Abstract: A method for manufacturing an image display device includes disposing the first substrate, on which conductors and wires connected to the conductors are formed, on a supporting member and covering a part of the first substrate with a container to thereby dispose the conductors within a space formed between the first substrate and the container. Part of the wires is disposed outside of the space. The method also includes the steps of providing the space with a desired atmosphere, applying a voltage to the conductors through the part of the wires disposed outside of the space, and connecting a second substrate including an image arming member via a connecting member to the first substrate, at a region of the first substrate different from a region where the container and the first substrate are connected together.

Abstract: A circuit connection structure including a substrate, a circuit board, a semiconductor, and a flexible wiring member. The substrate has a part of a display panel and an electrode terminal formed thereon. The circuit board is disposed with a space between it and the substrate and has an electrode terminal. The semiconductor device bridges the space between the substrate and the circuit board and has a first electrode and a second electrode and includes a driver IC. The flexible wiring member has a conductor, of which, opposite ends are connected to the second electrode and the electrode terminal of the circuit board, respectively. The driver IC is connected to the substrate by connecting the first electrode to the electrode terminal on the substrate. By connecting the driver IC to the substrate in this manner, it becomes possible to obviate a conventional thermal problem of positional deviation.

Abstract: A method for manufacturing an image display device includes disposing the first substrate, on which conductors and wires connected to the conductors are formed, on a supporting member and covering a part of the first substrate with a container to thereby dispose the conductors within a space formed between the first substrate and the container. Part of the wires is disposed outside of the space. The method also includes the steps of providing the space with a desired atmosphere, applying a voltage to the conductors through the part of the wires disposed outside of the space, and connecting a second substrate including an image forming member via a connecting member to the first substrate, at a region of the first substrate different from a region where the container and the first substrate are connected together.

Abstract: A method of connecting first electrodes formed on a first substrate to second electrodes formed on a second substrate and partially coated with a resist pattern so as to substantially expose an opening thereof at a surface of the second electrodes includes (a) coating the second electrodes with a solder at the opening of the resist pattern, (b) aligning the first electrodes with the second electrodes, and (c) electrically connecting the first electrodes to the second electrodes through the solder by heat-pressing the first and second electrodes with a heat-pressure bonding head including a tip face having a width smaller than a width of the opening of the resist pattern so as to heat-press the first and second electrodes at an entire region of the tip face of the heat-pressure bonding head. The method is effective in performing a good electrical connection between electrodes through a solder irrespective of an amount of the solder.

Abstract: A liquid crystal apparatus is constituted by a liquid crystal device including a pair of substrates at least one of which is provided with first electrodes, and a liquid crystal disposed between the substrates; a plurality of driver devices disposed on said at least one substrate at a periphery thereof and electrically connected to the first electrodes; a driver board for supplying signals to the driver devices, disposed in parallel with the driver devices; second electrodes disposed on said at least one substrate and electrically connected to the driver devices; and a plurality of connection sheets disposed between the driver board and said at least one substrate and each electrically connecting each of the driver devices to the driver board via the second electrodes.

Abstract: An image pickup device provided with an electronic image vibration compensating circuit, comprising an electronic zooming device for electronically varying the magnification of a designated portion of a taken image, a zoom lens constituting a phototaking lens, a zoom position detector for detecting the zoom position of the zoom lens, a driving circuit for zooming the zoom lens, and a control circuit for controlling the zoom lens and the electronic zooming device in mutually correlated manner, so as to maintain the image angle, determined by the zoom lens and the electronic zooming device at a predetermined value.

Abstract: A method of connecting first electrodes formed on a first substrate to second electrodes formed on a second substrate and partially coated with a resist pattern so as to substantially expose an opening thereof at a surface of the second electrodes includes (a) coating the second electrodes with a solder at the opening of the resist pattern, (b) aligning the first electrodes with the second electrodes, and (c) electrically connecting the first electrodes to the second electrodes through the solder by heat-pressing the first and second electrodes with a heat-pressure bonding head including a tip face having a width smaller than a width of the opening of the resist pattern so as to heat-press the first and second electrodes at an entire region of the tip face of the heat-pressure bonding head. The method is effective in performing a good electrical connection between electrodes through a solder irrespective of an amount of the solder.

