Patents by Inventor Toshikazu Takayama

Toshikazu Takayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10394122
    Abstract: A resist composition which generates an acid upon exposure and changes a solubility in a developing solution under an action of the acid, the resist composition containing a base material component whose solubility in the developing solution changes under the action of an acid and an acid generator represented by general formula (b1). In general formula (b-1), Rb1 represents an aromatic hydrocarbon group having at least one alkyl group having 3 or more carbon atoms as a substituent, Yb1 represents a divalent linking group containing an ester bond (—C(?O)—O— or —O—C(?O)—), Vb1 represents an alkylene group, a fluorinated alkylene group, or a single bond, m is an integer of 1 or more, and Mm+ represents an m-valent organic cation.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: August 27, 2019
    Assignee: TOYKO OHKA KOGYO CO., LTD.
    Inventors: Issei Suzuki, Masahito Yahagi, Yuki Fukumura, Kazuaki Ebisawa, Yoshitaka Komuro, Toshikazu Takayama, Takashi Kamizono, Tatsuya Fujii
  • Patent number: 10241406
    Abstract: A resist composition containing a resin component having a structural unit represented by general formula (a0-1), and a compound represented by general formula (b1). In general formula (a0-1), R is a hydrogen atom, an alkyl group, or a halogenated alkyl group. Va1 is a divalent hydrocarbon group. na1 represents an integer of 0 to 2. Ra?12 and Ra?13 are a monovalent chain saturated hydrocarbon group having 1 to 10 carbon atoms or a hydrogen atom. Ra?14 is a phenyl group, a naphthyl group, or an anthryl group. In general formula (b1), Rb1 represents a cyclic hydrocarbon group. Yb1 represents a divalent linking group containing an ester bond. Vb1 represents an alkylene group, a fluorinated alkylene group, or a single bond. m is an integer of 1 or more, and Mm+ is an m-valent organic cation.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: March 26, 2019
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Masahito Yahagi, Issei Suzuki, Yuki Fukumura, Toshikazu Takayama, Takashi Kamizono, Tatsuya Fujii
  • Publication number: 20170371241
    Abstract: A resist composition containing a resin component having a structural unit represented by general formula (a0-1), and a compound represented by general formula (b1). In general formula (a0-1), R is a hydrogen atom, an alkyl group, or a halogenated alkyl group. Va1 is a divalent hydrocarbon group. na1 represents an integer of 0 to 2. Ra?12 and Ra?13 are a monovalent chain saturated hydrocarbon group having 1 to 10 carbon atoms or a hydrogen atom. Ra?14 is a phenyl group, a naphthyl group, or an anthryl group. In general formula (b1), Rb1 represents a cyclic hydrocarbon group. Yb1 represents a divalent linking group containing an ester bond. Vb1 represents an alkylene group, a fluorinated alkylene group, or a single bond. m is an integer of 1 or more, and Mm+ is an m-valent organic cation.
    Type: Application
    Filed: June 21, 2017
    Publication date: December 28, 2017
    Inventors: Masahito YAHAGI, Issei SUZUKI, Yuki FUKUMURA, Toshikazu TAKAYAMA, Takashi KAMIZONO, Tatsuya FUJII
  • Publication number: 20170369698
    Abstract: A resist composition which generates an acid upon exposure and changes a solubility in a developing solution under an action of the acid, the resist composition containing a base material component whose solubility in the developing solution changes under the action of an acid and an acid generator represented by general formula (b1). In general formula (b-1), Rb1 represents an aromatic hydrocarbon group having at least one alkyl group having 3 or more carbon atoms as a substituent, Yb1 represents a divalent linking group containing an ester bond (—C(?O)—O— or —O—C(?O)—), Vb1 represents an alkylene group, a fluorinated alkylene group, or a single bond, m is an integer of 1 or more, and Mm+ represents an m-valent organic cation.
