Patents by Inventor Toshimasa Takao

Toshimasa Takao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9425235
    Abstract: A light emitting device, having: a first light emitting element and a second light emitting element; and a resin package equipped with an opening having a reflective wall that widens toward the upper face, the opening comprises at least first and second curved parts having different radiuses at the resin package upper face, and the radius of the first curved part disposed near the first light emitting element is greater than the radius of the second curved part disposed near the second light emitting element.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: August 23, 2016
    Assignee: NICHIA CORPORATION
    Inventors: Toshimasa Takao, Takeo Kurimoto
  • Publication number: 20150115294
    Abstract: A light emitting device includes a resin-molded body including: a light emitting window, a white portion, and a black portion, wherein, in a top plan view of the light emitting device, the white portion surrounds the light emitting window, and the black portion surrounds the white portion; an electrode protruding from an outer surface of the resin-molded body; and a plurality of light emitting elements mounted in an area surrounded by the white portion, the plurality of light emitting elements including at least two light emitting elements that are different in type from one another.
    Type: Application
    Filed: July 3, 2014
    Publication date: April 30, 2015
    Applicant: Nichia Corporation
    Inventors: Takayuki IGARASHI, Ryo OISHI, Toshimasa TAKAO, Tetsuya YAGI
  • Publication number: 20140319551
    Abstract: A light emitting device includes a resin-molded body including: a light emitting window, a white portion, and a black portion, wherein, in a top plan view of the light emitting device, the white portion surrounds the light emitting window, and the black portion surrounds the white portion; an electrode protruding from an outer surface of the resin-molded body; and a plurality of light emitting elements mounted in an area surrounded by the white portion, the plurality of light emitting elements including at least two light emitting elements that are different in type from one another.
    Type: Application
    Filed: July 3, 2014
    Publication date: October 30, 2014
    Inventors: Takayuki IGARASHI, Ryo Oishi, Toshimasa Takao, Tetsuya Yagi
  • Publication number: 20140008672
    Abstract: A light emitting device, having: a first light emitting element and a second light emitting element; and a resin package equipped with an opening having a reflective wall that widens toward the upper face, the opening comprises at least first and second curved parts having different radiuses at the resin package upper face, and the radius of the first curved part disposed near the first light emitting element is greater than the radius of the second curved part disposed near the second light emitting element.
    Type: Application
    Filed: July 5, 2013
    Publication date: January 9, 2014
    Inventors: Toshimasa TAKAO, Takeo KURIMOTO
  • Patent number: 7815343
    Abstract: The present invention provides a light emitting device which has high reliability and long service life by suppressing the sealing resin from peeling off the inner edge of the opening of the recess of the housing.
    Type: Grant
    Filed: August 2, 2007
    Date of Patent: October 19, 2010
    Assignee: Nichia Corporation
    Inventors: Ikuya Nii, Hiroaki Ukawa, Nobuhide Kasae, Toshimasa Takao
  • Patent number: 7709854
    Abstract: A light emitting device includes a package having a recess defined by an inner wall and a bottom surface and a lead terminal exposed at the bottom surface of the recess and protruded outward from the package. The lead terminal exposed at the bottom surface of the recess portion including a semiconductor light emitting element mounting region and a wire connecting region for connecting a conductive wire from the semiconductor light emitting element thereto. At least one of regions between the semiconductor light emitting element mounting region and the wire connecting region has a groove portion disposed in a position spaced apart from a peripheral edge portion of the lead terminal that is exposed at the bottom surface of the recess.
    Type: Grant
    Filed: October 4, 2007
    Date of Patent: May 4, 2010
    Assignee: Nichia Corporation
    Inventors: Yoshitaka Bando, Shintaro Nakashima, Toshimasa Takao
  • Publication number: 20080083931
    Abstract: A light emitting device includes a package having a recess defined by an inner wall and a bottom surface and a lead terminal exposed at the bottom surface of the recess and protruded outward from the package. The lead terminal exposed at the bottom surface of the recess portion including a semiconductor light emitting element mounting region and a wire connecting region for connecting a conductive wire from the semiconductor light emitting element thereto. At least one of regions between the semiconductor light emitting element mounting region and the wire connecting region has a groove portion disposed in a position spaced apart from a peripheral edge portion of the lead terminal that is exposed at the bottom surface of the recess.
    Type: Application
    Filed: October 4, 2007
    Publication date: April 10, 2008
    Applicant: NICHIA CORPORATION
    Inventors: Yoshitaka Bando, Shintaro Nakashima, Toshimasa Takao
  • Publication number: 20080037252
    Abstract: The present invention provides a light emitting device which has high reliability and long service life by suppressing the sealing resin from peeling off the inner edge of the opening of the recess of the housing.
    Type: Application
    Filed: August 2, 2007
    Publication date: February 14, 2008
    Applicant: NICHIA CORPORATION, a corporation of Japan
    Inventors: Ikuya Nii, Hiroaki Ukawa, Nobuhide Kasae, Toshimasa Takao
  • Patent number: D647069
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: October 18, 2011
    Assignee: Nichia Corporation
    Inventors: Toshimasa Takao, Tetsuya Yagi
  • Patent number: D661262
    Type: Grant
    Filed: April 26, 2010
    Date of Patent: June 5, 2012
    Assignee: Nichia Corporation
    Inventors: Takayuki Igarashi, Ryo Oishi, Toshimasa Takao, Tetsuya Yagi
  • Patent number: D715233
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: October 14, 2014
    Assignee: Nichia Corporation
    Inventors: Toshimasa Takao, Tetsuya Yagi