Patents by Inventor Toshio Kimura
Toshio Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180138657Abstract: A semiconductor laser module includes a semiconductor laser that outputs laser light; an optical fiber that guides the laser light; a lens that couples the laser light, which is output from the semiconductor laser, with the optical fiber; a base that is substantially tabular in shape and that has the semiconductor laser, the optical fiber, and the lens fixed thereon either directly or indirectly; and a housing which houses the base and fixes the base either directly or indirectly. Among faces of the base, a face on a side that is fixed either directly or indirectly to the housing includes a junction plane that is joined to the housing either directly or indirectly, and a detachment plane that is detached to remain unfixed from the housing.Type: ApplicationFiled: January 11, 2018Publication date: May 17, 2018Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Masakazu MIURA, Jun MIYOKAWA, Kazuki YAMAOKA, Toshio KIMURA
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Publication number: 20180083467Abstract: A transformer less battery charger system. In one embodiment, the battery charger system includes input terminals for receiving an AC voltage, output terminals for receiving terminals of a rechargeable battery pack, and a non-isolated DC-DC converter coupled between the input terminals and the output terminals. A device is also coupled somewhere between the input terminals and the output terminals. The device is configured to selectively and indirectly couple the input terminals to the output terminals. More particularly, the device indirectly couples the input terminals to the output terminals when the rechargeable battery pack terminals are received by the output terminals, and the device indirectly decouples the input terminals from the output terminals when the rechargeable battery pack terminals are separated from the output terminals.Type: ApplicationFiled: November 30, 2017Publication date: March 22, 2018Inventors: Tetsuo Sato, Shigeru Maeta, Toshio Kimura, Atsushi Mitamura, Akira Negishi, Gary S. Jacobson
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Publication number: 20180047756Abstract: A semiconductor die is disclosed upon which is formed direct current (DC) isolated first and second circuits. The first circuit is configured for electrical connection to a first ground. The second circuit is configured for electrical connection to a second ground. The first and second grounds can be at different potentials. The first and second circuits were formed using front end of line (FEOL) and back end of line (BEOL) processes. The first circuit includes a plurality of first devices, such as transistors, which were formed during the FEOL process, and the second circuit includes only second devices, such as transistors, which were formed during the BEOL process.Type: ApplicationFiled: August 12, 2016Publication date: February 15, 2018Inventors: Kenji Yoshida, Tetsuo Sato, Shigeru Maeta, Toshio Kimura
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Patent number: 9843206Abstract: A transformer less battery charger system. In one embodiment, the battery charger system includes input terminals for receiving an AC voltage, output terminals for receiving terminals of a rechargeable battery pack, and a non-isolated DC-DC converter coupled between the input terminals and the output terminals. A device is also coupled somewhere between the input terminals and the output terminals. The device is configured to selectively and indirectly couple the input terminals to the output terminals. More particularly, the device indirectly couples the input terminals to the output terminals when the rechargeable battery pack terminals are received by the output terminals, and the device indirectly decouples the input terminals from the output terminals when the rechargeable battery pack terminals are separated from the output terminals.Type: GrantFiled: September 11, 2015Date of Patent: December 12, 2017Assignee: Renesas Electronics America Inc.Inventors: Tetsuo Sato, Shigeru Maeta, Toshio Kimura, Atsushi Mitamura, Akira Negishi, Gary S. Jacobson
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Patent number: 9746627Abstract: A semiconductor laser module includes a semiconductor laser element outputting a laser light; an optical fiber; an optical component disposed at an outer periphery of the optical fiber and fixing the optical fiber; a first-fixing agent fastening the optical component and the optical fiber; a light-absorbing element disposed at an outer periphery of the optical component and fixing the optical component; a first light-blocking portion disposed between an end into which the laser light is incident of the optical fiber and the optical component; and a housing accommodating therein the semiconductor laser element, an end into which the laser light is incident of the optical fiber and the first light-blocking portion. The optical component has an optical transmittance at a wavelength of the laser light, and the light-absorbing element has an optical absorptivity at a wavelength of the laser light.Type: GrantFiled: March 7, 2016Date of Patent: August 29, 2017Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yuta Ishige, Naoki Hayamizu, Etsuji Katayama, Toshio Kimura