    Type: Application
    Filed: June 23, 2017
    Publication date: December 28, 2017
    Inventors: Issei SUZUKI, Masahito YAHAGI, Yuki FUKUMURA, Kazuaki EBISAWA, Yoshitaka KOMURO, Toshikazu TAKAYAMA, Takashi KAMIZONO, Tatsuya FUJII
  • Publication number: 20170369697
    Abstract: A resist composition containing a resin component having a structural unit represented by general formula (a0-1), and a compound represented by general formula (b1). In general formula (a0-1), R is a hydrogen atom, an alkyl group, or a halogenated alkyl group, Va1 is a divalent hydrocarbon group, na1 represents an integer of 0 to 2, Ya0 is a carbon atom, Xa0 is a group forming a monocyclic aliphatic hydrocarbon group together with Ya0, and Ra00 is an aromatic hydrocarbon group or a specific unsaturated hydrocarbon group. In general formula (b1), Rb1 represents a cyclic hydrocarbon group, Yb1 represents a divalent linking group containing an ester bond, Vb1 represents an alkylene group, a fluorinated alkylene group, or a single bond, and Mm+ is an m-valent organic cation.
    Type: Application
    Filed: June 23, 2017
    Publication date: December 28, 2017
    Inventors: Masahito YAHAGI, Issei SUZUKI, Yuki FUKUMURA, Toshikazu TAKAYAMA, Takashi KAMIZONO, Tatsuya FUJII
  • Patent number: 9149837
    Abstract: A substrate having rod-like molecules on a surface thereof including: a substrate in which a pattern including a convex portion with a flat upper surface is formed on at least a portion thereof; and a plurality of rod-like molecules, which are formed into rod-like shape, are aligned in line in a direction crossing a molecular length direction of each of the rod-like molecules an the upper surface of the convex portion, and have liquid crystalline states, wherein the molecular length LR of the rod-like molecule is 2.0 or less times LN, which is a length of the rod-like molecule in the molecular length direction within the convex portion; and a method for producing a substrate having rod-like molecules on a surface thereof.
    Type: Grant
    Filed: March 6, 2013
    Date of Patent: October 6, 2015
    Assignees: National University Corporation Nara Institute of Science and Technology, Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Masanobu Naito, Yusuke Nakamura, Toshiyuki Ogata, Toshikazu Takayama, Takayuki Hosono
  • Publication number: 20130236947
    Abstract: A substrate having rod-like molecules on a surface thereof including: a substrate in which a pattern including a convex portion with a flat upper surface is formed on at least a portion thereof; and a plurality of rod-like molecules, which are formed into rod-like shape, are aligned in line in a direction crossing a molecular length direction of each of the rod-like molecules an the upper surface of the convex portion, and have liquid crystalline states, wherein the molecular length LR of the rod-like molecule is 2.0 or less times LN, which is a length of the rod-like molecule in the molecular length direction within the convex portion; and a method for producing a substrate having rod-like molecules on a surface thereof.
    Type: Application
    Filed: March 6, 2013
    Publication date: September 12, 2013
    Applicants: Tokyo Ohka Kogyo Co., Ltd., National University Corporation Nara Institute of Science and Technology
    Inventors: Masanobu Naito, Yusuke Nakamura, Toshiyuki Ogata, Toshikazu Takayama, Takayuki Hosono
  • Patent number: 8409781
    Abstract: Disclosed are: a composition for forming a resist protection film, which shows less damage to a resist film, can form a good, rectangular resist pattern, and can be used regardless of the structure of a resin used in a resist composition; and a method for forming a resist pattern by using the composition. Specifically, disclosed are: a composition for forming a resist protection film, which comprises (a) an alkali-soluble polymer and (b) an ether-based solvent; and a method for forming a resist pattern by using the composition.
