Abstract: A curable composition contains a polymerizable compound, a photopolymerization initiator, and a solvent. The polymerizable compound contains a silicon compound having polymerizability, the curable composition has a viscosity of not less than 2 mPa·s and not more than 60 mPa·s at 23° C., the curable composition in a state in which the solvent is removed has a viscosity of not less than 30 mPa·s and not more than 10,000 mPa·s at 23° C., and content of the solvent with respect to the whole curable composition is not less than 5 vol % and not more than 95 vol %.

Abstract: A mold including a first part and a second part, wherein the first part includes a first surface and a second surface on an opposite side of the first surface, the second surface includes a concave portion having a concave shape, the first surface includes a convex portion and having a convex shape, the second part includes a third surface combined to the convex portion of the first part, and a fourth surface on the opposite side of the third surface, on which a pattern to be transferred to a transfer target is formed, the first part is made of a material having a first elastic modulus, and the second part is made of a material having a second elastic modulus lower than the first elastic modulus.

Abstract: A curable composition containing a polymerizable compound, a photopolymerization initiator, and a solvent, wherein the curable composition has a viscosity of not less than 1.3 mPa·s and not more than 60 mPa·s at 23° C. and at 1 atm, a content of the solvent with respect to whole of the curable composition is not less than 5 vol % and not more than 95 vol %, a boiling point of the solvent is not less than 135° C. at 1 atm, and defining a surface tension of a composition obtained by removing the solvent from the curable composition at 1 atm as yl [mN/m] and the surface tension of the solvent at 23° C. and at 1 atm as ?2 [mN/m], ?1 is not more than 30, ?2 is not more than 24, and ?1 is larger than ?2.

Abstract: A substrate surface planarization method includes an arranging step of arranging a liquid curable composition onto a substrate surface having unevenness, a waiting step of waiting until the surface of the layer of the liquid curable composition becomes smooth, and a light exposure step of applying light to cure the layer of the liquid curable composition in this order. The arranging step includes a first arranging step of arranging a layer made of a first liquid curable composition (A1) containing at least a polymerizable compound (a1), and a second arranging step of arranging droplets of a second liquid curable composition (A2) containing at least a polymerizable compound (a2) onto the layer made of the first liquid curable composition (A1) by dropping the droplets discretely.

Abstract: A foreign substance inspection method for inspecting for a foreign substance includes bringing a first surface of a first substate into contact with a second surface of a second substrate to cause the first and second surfaces to face each other, obtaining an image of reflected light from the first and second surfaces in contact with each other, and determining, based on the obtained image, the presence of a foreign substance, or the absence of a foreign substance, or the position of a foreign substance.

Abstract: According to an embodiment, an information processing apparatus includes a processing unit configured to: detect whether or not one or more conditions defining timings to perform learning of a regression model configured to predict one or more objective variables for a plurality of explanatory variables are satisfied; determine priorities of the plurality of explanatory variables according to a condition detected to be satisfied; and perform learning of the regression model by using an objective function and learning data, the objective function including a regularization term having a regularization strength changing according to the priorities.

Abstract: A curable composition containing a polymerizable compound (a), a photopolymerization initiator (b), and a solvent (c), wherein the curable composition has viscosity of not less than 2 mPas and not more than 60 mPa·s at 23° C., a content of the solvent (d) with respect to the whole curable composition is not less than 5 vol % and not more than 95 vol %, a boiling point of the solvent (d) at normal pressure is less than 250° C., and the polymerizable compound (a) contains a compound (a-1) containing not less than one aromatic ring or aromatic heterocycle, and not less than four vinyl groups directly bonding to the aromatic ring or the aromatic heterocycle.

Abstract: A robot system includes: a conveying device configured to convey a workpiece; a robot configured to execute an operation on the workpiece; and circuitry configured to: identify a current position of the workpiece and an object area occupied by an object; identify an interlock area that moves with the current position of the workpiece being conveyed by the conveying device; check an overlap between the interlock area and the object area; and control the robot to execute the operation based on the current position of the workpiece in response to determining that the interlock area does not overlap the object area.

Abstract: An object is to provide a photo-curable composition having high dry etching resistance and high thermal stability. A photo-curable composition includes at least a polymerizable compound and a photopolymerization initiator, and further includes at least one of a flame retarder and a flame-retardant polymerizable compound.

Abstract: A substrate surface planarization method includes an arranging step of arranging a liquid curable composition onto a substrate surface having unevenness, a waiting step of waiting until the surface of the layer of the liquid curable composition becomes smooth, and a light exposure step of applying light to cure the layer of the liquid curable composition in this order. The arranging step includes a first arranging step of arranging a layer made of a first liquid curable composition (A1) containing at least a polymerizable compound (a1), and a second arranging step of arranging droplets of a second liquid curable composition (A2) containing at least a polymerizable compound (a2) onto the layer made of the first liquid curable composition (A1) by dropping the droplets discretely.

