises an epoxy resin, an active ester resin, and an aromatic polyamide resin.Type: ApplicationFiled: March 9, 2018Publication date: January 2, 2020Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Yoshihiro YONEDA, Toshifumi MATSUSHIMA, Toshihiro HOSOI, Kenshiro FUKUDA
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Patent number: 10524360Abstract: A material for forming of the capacitor layer which generates no crack in drilling on the dielectric layer of the capacitor in manufacturing of a highly multilayered printed wiring board embedded a capacitor circuit. Copper clad laminate for forming of an embedded capacitor layer of a multilayered printed wiring board including an embedded capacitor circuit having a layer structure of copper layer/dielectric layer of the capacitor/copper layer in an inner layer characterized in that the composite elastic modulus Er of the resin film constituting the dielectric layer of the capacitor along the thickness direction is less than 6.1 GPa is employed.Type: GrantFiled: February 8, 2018Date of Patent: December 31, 2019Assignee: MITSUI MINING & SMELTING CO., LTD.Inventors: Fujio Kuwako, Toshifumi Matsushima, Toshihiro Hosoi
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Patent number: 10244640Abstract: An object of the present invention is to provide a multilayered printed wiring board provided with split through holes excellent in through-hole formability and co-planarity in inner layer wirings around through holes for providing of a conduction isolation portion. To achieve the object, “a copper clad laminate provided with a protective layer for manufacturing of a printed wiring board having a conduction isolation portion electrically isolating a through hole, the copper clad laminate is characterized in that the copper clad laminate is provided with a protective layer on the surface that can be released after forming of the through holes for providing of a conduction isolation portion and filling of the through holes for providing of a conduction isolation portion by a plating resist” is employed.Type: GrantFiled: February 19, 2015Date of Patent: March 26, 2019Assignee: MITSUI MINING & SMELTING CO., LTD.Inventors: Fujio Kuwako, Toshifumi Matsushima, Toshihiro Hosoi, Ayumu Tateoka
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Patent number: 10134264Abstract: In an emergency report apparatus, diagnostic data is modulated based on a preselected diagnostic modulation method by using a diagnostic carrier wave having a carrier wave frequency that is set within a range of frequencies detectable by a vehicle-mounted voice input instrument and is outside a voice band. A diagnostic electric signal is outputted to a voice output instrument. Demodulated data is generated by demodulating an input voice electric signal being a voice electric signal representing a voice detected by the voice input instrument based on a preselected diagnostic demodulation method. It is determines whether the demodulated data includes data that matches the diagnostic data.Type: GrantFiled: November 23, 2015Date of Patent: November 20, 2018Assignee: DENSO CORPORATIONInventors: Toshihiro Hosoi, Shinichi Yokoi
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Publication number: 20180206345Abstract: There is provided a resin-coated copper foil including a resin layer having excellent dielectric characteristics suitable for high frequency applications, exhibiting high interlayer adhesion and heat resistance in the case where the resin layer is used in a copper-clad laminate or printed circuit board. The resin-coated copper foil of the present invention includes a copper foil and a resin layer on at least one side of the copper foil. The resin layer comprises a resin mixture containing an epoxy resin, a polyimide resin, and an aromatic polyamide resin; and an imidazole curing catalyst.Type: ApplicationFiled: July 8, 2016Publication date: July 19, 2018Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Yoshihiro YONEDA, Toshifumi MATSUSHIMA, Toshihiro HOSOI, Fujio KUWAKO
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Publication number: 20180160536Abstract: A material for forming of the capacitor layer which generates no crack in drilling on the dielectric layer of the capacitor in manufacturing of a highly multilayered printed wiring board embedded a capacitor circuit. Copper clad laminate for forming of an embedded capacitor layer of a multilayered printed wiring board including an embedded capacitor circuit having a layer structure of copper layer/dielectric layer of the capacitor/copper layer in an inner layer characterized in that the composite elastic modulus Er of the resin film constituting the dielectric layer of the capacitor along the thickness direction is less than 6.1 GPa is employed.Type: ApplicationFiled: February 8, 2018Publication date: June 7, 2018Applicant: MITSUI MINING & SMELTING CO., LTD.Inventors: Fujio KUWAKO, Toshifumi MATSUSHIMA, Toshihiro HOSOI
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Publication number: 20180089987Abstract: In an emergency report apparatus, diagnostic data is modulated based on a preselected diagnostic modulation method by using a diagnostic carrier wave having a carrier wave frequency that is set within a range of frequencies detectable by a vehicle-mounted voice input instrument and is outside a voice band. A diagnostic electric signal is outputted to a voice output instrument. Demodulated data is generated by demodulating an input voice electric signal being a voice electric signal representing a voice detected by the voice input instrument based on a preselected diagnostic demodulation method. It is determines whether the demodulated data includes data that matches the diagnostic data.Type: ApplicationFiled: November 23, 2015Publication date: March 29, 2018Applicant: DENSO CORPORATIONInventors: Toshihiro HOSOI, Shinichi YOKOI
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Patent number: 9924597Abstract: A material for forming of the capacitor layer which generates no crack in drilling on the dielectric layer of the capacitor in manufacturing of a highly multilayered printed wiring board embedded a capacitor circuit. Copper clad laminate for forming of an embedded capacitor layer of a multilayered printed wiring board including an embedded capacitor circuit having a layer structure of copper layer/dielectric layer of the capacitor/copper layer in an inner layer characterized in that the composite elastic modulus Er of the resin film constituting the dielectric layer of the capacitor along the thickness direction is less than 6.1 GPa is employed.Type: GrantFiled: February 20, 2015Date of Patent: March 20, 2018Assignee: MITSUI MINING & SMELTING CO., LTD.Inventors: Fujio Kuwako, Toshifumi Matsushima, Toshihiro Hosoi