    Type: Grant
    Filed: September 14, 2007
    Date of Patent: April 2, 2013
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Keita Ishiduka, Toshikazu Takayama
  • Patent number: 8216763
    Abstract: A photosensitive resin composition which has a quenching function and satisfactory long-term stability and which, in particular, can be prevented from suffering sensitivity abnormality caused by change with time during storage (change from given sensitivity); and a method of forming a pattern from the composition. The resist composition contains a base resin comprising, as the main component, a silicon-containing polymer which is a siloxane or silsesquioxane polymer or the like, the composition containing, as a quencher, a specific sulfonium compound in place of a nitrogenous compound.
    Type: Grant
    Filed: October 10, 2006
    Date of Patent: July 10, 2012
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Kazufumi Sato, Yasushi Fujii, Hisanobu Harada, Koji Yonemura, Isamu Takagi, Daisuke Kawana, Tomotaka Yamada, Toshikazu Takayama
  • Patent number: 8198004
    Abstract: A resist composition which is stable relative to solvents used in immersion lithography processes and displays excellent sensitivity and resist pattern profile, and a method of forming a resist pattern that uses such a resist composition are provided. The resist composition is in accordance with predetermined parameters, or is a positive resist composition comprising a resin component (A) which contains an acid dissociable, dissolution inhibiting group and displays increased alkali solubility under the action of acid, an acid generator component (B), and an organic solvent (C), wherein the component (A) contains a structural unit (a1) derived from a (meth)acrylate ester containing an acid dissociable, dissolution inhibiting group, but contains no structural units (a0), including structural units (a0-1) containing an anhydride of a dicarboxylic acid and structural units (a0-2) containing a phenolic hydroxyl group.
    Type: Grant
    Filed: October 15, 2008
    Date of Patent: June 12, 2012
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Taku Hirayama, Hideo Hada, Satoshi Fujimura, Takeshi Iwai, Mitsuru Sato, Ryoichi Takasu, Toshikazu Tachikawa, Jun Iwashita, Keita Ishiduka, Tomotaka Yamada, Toshikazu Takayama, Masaaki Yoshida
  • Patent number: 8097397
    Abstract: Disclosed are: a material for forming a protective film to be laminated on a photoresist film, which can prevent the contamination of an exposing device with an outgas generated from the photoresist film, which has little influence on the environment, which has a high water repellent property, which sparingly causes mixing with the photoresist film, and which can form a high-resolution photoresist pattern; a method for forming a photoresist pattern; and a solution for washing/removing a protective film. Specifically disclosed are: a material for forming a protective film, which comprises (a) a non-polar polymer and (b) a non-polar solvent; a method for forming a photoresist pattern by using the material; and a solution for washing/removing a protective film, which is intended to be used in the method.
    Type: Grant
    Filed: September 13, 2007
    Date of Patent: January 17, 2012
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Toshikazu Takayama, Keita Ishiduka, Hideo Hada, Shigeru Yokoi
  • Publication number: 20100086879
    Abstract: Disclosed are: a material for forming a protective film to be laminated on a photoresist film, which can prevent the contamination of an exposing device with an outgas generated from the photoresist film, which has little influence on the environment, which has a high water repellent property, which sparingly causes mixing with the photoresist film, and which can form a high-resolution photoresist pattern; a method for forming a photoresist pattern; and a solution for washing/removing a protective film. Specifically disclosed are: a material for forming a protective film, which comprises (a) a non-polar polymer and (b) a non-polar solvent; a method for forming a photoresist pattern by using the material; and a solution for washing/removing a protective film, which is intended to be used in the method.
    Type: Application
    Filed: September 13, 2007
    Publication date: April 8, 2010
    Inventors: Toshikazu Takayama, Keita Ishiduka, Hideo Hada, Shigeru Yokoi
  • Publication number: 20100040973
    Abstract: Disclosed are: a composition for forming a resist protection film, which shows less damage to a resist film, can form a good, rectangular resist pattern, and can be used regardless of the structure of a resin used in a resist composition; and a method for forming a resist pattern by using the composition. Specifically, disclosed are: a composition for forming a resist protection film, which comprises (a) an alkali-soluble polymer and (b) an ether-based solvent; and a method for forming a resist pattern by using the composition.
