Patents by Inventor Toshikazu Shinogaya
Toshikazu Shinogaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7226561Abstract: A method of producing a silicon carbide sintered body jig using a reaction sintering method, comprising: (a)dispersing a silicon carbide powder and an organic substance as a carbon source in a solvent, to produce a mixed slurry powder, (b) pouring the resulted slurry powder into a mold and drying this to obtain a green body, (c) temporarily-sintering the resulted green body under a vacuum atmosphere at 1800° C., to obtain a temporarily-sintered body, (d) temporarily-molding said temporarily-sintered body, to obtain a temporarily-molded body, (e) impregnating a melted metal silicon into the resulted temporarily-molded body by a capillary phenomenon and reacting free carbon in said temporarily-molded body with silicon sucked into said temporarily-molded body by a capillary phenomenon, to obtain a silicon carbide sintered body, and (f) subjecting the resulted silicon carbide sintered body to precise processing, to obtain a silicon carbide sintered body jig.Type: GrantFiled: March 7, 2003Date of Patent: June 5, 2007Assignee: Bridgestone CorporationInventors: Tsuyoshi Motoyama, Jin-ichi Taguchi, Fumio Odaka, Toshikazu Shinogaya
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Publication number: 20070117722Abstract: A method of producing a silicon carbide sintered body for heaters, which contains 500 ppm or more of nitrogen, including obtaining slurry-like mixed powder obtained by dispersing silicon carbide powder in a solvent; obtaining a green body by pouring the mixed powder in a shaping die followed by drying; first heating step of heating the green body under a vacuum atmosphere up to a temperature in the range of 550 to 650° C.; and second heating step of, after further heating to a temperature equal to or higher than 1500° C. under a nitrogen gas atmosphere, holding at the temperature under the nitrogen gas atmosphere to obtain a silicon carbide sintered body. And a silicon carbide sintered body for heaters, which has a nitrogen content of 500 ppm or more and the porosity of 32% by volume or less.Type: ApplicationFiled: December 24, 2004Publication date: May 24, 2007Inventors: Fumio Odaka, Toshikazu Shinogaya, Mari Miyano
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Publication number: 20050116394Abstract: A method of producing a silicon carbide sintered body jig using a reaction sintering method, comprising: (a)dispersing a silicon carbide powder and an organic substance as a carbon source in a solvent, to produce a mixed slurry powder, (b) pouring the resulted slurry powder into a mold and drying this to obtain a green body, (c) temporarily-sintering the resulted green body under a vacuum atmosphere at 1800° C., to obtain a temporarily-sintered body, (d) temporarily-molding said temporarily-sintered body, to obtain a temporarily-molded body, (e) impregnating a melted metal silicon into the resulted temporarily-molded body by a capillary phenomenon and reacting free carbon in said temporarily-molded body with silicon sucked into said temporarily-molded body by a capillary phenomenon, to obtain a silicon carbide sintered body, and (f) subjecting the resulted silicon carbide sintered body to precise processing, to obtain a silicon carbide sintered body jig.Type: ApplicationFiled: March 7, 2003Publication date: June 2, 2005Inventors: Tsuyoshi Motoyama, Jin-ichi Taguchi, Fumio Odaka, Toshikazu Shinogaya
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Patent number: 6821617Abstract: A method of producing a wafer comprising conducting a baking treatment on a sintered silicon carbide cut in the form of wafer. An embodiment in which the temperature for the above-mentioned baking treatment is 1350° C. or more, embodiments in which the temperature for the above-mentioned baking treatment is 1400 to 1550° C. and the pressure for the above-mentioned baking treatment is 10−4 Torr or less, and the like are preferable. A wafer which can be produced by the above-mentioned method of producing a water. Embodiments in which the above-mentioned flexural strength measured by a flexural test method (JIS 1601) is 700 MPa or more, the above-mentioned element composition ratio Si/C in all parts is 0.48/0.52 to 0.52/0.48, and the above-mentioned density is 2.9 g/cm3 or more. A high quality wafer improving thermal shock resistance and generating no crack by thermal shock, and a method which can produce this wafer efficiently are provided.Type: GrantFiled: March 18, 2002Date of Patent: November 23, 2004Assignee: Bridgestone CorporationInventors: Fumio Odaka, Sho Kumagai, Toshikazu Shinogaya
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Publication number: 20030036245Abstract: A method of producing a wafer comprising conducting a baking treatment on a sintered silicon carbide cut in the form of wafer. An embodiment in which the temperature for the above-mentioned baking treatment is 1350° C. or more, embodiments in which the temperature for the above-mentioned baking treatment is 1400 to 1550° C. and the pressure for the above-mentioned baking treatment is 10−4 Torr or less, and the like are preferable. A wafer which can be produced by the above-mentioned method of producing a water. Embodiments in which the above-mentioned flexural strength measured by a flexural test method (JIS 1601) is 700MPa or more, the above-mentioned element composition ratio Si/C in all parts is 0.48/0.52 to 0.52/0.48, and the above-mentioned density is 2.9g/cm3 or more.Type: ApplicationFiled: March 18, 2002Publication date: February 20, 2003Applicant: BRIDGESTONE CORPORATIONInventors: Fumio Odaka, Sho Kumagai, Toshikazu Shinogaya