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Publication number: 20170207642Abstract: An apparatus and method for use in devices such as rechargeable battery packs. The apparatus, in one embodiment, includes an integrated circuit comprising a first circuit, a second circuit, and a thin film transistor (TFT). The first circuit is configured to generate a square wave signal. The second circuit is configured to convert the square wave signal to a direct current (DC) signal. The TFT is configured to activate and conduct current in response to the DC control signal.Type: ApplicationFiled: January 13, 2017Publication date: July 20, 2017Inventors: Tetsuo Sato, Shigeru Maeta, Toshio Kimura, Kenji Yoshida
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Patent number: 9692205Abstract: A semiconductor laser module includes: a semiconductor laser element emitting a laser light; an optical fiber, into which the laser light emitted from the semiconductor laser element is incident, guiding the laser light; and an optical-fiber-holding unit having a fixing agent and holding the optical fiber, the fixing agent being for fixing the optical fiber. The fixing agent is provided at an area in which a power of a leakage light of the laser light having been incident into the optical fiber and then emitted to outside the optical fiber is low.Type: GrantFiled: November 20, 2015Date of Patent: June 27, 2017Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Tetsuya Matsuyama, Naoki Hayamizu, Toshio Kimura, Jun Miyokawa, Yuta Ishige
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Publication number: 20170139161Abstract: An optical fiber fixing structure includes: a cylindrical member; an optical fiber inserted into a hole of the cylindrical member; and a fixing material configured to fix the cylindrical member and the optical fiber, wherein the optical fiber is a polarization maintaining optical fiber having a polarization axis, and a center of the optical fiber is arranged so as to be eccentric to a center of the hole, and an angle formed by an eccentric direction connecting the center of the hole and the center of the optical fiber and the polarization axis is ?22.5° to 22.5°, or 67.5° to 112.5°.Type: ApplicationFiled: January 26, 2017Publication date: May 18, 2017Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Kazuki YAMAOKA, Jun MIYOKAWA, Masakazu MIURA, Toshio KIMURA
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Publication number: 20170077729Abstract: A transformer less battery charger system. In one embodiment, the battery charger system includes input terminals for receiving an AC voltage, output terminals for receiving terminals of a rechargeable battery pack, and a non-isolated DC-DC converter coupled between the input terminals and the output terminals. A device is also coupled somewhere between the input terminals and the output terminals. The device is configured to selectively and indirectly couple the input terminals to the output terminals. More particularly, the device indirectly couples the input terminals to the output terminals when the rechargeable battery pack terminals are received by the output terminals, and the device indirectly decouples the input terminals from the output terminals when the rechargeable battery pack terminals are separated from the output terminals.Type: ApplicationFiled: September 11, 2015Publication date: March 16, 2017Inventors: Tetsuo Sato, Shigeru Maeta, Toshio Kimura, Atsushi Mitamura, Akira Negishi, Gary S. Jacobson
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Patent number: 9466942Abstract: An optical element module includes a casing having a bottom plate, a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion, a support member mounted on the temperature-adjusting unit in the casing, and a semiconductor laser element being mounted on the support member and outputting a laser light to a forward side. The upper layer portion of the temperature-adjusting unit projects at a backward side of the semiconductor laser element relative to the lower layer portion.Type: GrantFiled: December 9, 2014Date of Patent: October 11, 2016Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Tetsuya Matsuyama, Maiko Ariga, Toshio Sugaya, Toshio Kimura
