Abstract: A blow molding apparatus includes a machine bed, an upper base disposed at intervals in a vertical direction from the machine bed, a transport plate configured to rotate at a height position of the upper base to convey the preform between an injection molding part and a blow molding part, and an elevation mechanism configured to move the transport plate or the upper base up and down in the vertical direction with respect to a mold disposed on the machine bed. A support pillar includes a height adjusting part configured to adjust a stroke of the transport plate or the upper base in the vertical direction with respect to the machine bed.

Abstract: A blow molding machine includes a support member that supports a mold component and a moving mechanism that moves the support member to a projecting position toward the outside of the machine and to a storing position. The machine includes a first fixed fulcrum shaft. The support member includes a base end portion rotatably supported by the first fixed fulcrum shaft and a free end portion having a first movable fulcrum shaft. The moving mechanism has rotatably interconnected links. One link is rotatably supported by the movable fulcrum shaft. In the projecting position, the links are maintained linearly by a first angle fixing tool to serve as a leg portion that supports the support member's free end portion.

Abstract: Disclosed is a semiconductor device including a semiconductor layer having a main surface, a first conductivity type drift region formed at a surface layer part of the main surface, a super junction region having a first conductivity type first column region and a second conductivity type second column region, a second conductivity type low resistance region formed at the surface layer part of the drift region and having an impurity concentration in excess of that of the second column region, a region insulating layer formed on the main surface and covering the low resistance region such as to cause part of the low resistance region to be exposed, a first pad electrode formed on the region insulating layer such as to overlap with the low resistance region, and a second pad electrode formed on the main surface and electrically connected to the second column region and the low resistance region.

Abstract: A blow molding apparatus includes: a temperature adjusting unit configured to supply a preform with cooling air to perform a temperature adjustment of the preform, the preform having been inj ection-molded, having a bottomed shape and made of a resin; a blow molding unit configured to blow-mold the preform that has been subjected to a temperature adjustment with blow air, and configured to manufacture a container made of a resin; an air tank configured to supply the temperature adjusting unit with the cooling air; and a recovery unit configured to recover the blow air exhausted from the blow molding unit into the air tank.

Abstract: A blow molding machine includes a support member that supports a mold component and a moving mechanism that moves the support member to a projecting position toward the outside of the machine and to a storing position. The machine includes a first fixed fulcrum shaft. The support member includes a base end portion rotatably supported by the first fixed fulcrum shaft and a free end portion having a first movable fulcrum shaft. The moving mechanism has rotatably interconnected links. One link is rotatably supported by the movable fulcrum shaft. In the projecting position, the links are maintained linearly by a first angle fixing tool to serve as a leg portion that supports the support member's free end portion.

Abstract: A blow molding apparatus includes a machine bed, an upper base disposed at intervals in a vertical direction from the machine bed, a transport plate configured to rotate at a height position of the upper base to convey the preform between an injection molding part and a blow molding part, and an elevation mechanism configured to move the transport plate or the upper base up and down in the vertical direction with respect to a mold disposed on the machine bed. A support pillar includes a height adjusting part configured to adjust a stroke of the transport plate or the upper base in the vertical direction with respect to the machine bed.

Abstract: A blow molding machine includes a support member and a moving mechanism that moves the support member to a projecting position a storing position. The blow molding machine includes a first fixed fulcrum shaft, and the support member includes a base end portion rotatably supported by the first fixed fulcrum shaft and a free end portion provided with a first movable fulcrum shaft. The moving mechanism includes a plurality of links connected rotatably to each other, one of the plurality of links being rotatably supported by the movable fulcrum shaft of the support member, and, when the support member is set at the projecting position, the plurality of links are maintained linearly by a first angle fixing tool, thereby enabling the plurality of links to serve as a leg portion that supports the free end portion of the support member.

Abstract: Disclosed is a semiconductor device including a semiconductor layer having a main surface, a first conductivity type drift region formed at a surface layer part of the main surface, a super junction region having a first conductivity type first column region and a second conductivity type second column region, a second conductivity type low resistance region formed at the surface layer part of the drift region and having an impurity concentration in excess of that of the second column region, a region insulating layer formed on the main surface and covering the low resistance region such as to cause part of the low resistance region to be exposed, a first pad electrode formed on the region insulating layer such as to overlap with the low resistance region, and a second pad electrode formed on the main surface and electrically connected to the second column region and the low resistance region.

