Abstract: An electrical connector includes contacts each having a junction to be electrically connected to another substrate and a pair of contact portions bifurcated and extending from the junction to form a bearing space therebetween, and an array plate for forming thereon a contact group by aligning a plurality of the contacts in a particular direction, and a cam shaft positioned and rotatably held within the bearing spaces of the contacts aligned with one another on the array plate to form a contact group and having a major axis portion and a minor axis portion different in size such that former is larger and the latter is smaller than the width of the bearing spaces so that the cam shaft is axially insertable into and retractable from the bearing spaces of the contacts. With this construction, the contacts can be detachably fitted in a connector so that failed contacts can be easily replaced with new contacts.

Abstract: Disclosed is an electronic circuit device in which the solder (14) connecting lead pins (6) to the ceramic substrate (2) has a melting point of 356.degree. C. to 450.degree. C. and has a tensile strength being low in such an extent that a thermal contraction stress generated in a cooling process of the solder (14) from the melting point thereof is low and the substrate (2) does not break. The solder (14) is a Au-Ge alloy containing 10-15 wt % of Ge. Electronic circuit devices, which employ the above solder (14) in the connections, are free from damages in the ceramic wiring substrate (2) due to the bonding. Further, when the electronic circuit device undergoes a series of assembly processes after the above bonding, such solder (14) does not melt, and wettability of such solder (14) is favorable.