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Publication number: 20160246022Abstract: A semiconductor laser module includes a semiconductor laser element outputting a laser light; an optical fiber; an optical component disposed at an outer periphery of the optical fiber and fixing the optical fiber; a first-fixing agent fastening the optical component and the optical fiber; a light-absorbing element disposed at an outer periphery of the optical component and fixing the optical component; a first light-blocking portion disposed between an end into which the laser light is incident of the optical fiber and the optical component; and a housing accommodating therein the semiconductor laser element, an end into which the laser light is incident of the optical fiber and the first light-blocking portion. The optical component has an optical transmittance at a wavelength of the laser light, and the light-absorbing element has an optical absorptivity at a wavelength of the laser light.Type: ApplicationFiled: March 7, 2016Publication date: August 25, 2016Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Yuta ISHIGE, Naoki HAYAMIZU, Etsuji KATAYAMA, Toshio KIMURA
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Patent number: 9373932Abstract: A semiconductor laser module 1 is mainly composed of a package 3, a semiconductor laser 5, lenses 7, 9, 13, reflecting mirrors 11, an optical fiber 15, and the like. The package 3 is composed of a bottom part and side surfaces 19a, 19b. The side surfaces 19a, 19b stand erect approximately vertical to the bottom part of the package. In the semiconductor laser module 1, a plurality of semiconductor laser installation surfaces 17 are formed in a step-like shape. On each semiconductor laser installation surface 17, a semiconductor laser 5 is installed. A lens 7 is arranged at the anterior (in the emission direction) of the semiconductor laser 5. Moreover, a lens 9 is arranged further to the anterior. A reflecting mirror 11 is fixed to the side surface 19a, which is provided facing the emission direction of the semiconductor laser 5.Type: GrantFiled: November 7, 2014Date of Patent: June 21, 2016Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Naoki Hayamizu, Yuta Ishige, Toshio Kimura
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Patent number: 9333627Abstract: Provided is a grindstone tool capable of grinding with high precision and a method for manufacturing same, the grindstone tool having improved chip discharge characteristics to thereby prevent chips clogging of the chip pocket. The grinding tool comprises: dimples (14) formed in the external peripheral surface (13a) of a base metal (11) so that the quantity present in any position in the width direction of the external peripheral surface (13a) is the same in the peripheral direction; a grinding surface (21) formed by affixing a plurality of abrasive grains (22) to the external peripheral surface (13a) using a plating layer (23); and recess parts (24) into which chips produced by the grinding of the abrasive grains (22) are discharged, the recess parts being formed by portions that correspond to the dimples (14) in the grinding surface (21) being recessed.Type: GrantFiled: February 24, 2012Date of Patent: May 10, 2016Assignee: MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.Inventors: Hideaki Arisawa, Toshio Kimura
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Publication number: 20160079728Abstract: A semiconductor laser module includes: a semiconductor laser element emitting a laser light; an optical fiber, into which the laser light emitted from the semiconductor laser element is incident, guiding the laser light; and an optical-fiber-holding unit having a fixing agent and holding the optical fiber, the fixing agent being for fixing the optical fiber. The fixing agent is provided at an area in which a power of a leakage light of the laser light having been incident into the optical fiber and then emitted to outside the optical fiber is low.Type: ApplicationFiled: November 20, 2015Publication date: March 17, 2016Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Tetsuya MATSUYAMA, Naoki Hayamizu, Toshio Kimura, Jun Miyokawa, Yuta Ishige
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Patent number: 9075719Abstract: A storage system is migrated without stopping service provision by a host computer. By this means, in a migration-source storage system, data of the cache memory is destaged, and, next, data received from the host computer is directly written in a logical unit by bypassing the cache memory. On the other hand, in a migration-destination storage system, communication with the migration-source storage system is performed to set setting information of a logical unit of the migration object into a logical unit management table and set a writing mode for the cache memory to a cache-bypass mode. After that, the migration-source storage system blocks a path to the host computer. The migration-destination storage system receives a report of the path block from the migration-source storage system and then opens a path between the own system and the host computer.Type: GrantFiled: February 10, 2012Date of Patent: July 7, 2015Assignee: Hitachi, Ltd.Inventors: Mika Teranishi, Hiroji Shibuya, Shunji Murayama, Toshio Kimura, Kazushige Nagamatsu