Abstract: A blow molding machine includes a support member that supports a mold component and a moving mechanism that moves the support member to a projecting position toward the outside of the machine and to a storing position. The machine includes a first fixed fulcrum shaft. The support member includes a base end portion rotatably supported by the first fixed fulcrum shaft and a free end portion having a first movable fulcrum shaft. The moving mechanism has rotatably interconnected links. One link is rotatably supported by the movable fulcrum shaft. In the projecting position, the links are maintained linearly by a first angle fixing tool to serve as a leg portion that supports the support member's free end portion.

Abstract: A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.

Abstract: A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.

Abstract: A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.

Abstract: A semiconductor device includes: a first base layer; a drain layer disposed on the back side surface of the first base layer; a second base layer formed on the surface of the first base layer; a source layer formed on the surface of the second base layer; a gate insulating film disposed on the surface of both the source layer and the second base layer; a gate electrode disposed on the gate insulating film; a column layer formed in the first base layer of the lower part of both the second base layer and the source layer by opposing the drain layer; a drain electrode disposed in the drain layer; and a source electrode disposed on both the source layer and the second base layer, wherein heavy particle irradiation is performed to the column layer to form a trap level locally.

Abstract: A semiconductor device includes: a first base layer; a drain layer disposed on the back side surface of the first base layer; a second base layer formed on the surface of the first base layer; a source layer formed on the surface of the second base layer; a gate insulating film disposed on the surface of both the source layer and the second base layer; a gate electrode disposed on the gate insulating film; a column layer formed in the first base layer of the lower part of both the second base layer and the source layer by opposing the drain layer; a drain electrode disposed in the drain layer; and a source electrode disposed on both the source layer and the second base layer, wherein heavy particle irradiation is performed to the column layer to form a trap level locally.

Abstract: A semiconductor device includes: a first base layer; a drain layer disposed on the back side surface of the first base layer; a second base layer formed on the surface of the first base layer; a source layer formed on the surface of the second base layer; a gate insulating film disposed on the surface of both the source layer and the second base layer; a gate electrode disposed on the gate insulating film; a column layer formed in the first base layer of the lower part of both the second base layer and the source layer by opposing the drain layer; a drain electrode disposed in the drain layer; and a source electrode disposed on both the source layer and the second base layer, wherein heavy particle irradiation is performed to the column layer to form a trap level locally.

Abstract: A semiconductor device includes: a first base layer; a drain layer disposed on the back side surface of the first base layer; a second base layer formed on the surface of the first base layer; a source layer formed on the surface of the second base layer; a gate insulating film disposed on the surface of both the source layer and the second base layer; a gate electrode disposed on the gate insulating film; a column layer formed in the first base layer of the lower part of both the second base layer and the source layer by opposing the drain layer; a drain electrode disposed in the drain layer; and a source electrode disposed on both the source layer and the second base layer, wherein heavy particle irradiation is performed to the column layer to form a trap level locally.

Abstract: A blow molding machine includes a support member and a moving mechanism that moves the support member to a projecting position a storing position. The blow molding machine includes a first fixed fulcrum shaft, and the support member includes a base end portion rotatably supported by the first fixed fulcrum shaft and a free end portion provided with a first movable fulcrum shaft. The moving mechanism includes a plurality of links connected rotatably to each other, one of the plurality of links being rotatably supported by the movable fulcrum shaft of the support member, and, when the support member is set at the projecting position, the plurality of links are maintained linearly by a first angle fixing tool, thereby enabling the plurality of links to serve as a leg portion that supports the free end portion of the support member.

Abstract: A blow molding machine includes a support member and a moving mechanism that moves the support member to a projecting position a storing position. The blow molding machine includes a first fixed fulcrum shaft, and the support member includes a base end portion rotatably supported by the first fixed fulcrum shaft and a free end portion provided with a first movable fulcrum shaft. The moving mechanism includes a plurality of links connected rotatably to each other, one of the plurality of links being rotatably supported by the movable fulcrum shaft of the support member, and, when the support member is set at the projecting position, the plurality of links are maintained linearly by a first angle fixing tool, thereby enabling the plurality of links to serve as a leg portion that supports the free end portion of the support member.

Abstract: A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.

Abstract: A data transfer device performing data transfer at a high speed if a descriptor chain cannot be entirely transferred by a single activation. In a DMA control device, when a transfer activation signal is asserted, a descriptor information control part sequentially reads descriptor information from a descriptor information storage part. When the count of pieces of descriptor information that have been read becomes equal to a transferable frame count, a backward skip control part outputs a backward skip instruction. When the backward skip instruction is outputted, a descriptor information control part skips reading remaining descriptor information.