    Type: Application
    Filed: September 14, 2007
    Publication date: February 18, 2010
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Keita Ishiduka, Toshikazu Takayama
  • Publication number: 20090220889
    Abstract: A photosensitive resin composition which has a quenching function and satisfactory long-term stability and which, in particular, can be prevented from suffering sensitivity abnormality caused by change with time during storage (change from given sensitivity); and a method of forming a pattern from the composition. The resist composition contains a base resin comprising, as the main component, a silicon-containing polymer which is a siloxane or silsesquioxane polymer or the like, the composition containing, as a quencher, a specific sulfonium compound in place of a nitrogenous compound.
    Type: Application
    Filed: October 10, 2006
    Publication date: September 3, 2009
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Kazufumi Sato, Yasushi Fujii, Hisanobu Harada, Koji Yonemura, Isamu Takagi, Daisuke Kawana, Tomotaka Yamada, Toshikazu Takayama
  • Patent number: 7541138
    Abstract: A resist composition which is stable relative to solvents used in immersion lithography processes and displays excellent sensitivity and resist pattern profile, and a method of forming a resist pattern that uses such a resist composition are provided. The resist composition is in accordance with predetermined parameters, or is a positive resist composition comprising a resin component (A) which contains an acid dissociable, dissolution inhibiting group and displays increased alkali solubility under the action of acid, an acid generator component (B), and an organic solvent (C), wherein the component (A) contains a structural unit (a1) derived from a (meth)acrylate ester containing an acid dissociable, dissolution inhibiting group, but contains no structural units (a0), including structural units (a0-1) containing an anhydride of a dicarboxylic acid and structural units (a0-2) containing a phenolic hydroxyl group.
    Type: Grant
    Filed: January 10, 2007
    Date of Patent: June 2, 2009
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Taku Hirayama, Hideo Hada, Satoshi Fujimura, Takeshi Iwai, Mitsuru Sato, Ryoichi Takasu, Toshikazu Tachikawa, Jun Iwashita, Keita Ishiduka, Tomotaka Yamada, Toshikazu Takayama, Masaaki Yoshida
  • Publication number: 20090130605
    Abstract: A resist composition which is stable relative to solvents used in immersion lithography processes and displays excellent sensitivity and resist pattern profile, and a method of forming a resist pattern that uses such a resist composition are provided. The resist composition is in accordance with predetermined parameters, or is a positive resist composition comprising a resin component (A) which contains an acid dissociable, dissolution inhibiting group and displays increased alkali solubility under the action of acid, an acid generator component (B), and an organic solvent (C), wherein the component (A) contains a structural unit (a1) derived from a (meth)acrylate ester containing an acid dissociable, dissolution inhibiting group, but contains no structural units (a0), including structural units (a0-1) containing an anhydride of a dicarboxylic acid and structural units (a0-2) containing a phenolic hydroxyl group.
    Type: Application
    Filed: October 15, 2008
    Publication date: May 21, 2009
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Taku Hirayama, Hideo Hada, Satoshi Fujimura, Takeshi Iwai, Mitsuru Sato, Ryoichi Takasu, Toshikazu Tachikawa, Jun Iwashita, Keita Ishiduka, Tomotaka Yamada, Toshikazu Takayama, Masaaki Yoshida
  • Patent number: 7527909
    Abstract: A resist composition which is stable relative to solvents used in immersion lithography processes and displays excellent sensitivity and resist pattern profile, and a method of forming a resist pattern that uses such a resist composition are provided. The resist composition is in accordance with predetermined parameters, or is a positive resist composition comprising a resin component (A) which contains an acid dissociable, dissolution inhibiting group and displays increased alkali solubility under the action of acid, an acid generator component (B), and an organic solvent (C), wherein the component (A) contains a structural unit (a1) derived from a (meth)acrylate ester containing an acid dissociable, dissolution inhibiting group, but contains no structural units (a0), including structural units (a0-1) containing an anhydride of a dicarboxylic acid and structural units (a0-2) containing a phenolic hydroxyl group.