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Publication number: 20150131692Abstract: A semiconductor laser module 1 is mainly composed of a package 3, a semiconductor laser 5, lenses 7, 9, 13, reflecting mirrors 11, an optical fiber 15, and the like. The package 3 is composed of a bottom part and side surfaces 19a, 19b. The side surfaces 19a, 19b stand erect approximately vertical to the bottom part of the package. In the semiconductor laser module 1, a plurality of semiconductor laser installation surfaces 17 are formed in a step-like shape. On each semiconductor laser installation surface 17, a semiconductor laser 5 is installed. A lens 7 is arranged at the anterior (in the emission direction) of the semiconductor laser 5. Moreover, a lens 9 is arranged further to the anterior. A reflecting mirror 11 is fixed to the side surface 19a, which is provided facing the emission direction of the semiconductor laser 5.Type: ApplicationFiled: November 7, 2014Publication date: May 14, 2015Inventors: Naoki HAYAMIZU, Yuta ISHIGE, Toshio KIMURA
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Publication number: 20150098480Abstract: An optical element module includes a casing having a bottom plate, a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion, a support member mounted on the temperature-adjusting unit in the casing, and a semiconductor laser element being mounted on the support member and outputting a laser light to a forward side. The upper layer portion of the temperature-adjusting unit projects at a backward side of the semiconductor laser element relative to the lower layer portion.Type: ApplicationFiled: December 9, 2014Publication date: April 9, 2015Applicant: FURUKAWA ELECTRIC CO., LTDInventors: Tetsuya MATSUYAMA, Maiko Ariga, Toshio Sugaya, Toshio Kimura
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Patent number: 8874965Abstract: The present invention enables program codes to be shared among processors 211. To prevent the debug operation of one processor 211 from affecting the debug operation of the other processors 211, when detecting a breakpoint during execution of a program code, a debugger 410 or a debugger stub 520 controls the execution of the program code while exchanging breakpoint information 800 with the other debuggers 410 or the other debugger stubs 520. Furthermore, a circuit 170 is created which prevents the program code being carelessly rewritten due to thermal runaway, a bug, and the like of a processor 211, and the protection setting by the protection logic 71 in the circuit 170 is released only in case the processor 211 accesses each of a plurality of registers from 65 to 67 in specified order.Type: GrantFiled: October 26, 2011Date of Patent: October 28, 2014Assignee: Hitachi, Ltd.Inventors: Toshio Kimura, Jun Kitahara, Hiroji Shibuya, Kazushige Nagamatsu, Nakaba Sato, Mika Teranishi
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Publication number: 20140220872Abstract: Provided is a grindstone tool capable of grinding with high precision and a method for manufacturing same, the grindstone tool having improved chip discharge characteristics to thereby prevent chips clogging of the chip pocket. The grinding tool comprises: dimples (14) formed in the external peripheral surface (13a) of a base metal (11) so that the quantity present in any position in the width direction of the external peripheral surface (13a) is the same in the peripheral direction; a grinding surface (21) formed by affixing a plurality of abrasive grains (22) to the external peripheral surface (13a) using a plating layer (23); and recess parts (24) into which chips produced by the grinding of the abrasive grains (22) are discharged, the recess parts being formed by portions that correspond to the dimples (14) in the grinding surface (21) being recessed.Type: ApplicationFiled: February 24, 2012Publication date: August 7, 2014Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Hideaki Arisawa, Toshio Kimura
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Publication number: 20140156815Abstract: The object of the invention is to enable automatic recognition of a content of change of configuration at a host side when physical configuration change such as the expansion or reduction of a storage subsystem occurs. Coupling information with respect to the storage subsystems is provided to the host side, and when physical configuration change occurs, a notice that change of configuration has been executed and the content of change of configuration is notified from the storage subsystem side to the host side, based on which the coupling information is updated automatically. According to this method, the host can constantly recognize the current adequate logical configuration of one or more storage subsystems that the host accesses.Type: ApplicationFiled: December 3, 2012Publication date: June 5, 2014Applicant: Hitachi, Ltd.Inventors: Jun Kitahara, Takamitsu Morioka, Isao Shimonishi, Toshio Kimura, Hiroji Shibuya