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Patent number: 5578670Abstract: A magnetic powder for bonded magnets is obtained by subjecting starting magnetic particles to agitation in a high speed air stream whereby individual particles are mechanically impacted with one another by the action of the stream. A magnetic composition comprising the magnetic powder and a resin binder is also described wherein the magnetic powder can be highly packed in the resin binder to ensure good fluidity of the composition. The magnetic composition can be prepared by mixing magnetic particles and a resin binder powder, subjecting the mixture to agitation in a high speed air stream for impactness of the particles and heading the mixture or by subjecting magnetic particles to agitation in a high speed air stream, mixing the agitated particles with a powder of a resin binder and heading the resultant mixture.Type: GrantFiled: May 17, 1995Date of Patent: November 26, 1996Assignee: Bridgestone CorporationInventors: Kazuma Nakazawa, Munehiko Kato, Toshikazu Shinogaya
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Patent number: 4887950Abstract: A waterproof nut which may be used, for example, inside a water storage tank, is constituted by a metallic nut body having the outer periphery coated with a synthetic resin layer which also covers both the front and rear surfaces of the nut body. The resin layer which covers the rear surface of the nut body includes a cap-shaped portion for accommodating the free end of a bolt which is screwed into the nut body in such a manner that the free end projects from the rear surface of the nut body, whereby water is prevented from entering the nut body.Type: GrantFiled: April 29, 1988Date of Patent: December 19, 1989Assignee: Bridgestone CorporationInventors: Kiyoshi Sakayori, Shinichi Iwasaki, Yozo Ishida, Toshikazu Shinogaya, Yuzo Ishizuka
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Patent number: 4788022Abstract: A waterproof nut which may be used, for example, inside a water storage tank, is constituted by a metallic nut body having the outer periphery coated with a synthetic resin layer which also covers both the front and rear surfaces of the nut body. The resin layer which covers the rear surface of the nut body includes a cap-shaped portion for accommodating the free end of a bolt which is screwed into the nut body in such a manner that the free end projects from the rear surface of the nut body, whereby water is prevented from entering the nut body.Type: GrantFiled: September 3, 1987Date of Patent: November 29, 1988Assignee: Bridgestone Corp.Inventors: Kiyoshi Sakayori, Shinichi Iwasaki, Yozo Ishida, Toshikazu Shinogaya, Yuzo Ishizuka
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Patent number: 4647495Abstract: An electromagnetic reflection body is disclosed, which comprises a woven fabric made from a blended yarn of metallic filament and organic or inorganic fiber, and a fiber reinforced synthetic resin united therewith in one piece. This reflection body is used for an electromagnetic wave reflector, an electromagnetic interference shielding plate and the like.Type: GrantFiled: August 12, 1985Date of Patent: March 3, 1987Assignee: Bridgestone CorporationInventors: Tatsuya Kanayama, Yutaka Yamanaka, Hitoshi Toyoda, Akihiko Tanaka, Toshikazu Shinogaya
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Patent number: 4607065Abstract: A sealant composition for the puncture-sealing tire and a method of producing the same are disclosed. This sealant composition is crosslinking-reaction type and comprises (A) at least one rubber, (B) a tackifier, (C) an acryloyl or methacryloyl group-containing polymerizable unsaturated compound, (D) a filler and (E) a photopolymerization initiator. In the production of the sealant composition, the component (A) is first reacted with the component (C) and then kneaded with the components (B), (D) and (E).Type: GrantFiled: May 15, 1985Date of Patent: August 19, 1986Assignee: Bridgestone Tire Company LimitedInventors: Takashi Kitamura, Yukio Fukuura, Itsuo Tanuma, Toshikazu Shinogaya, Yuji Noda
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Patent number: 4548687Abstract: A sealant composition for the puncture-sealing tire and a method of producing the same are disclosed. This sealant composition is crosslinking-reaction type and comprises (A) at least one rubber, (B) a tackifier, (C) an acryloyl or methacryloyl group-containing polymerizable unsaturated compound, (D) a filler and (E) a photopolymerization initiator. In the production of the sealant composition, the component (A) is first reacted with the component (C) and then kneaded with the components (B), (D) and (E).Type: GrantFiled: April 29, 1983Date of Patent: October 22, 1985Assignee: Bridgestone Tire Company LimitedInventors: Takashi Kitamura, Yukio Fukuura, Itsuo Tanuma, Toshikazu Shinogaya, Yuji Noda