    Type: Grant
    Filed: January 10, 2007
    Date of Patent: May 5, 2009
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Taku Hirayama, Hideo Hada, Satoshi Fujimura, Takeshi Iwai, Mitsuru Sato, Ryoichi Takasu, Toshikazu Tachikawa, Jun Iwashita, Keita Ishiduka, Tomotaka Yamada, Toshikazu Takayama, Masaaki Yoshida
  • Patent number: 7501220
    Abstract: A resist composition which is stable relative to solvents used in immersion lithography processes and displays excellent sensitivity and resist pattern profile, and a method of forming a resist pattern that uses such a resist composition are provided. The resist composition is in accordance with predetermined parameters, or is a positive resist composition comprising a resin component (A) which contains an acid dissociable, dissolution inhibiting group and displays increased alkali solubility under the action of acid, an acid generator component (B), and an organic solvent (C), wherein the component (A) contains a structural unit (a1) derived from a (meth)acrylate ester containing an acid dissociable, dissolution inhibiting group, but contains no structural units (a0), including structural units (a0-1) containing an anhydride of a dicarboxylic acid and structural units (a0-2) containing a phenolic hydroxyl group.
    Type: Grant
    Filed: May 13, 2004
    Date of Patent: March 10, 2009
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Taku Hirayama, Hideo Hada, Satoshi Fujimura, Takeshi Iwai, Mitsuru Sato, Ryoichi Takasu, Toshikazu Tachikawa, Jun Iwashita, Keita Ishiduka, Tomotaka Yamada, Toshikazu Takayama, Masaaki Yoshida
  • Publication number: 20070190436
    Abstract: A resist composition which is stable relative to solvents used in immersion lithography processes and displays excellent sensitivity and resist pattern profile, and a method of forming a resist pattern that uses such a resist composition are provided. The resist composition is in accordance with predetermined parameters, or is a positive resist composition comprising a resin component (A) which contains an acid dissociable, dissolution inhibiting group and displays increased alkali solubility under the action of acid, an acid generator component (B), and an organic solvent (C), wherein the component (A) contains a structural unit (a1) derived from a (meth)acrylate ester containing an acid dissociable, dissolution inhibiting group, but contains no structural units (a0), including structural units (a0-1) containing an anhydride of a dicarboxylic acid and structural units (a0-2) containing a phenolic hydroxyl group.
    Type: Application
    Filed: January 10, 2007
    Publication date: August 16, 2007
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Taku Hirayama, Hideo Hada, Satoshi Fujimura, Takeshi Iwai, Mitsuru Sato, Ryoichi Takasu, Toshikazu Tachikawa, Jun Iwashita, Keita Ishiduka, Tomotaka Yamada, Toshikazu Takayama, Masaaki Yoshida
  • Publication number: 20070178394
    Abstract: A resist composition which is stable relative to solvents used in immersion lithography processes and displays excellent sensitivity and resist pattern profile, and a method of forming a resist pattern that uses such a resist composition are provided. The resist composition is in accordance with predetermined parameters, or is a positive resist composition comprising a resin component (A) which contains an acid dissociable, dissolution inhibiting group and displays increased alkali solubility under the action of acid, an acid generator component (B), and an organic solvent (C), wherein the component (A) contains a structural unit (a1) derived from a (meth)acrylate ester containing an acid dissociable, dissolution inhibiting group, but contains no structural units (a0), including structural units (a0-1) containing an anhydride of a dicarboxylic acid and structural units (a0-2) containing a phenolic hydroxyl group.
    Type: Application
    Filed: January 10, 2007
    Publication date: August 2, 2007
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Taku Hirayama, Hideo Hada, Satoshi Fujimura, Takeshi Iwai, Mitsuru Sato, Ryoichi Takasu, Toshikazu Tachikawa, Jun Iwashita, Keita Ishiduka, Tomotaka Yamada, Toshikazu Takayama, Masaaki Yoshida