Abstract: The present invention provides a layer forming composition used to form an adhesion layer that brings a base material and a curable composition into tight contact with each other, comprising a surfactant (D) whose HLB value is 1 to 5.

Abstract: A pattern forming method is provided. A thickness of a residual film sandwiched between a most projecting portion of a pattern of the mold and the substrate is not less than 50 nm, and a height difference of the unevenness of the mold is not more than the thickness of the residual film. The method includes a forming step of forming an inversion layer on unevenness transferred from the mold onto a cured film, a removing step of removing an upper layer portion of the inversion layer such that a top surface of a convex portion of the unevenness formed on the cured film is exposed, and an etching step of, using the inversion layer buried in the concave portion as a mask, etching the cured film up to a surface of the substrate to form an inverted pattern.

Abstract: A film forming method includes an arranging step of arranging a curable composition on a base material, a contact step of bringing the curable composition into contact with a film forming region of a mold after the arranging step, a curing step of curing the curable composition after the contact step, and a separation step of separating the curable composition and the mold after the curing step, wherein in the contact step, a gas that fills a space between the base material and the mold exists, a solubility coefficient of the gas to the curable composition is not less than 0.5 kg/m3·atm and not more than 10 kg/m3·atm, and an average liquid film thickness that is a value obtained by dividing a volume of the curable composition by an area of the film forming region is not less than 70 nm.

Abstract: A pattern forming method includes a contact step of bringing a curable composition containing a polymerizable compound and arranged on a field of a substrate into contact with a mold; a curing step of forming a cured film including a pattern formed by a cured product of the curable composition by irradiating the curable composition arranged on the field with light; and a separation step of separating the cured film and the mold, wherein the field includes a plurality of regions, and in the curing step, for each of the plurality of regions, the curable composition is irradiated with light in accordance with an illuminance and an irradiation time decided based on a target line width of the pattern.

Abstract: Provided is a medical control apparatus including: a processing unit configured to cause one or both of a first display region in which an object relating to an input source of an image is to be displayed and a second display region in which an object relating to an output destination of an image is to be displayed and a third display region in which an object for controlling the input source or the output destination is to be displayed, to be displayed in one screen.

Abstract: The present invention provides a film forming method comprising: discretely arranging, on a substrate with unevenness, a plurality of droplets of a curable composition in a liquid form containing at least a polymerizable compound (a) as a nonvolatile component and at least a solvent (d) as a volatile component; waiting until each of the plurality of droplets discretely arranged on the substrate combines with an adjacent droplet to form a continuous liquid film on the substrate, and the solvent (d) contained in the liquid film volatilizes, and a content of the solvent (d) becomes not more than 10 vol % with respect to the whole liquid film; and curing the curable composition in the liquid form after the waiting.

Abstract: A curable composition containing a polymerizable compound (a), a photopolymerization initiator (b), and a solvent (c), wherein the curable composition has viscosity of not less than 2 mPa·s and not more than 60 mPa·s at 23° C., a content of the solvent (d) with respect to the whole curable composition is not less than 5 vol % and not more than 95 vol %, a boiling point of the solvent (d) at normal pressure is less than 250° C., and the polymerizable compound (a) contains a compound (a-1) containing not less than one aromatic ring or aromatic heterocycle, and not less than four vinyl groups directly bonding to the aromatic ring or the aromatic heterocycle.

Abstract: A three dimensional manufactured product is manufactured A speed of filing an uncured light curing resin in a space for a next layer is enhanced, to improve a manufacturing speed. One surface of a container housing a light curing resin is configured by a gas-permeable sheet that faces the light curing resin, and transmits irradiation light of a light irradiating apparatus, and a light transmitting plate disposed at an outer side of the container from the gas permeable member. A pressurizing chamber controllable in pressure by a pressure controlling apparatus is defined between the gas-permeable sheet and the light transmitting plate. At moving a manufacturing stage, an inside of the pressurizing chamber is de-pressurized to cause the gas-permeable sheet to perform concave surface deformation, and at a time of performing light irradiation, gas in the pressurizing chamber is caused to permeate into the light curing resin by pressurizing.

Abstract: There is provided that a curable composition containing a polymerizable compound, a photopolymerization initiator, and solvent, wherein the polymerizable compound contains at least a compound having one of an aromatic structure, an aromatic heterocyclic structure, and an alicyclic structure, the curable composition has viscosity of not less than 2 mPa·s and not more than 60 mPa·s at 23° C., in a state in which the solvent is removed, the curable composition has a viscosity of not less than 30 mPa·s and not more than 10,000 mPa·s at 23° C., and a content of the solvent with respect to the whole curable composition is not less than 70 vol % and not more than 95 vol %.

Abstract: An object is to provide a photo-curable composition having high dry etching resistance and high thermal stability. A photo-curable composition includes at least a polymerizable compound and a photopolymerization initiator, and further includes at least one of a flame retarder and a flame-retardant polymerizable compound.