Patents by Inventor Toshimitsu MORIYA

Toshimitsu MORIYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210229222
    Abstract: A method for producing solder particles, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; and a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses. With respect to this method for producing solder particles, the average particle diameter of the solder particles is from 1 ?m to 30 ?m; and the C.V. value of the solder particles is 20% or less.
    Type: Application
    Filed: June 26, 2019
    Publication date: July 29, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Kunihiko AKAI, Yoshinori EJIRI, Yuuhei OKADA, Toshimitsu MORIYA, Shinichirou SUKATA, Masayuki MIYAJI
  • Publication number: 20210114145
    Abstract: The present invention relates to solder particles, each of which partially has a flat portion in the surface. By using these solder particles, electrodes facing each other are able to be appropriately connected, thereby achieving an anisotropic conductive material that exhibits excellent conduction reliability and excellent insulation reliability.
    Type: Application
    Filed: June 26, 2019
    Publication date: April 22, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Kunihiko AKAI, Yoshinori EJIRI, Yuuhei OKADA, Toshimitsu MORIYA, Shinichirou SUKATA, Masayuki MIYAJI
  • Publication number: 20210114147
    Abstract: A method for producing an anisotropic conductive film, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses; a transfer step wherein an insulating resin material is brought into contact with the recess opening side of the base material that includes the solder particles in the recesses, thereby obtaining a first resin layer on which the solder particles have been transferred; and a layering step wherein a second resin layer that is configured from an insulating resin material is formed on the surface of the first resin layer, on which the solder particles have been transferred, thereby obtaining an anisotropic conductive film.
    Type: Application
    Filed: June 26, 2019
    Publication date: April 22, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Kunihiko AKAI, Yoshinori EJIRI, Yuuhei OKADA, Toshimitsu MORIYA, Shinichirou SUKATA, Masayuki MIYAJI