Patents by Inventor Toshinobu Ogatsu

Toshinobu Ogatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6906546
    Abstract: Semiconductor device inspection apparatus suitable for inspecting narrow-pitched semiconductor devices and an inspection method. The apparatus has a wafer stage, a base table, an X stage, a Y stage, an elevation unit mounted on the Y stage and elevates the wafer stage up and down, a rotary unit which turns the wafer stage, a vibration elimination table which reduces vibration of the base table, a probe card having plural probe needles which electrically contact plural electrodes when the wafer stage moves upward, and a probe card holder where the probe card is to be placed. The heights of needles of the probe card are detected by a laser displacement meter. Images of a wafer and the needles are sensed by a camera. Based on image information, positions of the wafer and probe card are computed and the X stage, Y stage and elevation unit are controlled.
    Type: Grant
    Filed: October 29, 2003
    Date of Patent: June 14, 2005
    Assignee: NEC Corporation
    Inventors: Michinobu Tanioka, Toshinobu Ogatsu
  • Publication number: 20040100297
    Abstract: Disclosed are a semiconductor device inspection apparatus suitable for inspecting narrow-pitched semiconductor devices and an inspection method which uses the apparatus. The apparatus has a wafer stage, a base table, an X stage, a Y stage, an elevation unit which is mounted on the Y stage and elevates the wafer stage up and down, a rotary unit which turns the wafer stage, a vibration elimination table which reduces vibration of the base table, a probe card having plural probe needles which electrically contact plural electrodes when the wafer stage moves upward, and a probe card holder where the probe card is to be placed. The heights of needles of the probe card are detected by a laser displacement meter. Images of a wafer and the needles are sensed by a camera. Based on image information, positions of the wafer and probe card are computed and the X stage, Y stage and elevation unit are controlled.
    Type: Application
    Filed: October 29, 2003
    Publication date: May 27, 2004
    Applicant: NEC CORPORATION
    Inventors: Michinobu Tanioka, Toshinobu Ogatsu
  • Publication number: 20040084824
    Abstract: A wafer support device is provided including a fixed base, a guiding device on the fixed base, a movable base disposed movably vertically with respect to the fixed base by the cross roller guide, and a first pressing device fixed on the fixed base. The first pressing device presses the movable base. A wafer support device is also provided which a &thgr; stage rotatably disposed on the movable base with the vertical direction as a rotation axis, a linear motor fixed on the fixed base, a contact bar disposed on the movable base, a load control device controlling a load of pressing, and a controller controlling a pressing force by the pressing device based on the load detected by the load sensor.
    Type: Application
    Filed: October 29, 2003
    Publication date: May 6, 2004
    Applicant: NEC CORPORATION
    Inventor: Toshinobu Ogatsu