Abstract: A flat cable is formed by disposing a layer of conductor lines on one side and a conductor layer on the other side, respectively, of an insulating support layer so as to provide a connection part having a laminated structure including the conductor lines, the insulating support layer and the conductor layer in this order. The flat cable is connected with a connector including a housing and contacts disposed to be connected with the conductor lines and the conductor layer on mutually opposite inner surfaces of the housing. The resultant connection structure effectively utilizes both surfaces of the flat cable to be reduced in size and allows a stable connection and a stable potential level of the conductor and conductor lines.

Abstract: A lens control device for an inner focus lens system has a first lens group for zooming; a second lens group for focusing; a first zooming unit for controlling the second lens group for correcting the displacement of the focal plane resulting from the movement of the first lens group; a memory for memorizing the relative position of the second lens group to the first lens group in a zooming operation by the first zooming unit; a calculation unit for calculating the moving speed of the second lens group based on the memorized data, in order to maintain the focused in the course of movement of the first lens group; and a second zooming unit for controlling the second lens group according to the result of calculation.

Abstract: A circuit board connection structure is formed by a first substrate having a first electrode pattern, a second substrate having a second electrode pattern, and a film circuit member electrically connecting the first and second electrode patterns. The film circuit member includes lead electrodes having an exposed portion partly connected to the first electrode pattern at a part of the exposed portion closer to an edge of the film circuit member. The film circuit member may further includes lead electrodes having an exposed portion partly connected to the second electrode pattern at a part of the exposed portion closer to an edge of the film circuit member. The circuit board connection structure may be incorporated in various electronic devices, including a liquid crystal display device.

Abstract: A printed circuit board comprises a plurality of board layers and a plurality of wiring layers both of which are laminated. When a wiring pattern is disposed at one side against the center line, a dummy wiring pattern is formed at the place substantially symmetrical to the position where the wiring pattern is disposed to suppress a warp of the printed circuit board caused by temperature changes and to ease connection work between the printed circuit board and units, such as TABs for driving liquid crystal.

Abstract: An image pickup apparatus is provided with a vibration sensor for detecting vibrations of the apparatus, an optical image-shake correcting device for optically correcting an image shake according to an output of the vibration sensor, an electronic image-shake correcting device for electronically correcting the image shake according to an output of the vibration sensor. The apparatus includes a control circuit arranged to select either the optical image-shake correcting device or the electronic image-shake correcting device according to the focal length of an image-pickup optical system of the apparatus.

Abstract: An electric circuit substrate having a multilayer structure is constituted from at least three wiring layers including an outermost wiring layer, at least one first inner wiring layer disposed under the outermost wiring layer, and a second inner wiring layer disposed under the at least one first inner wiring layer, each provided with a prescribed conductor pattern, respectively. In the multilayer structure, the outermost wiring layer has an alignment mark, the above-mentioned at least one first inner wiring layer has a blank portion free from its conductor pattern in a position immediately under the alignment mark, and the second inner wiring layer has an entire solid portion of its conductor pattern in a position immediately under the blank portion. The above multilayer structure including the alignment mark is effective in preventing recognition error or recognition failure of the alignment mark, thus allowing accurate positioning of the electric circuit substrate.

Abstract: A circuit assembly suitable for constituting, e.g., a liquid crystal display device, is constituted by a transparent first substrate having thereon a plurality of first electrodes, and a second substrate having thereon a plurality of second electrodes and at least partially superposed with the first substrate so that the mutually corresponding first and second electrodes are superposed and electrically connected with each other. The first electrode has a light-transmissive layer and an opaque layer laminated with the light transmissive layer, and a portion of the first electrode superposed with the second substrate at least partially includes a light-transmissive portion. The first or second substrate has an alignment mark at a position thereof corresponding to the light-transmissive portion of the first electrode. The first substrate may for example be combined with another first substrate so as to sandwich a liquid crystal therebetween to form a liquid crystal device.

Abstract: A lens control device for an inner focus lens system has a first lens group for zooming; a second lens group for focusing; a first zooming unit for controlling the second lens group for correcting the displacement of the focal plane resulting from the movement of the first lens group; a memory for memorizing the relative position of the second lens group to the first lens group in a zooming operation by the first zooming unit; a calculation unit for calculating the moving speed of the second lens group based on the memorized data, in order to maintain the focused in the course of movement of the first lens group; and a second zooming unit for controlling the second lens group according to the result of calculation.